JPH0217843U - - Google Patents
Info
- Publication number
- JPH0217843U JPH0217843U JP9559288U JP9559288U JPH0217843U JP H0217843 U JPH0217843 U JP H0217843U JP 9559288 U JP9559288 U JP 9559288U JP 9559288 U JP9559288 U JP 9559288U JP H0217843 U JPH0217843 U JP H0217843U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bump
- lead frame
- package
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9559288U JPH0217843U (sl) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9559288U JPH0217843U (sl) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217843U true JPH0217843U (sl) | 1990-02-06 |
Family
ID=31320275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9559288U Pending JPH0217843U (sl) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217843U (sl) |
-
1988
- 1988-07-19 JP JP9559288U patent/JPH0217843U/ja active Pending