JPH02177499A - Electronic apparatus housing - Google Patents
Electronic apparatus housingInfo
- Publication number
- JPH02177499A JPH02177499A JP32941088A JP32941088A JPH02177499A JP H02177499 A JPH02177499 A JP H02177499A JP 32941088 A JP32941088 A JP 32941088A JP 32941088 A JP32941088 A JP 32941088A JP H02177499 A JPH02177499 A JP H02177499A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- plate
- protrusion plate
- printed circuit
- partition plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims abstract description 14
- 238000010586 diagram Methods 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、マイクロ波帯において用いられる局部発振器
に関し、特に他の電子部品からの電磁力の漏れによって
生じるスプリアスノイズのD/U(DU比)を改善し、
電磁シールドを向上させた電子機器筐体に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a local oscillator used in the microwave band, and particularly to D/U (DU ratio) of spurious noise caused by leakage of electromagnetic force from other electronic components. ) to improve
This invention relates to an electronic device housing with improved electromagnetic shielding.
[従来の技術]
従来、この種の電子機器筐体は、第3図に示すようにな
っていた。すなわち、筐体本体11の内部に電子部品1
4を搭載したプリント基板13をねじ締め固定し、その
上面から内部に仕切板12aを有する蓋12を被せ、筐
体を構成していた。[Prior Art] Conventionally, this type of electronic device housing has been designed as shown in FIG. That is, the electronic component 1 is placed inside the housing body 11.
A printed circuit board 13 on which 4 was mounted was fixed with screws, and a lid 12 having a partition plate 12a inside was placed over the top surface of the printed circuit board 13 to form a housing.
[解決すべき課題]
−L述した従来の電子機器筐体は、筐体本体内部に実装
したプリント基板を、蓋の内部に突設した仕切板で押圧
することによって、搭載された電子部品の電磁シールド
を図っていた。[Problems to be Solved] - The conventional electronic device housing mentioned above allows the electronic components mounted in the housing to be removed by pressing the printed circuit board mounted inside the housing body with a partition plate protruding inside the lid. I was trying to create an electromagnetic shield.
しかし、従来の電子機器筐体は、筐体本体と蓋との間に
プリント基板が介在し1両者は接触していなかった。そ
のため、両者の間に11−、ある誘電率をもった物質と
同等の空間が存在することとなり、一方の電子部品の周
波数の信号が他方の電子部品の側に漏れ、他方の電子部
品に慈影響を午えるという問題があった。However, in conventional electronic device casings, a printed circuit board is interposed between the casing body and the lid, and the two are not in contact with each other. Therefore, a space equivalent to a material with a certain dielectric constant exists between the two, and the frequency signal of one electronic component leaks to the other electronic component, causing the other electronic component to receive a There was a problem with the impact.
これを解消する手段として1プリント基板を二枚用い両
者を完全に分離して使用することも考えられる。しかし
、この場合、プリント基板を二枚に分離しなければなら
ないため、プリント基板の有効利用面積が小さくなると
ともに1両者の信号の受は渡しや、電源の受は渡しをケ
ーブル等で行なわなければならないという問題がある。As a means to solve this problem, it is conceivable to use two printed circuit boards and completely separate them. However, in this case, the printed circuit board has to be separated into two parts, which reduces the effective area of the printed circuit board, and also requires a cable, etc. to be used to receive signals from both sides, and to receive power from both sides. The problem is that it doesn't.
本発明は上述した問題点にかんがみてなされたもので、
電子部品を搭載するプリント基板に孔を設けることによ
って電子回路を仕切板によって完全に分離し、電磁シー
ルドを向上させるようにした電子機器筐体の提供を目的
とする。The present invention has been made in view of the above-mentioned problems.
The purpose of the present invention is to provide an electronic device housing in which electronic circuits are completely separated by a partition plate by providing holes in a printed circuit board on which electronic components are mounted, thereby improving electromagnetic shielding.
[課題の解決手段]
上記目的を達成するために本発明の電子機器筐体は、−
面が開口しその内部に突起板を有する筐体本体と、この
筐体本体の開口部に取り付けられ前記突起板と対向する
位置に仕切板を有する着と、前記筐体本体の内部に取り
付けられ前記突起板に嵌合可能な孔を有するプリント基
板からなる構成としである。[Means for Solving the Problems] In order to achieve the above object, the electronic device casing of the present invention has the following features:
A casing body having an open surface and a protrusion plate therein; a casing body attached to the opening of the casing body and having a partition plate at a position facing the protrusion plate; The structure includes a printed circuit board having a hole that can be fitted into the protrusion plate.
[実施例]
以下、本発明の一実施例について、図面を参照して説明
する。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例を示す電子a″JAJA筐体
図、第2図は本実施例の内部に固定するプリン)X板の
平面図である。FIG. 1 is a diagram of an electronic a''JAJA housing showing an embodiment of the present invention, and FIG. 2 is a plan view of a pudding board fixed inside this embodiment.
なお1本実施例では電圧制御発振器(VCO)と、その
周波数を制御するためのPLL回路を複数もった局部発
振器をもとに説明する。Note that this embodiment will be explained based on a local oscillator having a voltage controlled oscillator (VCO) and a plurality of PLL circuits for controlling its frequency.
図面において、1は電子機器筐体本体(以下、筐体本体
と称す、)であり、上面部が開口している。そして、こ
の筐体本体1の内部中央の長手方向に突起板1aが設け
である。In the drawings, reference numeral 1 denotes an electronic device casing body (hereinafter referred to as casing body), which has an open top surface. A protrusion plate 1a is provided in the longitudinal direction of the interior center of the casing body 1.
