JPH0216541U - - Google Patents
Info
- Publication number
- JPH0216541U JPH0216541U JP9444688U JP9444688U JPH0216541U JP H0216541 U JPH0216541 U JP H0216541U JP 9444688 U JP9444688 U JP 9444688U JP 9444688 U JP9444688 U JP 9444688U JP H0216541 U JPH0216541 U JP H0216541U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- sealing resin
- melting point
- low melting
- remove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Fuses (AREA)
Description
第1図は本考案の一実施例を示す断面図、第2
図Aは本考案の別実施例の主要部を示す断面図、
第2図Bは第2図Aにおけるb―b断面図、第3
図は本考案の別実施例の断面図である。
1,20……絶縁被覆リード線、10,30…
…絶縁被覆層、11,31……リード線、2,2
2……低融点可溶合金体、4,24……絶縁包囲
体、5,25……封止樹脂、l……封止樹脂に接
する露出リード線部分。
Fig. 1 is a sectional view showing one embodiment of the present invention;
Figure A is a sectional view showing the main parts of another embodiment of the present invention;
Figure 2B is a cross-sectional view taken along line bb in Figure 2A;
The figure is a sectional view of another embodiment of the present invention. 1, 20... Insulated lead wire, 10, 30...
...Insulating coating layer, 11,31...Lead wire, 2,2
2...Low melting point fusible alloy body, 4, 24...Insulating enclosure, 5, 25...Sealing resin, l...Exposed lead wire portion in contact with sealing resin.
Claims (1)
し、該低融点可溶合金体上を絶縁性包囲体で囲繞
し、絶縁性包囲体端とリード線端との間を封止樹
脂で封止せる温度ヒユーズにおいて、絶縁被覆リ
ード線端部から絶縁被覆を除去してリード線を露
出させ、長さがリード線径に対して1〜10倍の
露出リード線部分並びに絶縁被覆層端を上記封止
樹脂に接触させたことを特徴とする温度ヒユーズ
。 A low melting point fusible alloy body is joined between the insulated lead wires, the low melting point fusible alloy body is surrounded by an insulating envelope, and a sealing resin is placed between the end of the insulating envelope and the end of the lead wire. In the temperature fuse to be sealed, remove the insulation coating from the end of the insulation-covered lead wire to expose the lead wire, and remove the exposed lead wire portion whose length is 1 to 10 times the lead wire diameter and the end of the insulation coating layer. A temperature fuse characterized by being brought into contact with the above-mentioned sealing resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9444688U JPH073557Y2 (en) | 1988-07-15 | 1988-07-15 | Thermal fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9444688U JPH073557Y2 (en) | 1988-07-15 | 1988-07-15 | Thermal fuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0216541U true JPH0216541U (en) | 1990-02-02 |
JPH073557Y2 JPH073557Y2 (en) | 1995-01-30 |
Family
ID=31318969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9444688U Expired - Lifetime JPH073557Y2 (en) | 1988-07-15 | 1988-07-15 | Thermal fuse |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH073557Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04249822A (en) * | 1990-12-29 | 1992-09-04 | Uchihashi Estec Co Ltd | Alloy type thermal fuse |
-
1988
- 1988-07-15 JP JP9444688U patent/JPH073557Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04249822A (en) * | 1990-12-29 | 1992-09-04 | Uchihashi Estec Co Ltd | Alloy type thermal fuse |
Also Published As
Publication number | Publication date |
---|---|
JPH073557Y2 (en) | 1995-01-30 |
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