JPH0217841U - - Google Patents

Info

Publication number
JPH0217841U
JPH0217841U JP1988097071U JP9707188U JPH0217841U JP H0217841 U JPH0217841 U JP H0217841U JP 1988097071 U JP1988097071 U JP 1988097071U JP 9707188 U JP9707188 U JP 9707188U JP H0217841 U JPH0217841 U JP H0217841U
Authority
JP
Japan
Prior art keywords
guiding part
wire guiding
capillary
wire
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988097071U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988097071U priority Critical patent/JPH0217841U/ja
Publication of JPH0217841U publication Critical patent/JPH0217841U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例１を示す斜視図、第２
図は本考案の実施例２を示す斜視図、第３図は従
来のキヤピラリを示す斜視図、第４図は従来のキ
ヤピラリを使用したウエツジボンデイングの斜視
図である。 １……細穴、２……保持部、３……ワイヤ誘導
部、４……フツ素樹脂製熱収縮チユーブ、５……
固定用樹脂、６……ウエツジ、７……ペレツト、
８……電極、９……ワイヤ。 Fig. 1 is a perspective view showing the first embodiment of the present invention; Fig. 2 is a perspective view showing the first embodiment of the present invention;
The figure is a perspective view showing a second embodiment of the present invention, FIG. 3 is a perspective view showing a conventional capillary, and FIG. 4 is a perspective view of wedge bonding using a conventional capillary. 1...Small hole, 2...Holding part, 3...Wire guiding part, 4...Fluorine resin heat shrink tube, 5...
Fixing resin, 6... wedge, 7... pellet,
8... Electrode, 9... Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 肉厚の厚い円柱形の保持部と、細く円錐形にし
ぼられたワイヤ誘導部とからなり、軸心にボンデ
イングワイヤを通す細穴を有するガラス製キヤピ
ラリにおいて、前記ワイヤ誘導部を保護強化用チ
ユーブで被覆したことを特徴とするウエツジボン
ダー用キヤピラリ。 In a glass capillary consisting of a thick-walled cylindrical holding part and a wire guiding part narrowed into a thin conical shape, and having a thin hole in the axis for passing the bonding wire, a tube for protecting and reinforcing the wire guiding part is used. A capillary for a wedge bonder characterized by being coated with.
JP1988097071U 1988-07-22 1988-07-22 Pending JPH0217841U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988097071U JPH0217841U (en) 1988-07-22 1988-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988097071U JPH0217841U (en) 1988-07-22 1988-07-22

Publications (1)

Publication Number Publication Date
JPH0217841U true JPH0217841U (en) 1990-02-06

Family

ID=31322285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988097071U Pending JPH0217841U (en) 1988-07-22 1988-07-22

Country Status (1)

Country Link
JP (1) JPH0217841U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04166740A (en) * 1990-10-30 1992-06-12 Remitsuku Maruhachi:Kk Cap member and its pushing tool for molding form for body under test used in compression test of concrete

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04166740A (en) * 1990-10-30 1992-06-12 Remitsuku Maruhachi:Kk Cap member and its pushing tool for molding form for body under test used in compression test of concrete

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