一方、2は蓋である。この蓋の内部には、(1体本体l
に突設した突起板1aと対向する位置に仕切板2aが設
けてあり、筐体を組み立てたとき内部で当接する構造に
なっている。On the other hand, 2 is a lid. Inside this lid, there is one main body l.
A partition plate 2a is provided at a position facing the protrusion plate 1a protruding from the partition plate 2a, and has a structure in which the partition plate 2a abuts inside when the housing is assembled.
3はプリント基板であり、このプリント基板3の中央の
長手方向には筐体本体lの突起板1aに嵌入できる径の
長孔3aが設けである。そして。Reference numeral 3 denotes a printed circuit board, and the printed circuit board 3 is provided with an elongated hole 3a having a diameter that can be fitted into the protruding plate 1a of the housing body l in the longitudinal direction of the center of the printed circuit board 3. and.
このプリント基板3の表面には、筐体を組み立てること
によって突起板1aと仕切板2aにより分けられた電子
部品間の信号の受は渡しや電源の受は渡しができるよう
に、信号ライン3bが前記長孔3a以外の部分を通って
プリントしである。A signal line 3b is formed on the surface of the printed circuit board 3 so that signals can be received and passed between the electronic components separated by the protrusion plate 1a and the partition plate 2a and power supply can be transferred by assembling the casing. Printing is performed through a portion other than the elongated hole 3a.
したがって、このような構成からなる電子機器筐体によ
れば、まず、筐体本体1の内部に電子部品4を搭載した
プリント基板3を位置させ、突起板1aに長孔3aを嵌
入し、ねじ締め固定する。Therefore, according to the electronic device housing having such a configuration, first, the printed circuit board 3 on which the electronic component 4 is mounted is positioned inside the housing body 1, the elongated hole 3a is inserted into the protruding plate 1a, and the screw is inserted. Tighten and secure.
そして筐体本体1の上面からM2を被せ電子機器筐体を
組み立てる。Then, M2 is covered from the top surface of the casing body 1 to assemble the electronic device casing.
なお1本実施例では電圧制御発振器(VCO)等の電子
部品を二個搭載した例を示したが、電子部品が三個以上
であっても、プリント基板に所要の形状、数の孔を設け
、かつ仕切板と突起板を所要の箇所に設けることによっ
て同様の機能を有することができる。1. Although this example shows an example in which two electronic components such as a voltage controlled oscillator (VCO) are mounted, even if there are three or more electronic components, holes of the required shape and number can be provided on the printed circuit board. , and by providing the partition plate and the protruding plate at required locations, the same function can be achieved.
[発明の効果]
以上説明したように本発明は、電子部品を搭載するプリ
ント基板に孔を設けることによって仕切板と突起板が直
接当接するので、筐体内部の電磁シールドをより向上さ
せる効果がある。[Effects of the Invention] As explained above, the present invention has the effect of further improving the electromagnetic shielding inside the casing because the partition plate and the protruding plate come into direct contact by providing holes in the printed circuit board on which electronic components are mounted. be.
第1図は本発明の一実施例を示す電子a本筐体の断面図
、第2図は本実施例の内部に固定するプリント基板の平
面図、第3図は従来の電子機器筐体の断面図である。Fig. 1 is a cross-sectional view of an electronic device casing showing an embodiment of the present invention, Fig. 2 is a plan view of a printed circuit board fixed inside this embodiment, and Fig. 3 is a diagram of a conventional electronic device casing. FIG.
Claims (1)
の筺体本体の開口部に取り付けられ前記突起板と対向す
る位置に仕切板を有する蓋と、前記筐体本体の内部に取
り付けられ前記突起板に嵌合可能な孔を有するプリント
基板からなることを特徴とする電子機器筐体。a casing body that is open on one side and has a protrusion plate therein; a lid attached to the opening of the casing body and having a partition plate at a position facing the protrusion plate; An electronic device casing comprising a printed circuit board having a hole that can be fitted into a protrusion plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32941088A JPH02177499A (en) | 1988-12-28 | 1988-12-28 | Electronic apparatus housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32941088A JPH02177499A (en) | 1988-12-28 | 1988-12-28 | Electronic apparatus housing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02177499A true JPH02177499A (en) | 1990-07-10 |
Family
ID=18221103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32941088A Pending JPH02177499A (en) | 1988-12-28 | 1988-12-28 | Electronic apparatus housing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02177499A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231395A (en) * | 1984-04-27 | 1985-11-16 | 松下電器産業株式会社 | Electronic circuit device |
JPS6127288B2 (en) * | 1981-06-20 | 1986-06-25 | Daido Kogyo Kk | |
JPS625698A (en) * | 1985-07-02 | 1987-01-12 | 松下電器産業株式会社 | Earth soldering construction of high frequency unit |
JPS6257449B2 (en) * | 1984-09-05 | 1987-12-01 | Jiro Hotsuta |
-
1988
- 1988-12-28 JP JP32941088A patent/JPH02177499A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6127288B2 (en) * | 1981-06-20 | 1986-06-25 | Daido Kogyo Kk | |
JPS60231395A (en) * | 1984-04-27 | 1985-11-16 | 松下電器産業株式会社 | Electronic circuit device |
JPS6257449B2 (en) * | 1984-09-05 | 1987-12-01 | Jiro Hotsuta | |
JPS625698A (en) * | 1985-07-02 | 1987-01-12 | 松下電器産業株式会社 | Earth soldering construction of high frequency unit |
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