JPH0216763U - - Google Patents
Info
- Publication number
- JPH0216763U JPH0216763U JP9609288U JP9609288U JPH0216763U JP H0216763 U JPH0216763 U JP H0216763U JP 9609288 U JP9609288 U JP 9609288U JP 9609288 U JP9609288 U JP 9609288U JP H0216763 U JPH0216763 U JP H0216763U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- embossments
- chip
- taping band
- taping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9609288U JPH0216763U (fi) | 1988-07-20 | 1988-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9609288U JPH0216763U (fi) | 1988-07-20 | 1988-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216763U true JPH0216763U (fi) | 1990-02-02 |
Family
ID=31320899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9609288U Pending JPH0216763U (fi) | 1988-07-20 | 1988-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216763U (fi) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59217399A (ja) * | 1983-05-26 | 1984-12-07 | 株式会社東芝 | 半導体部品のテ−ピング用テ−プ |
-
1988
- 1988-07-20 JP JP9609288U patent/JPH0216763U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59217399A (ja) * | 1983-05-26 | 1984-12-07 | 株式会社東芝 | 半導体部品のテ−ピング用テ−プ |
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