JPH0217846U - - Google Patents
Info
- Publication number
- JPH0217846U JPH0217846U JP9521388U JP9521388U JPH0217846U JP H0217846 U JPH0217846 U JP H0217846U JP 9521388 U JP9521388 U JP 9521388U JP 9521388 U JP9521388 U JP 9521388U JP H0217846 U JPH0217846 U JP H0217846U
- Authority
- JP
- Japan
- Prior art keywords
- wall
- protective cover
- utility
- model registration
- components according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、本考案による保護カバー及びその取
付方法を示す斜視図である。第２図は、保護カバ
ーの上面図である。第３図は、保護カバーの側面
図である。第４図は、保護カバーの取付状態を示
す上面図である。第５図は、同じく側面図である
。第６図は、同じく下面図である。
１……保護カバー、２……ＩＣ、３……第１壁
部、４……第２壁部、５，６……屈曲部、７……
ヒンジ部、８……爪、９……湾曲部、１０……爪
、１１……スロツト、１２，１３……フランジ部
、１４，１５……凹み、１６，１７……突条、２
０……基板、２１……下端、２２……リード線。
FIG. 1 is a perspective view showing a protective cover and its attachment method according to the present invention. FIG. 2 is a top view of the protective cover. FIG. 3 is a side view of the protective cover. FIG. 4 is a top view showing the state in which the protective cover is attached. FIG. 5 is a side view as well. FIG. 6 is a bottom view as well. DESCRIPTION OF SYMBOLS 1... Protective cover, 2... IC, 3... First wall part, 4... Second wall part, 5, 6... Bent part, 7...
Hinge part, 8...Claw, 9...Curved part, 10...Claw, 11...Slot, 12, 13...Flange part, 14, 15...Concave, 16, 17...Protrusion, 2
0... Board, 21... Lower end, 22... Lead wire.
Claims (1)
、合成樹脂材料からなる壁体と、前記壁体の両端
を拡開・閉鎖するヒンジ手段と、前記壁体をもつ
て前記電子部品を囲繞するべく前記両端を係合さ
せる係合手段とを備えることを特徴とする電子部
品の保護カバー。 (2) 前記壁体の下端に内向きのフランジ部が形
成されていることを特徴とする実用新案登録請求
の範囲第１項に記載の電子部品の保護カバー。 (3) 前記壁体の内壁面上に突部が形成されてい
ることを特徴とする実用新案登録請求の範囲第１
項または第２項に記載の電子部品の保護カバー。[Claims for Utility Model Registration] (1) A protective cover attached to an electronic component, which comprises a wall made of a synthetic resin material, hinge means for expanding and closing both ends of the wall, and the wall. and engaging means for engaging the both ends to surround the electronic component. (2) The protective cover for electronic components according to claim 1, wherein an inward flange portion is formed at the lower end of the wall body. (3) Utility model registration claim 1, characterized in that a protrusion is formed on the inner wall surface of the wall body.
A protective cover for electronic components according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9521388U JPH0356056Y2 (en) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9521388U JPH0356056Y2 (en) | 1988-07-19 | 1988-07-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217846U true JPH0217846U (en) | 1990-02-06 |
| JPH0356056Y2 JPH0356056Y2 (en) | 1991-12-16 |
Family
ID=31319841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9521388U Expired JPH0356056Y2 (en) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356056Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Package of semiconductor device |
-
1988
- 1988-07-19 JP JP9521388U patent/JPH0356056Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09121008A (en) * | 1995-10-25 | 1997-05-06 | Nec Corp | Package of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356056Y2 (en) | 1991-12-16 |
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