JPH02162870A - Picture input/output device - Google Patents

Abstract

PURPOSE:To make the title device compact and to reduce costs by reading an original picture on a photoelectric converting element array side in an edge surface read system, directly controlling a heat generating resistor, and recording the picture on a recording paper in the edge surface recording system. CONSTITUTION:A light guide path 15 to guide incident light hupsilon from a light source to an original 11 is formed between respective photoelectric converting elements 13 in a photoelectric converting element array 14, the light reflected on the original surface 11 is received by the respective photoelectric converting elements 13 in the edge surface read system, picture information is converted into an electric signal, amplified by respectively corresponding amplifying circuits in a signal processing circuit 18, then it is made into a voltage pulse signal corresponding to the picture information by respective peak holding circuits. Further, respective switching elements are operated by a voltage pulse signal, a corresponding heat generating resistor 16 is heat-generated, and the picture is recorded on a facing recording paper 12 in an edge surface recording system. Thus, the device can be made compact, the costs are reduced, and high-speed processing is attained.

Description

[Detailed description of the invention] Industrial applications The present invention relates to an image input/output device for a copying machine.

Conventional technology Conventionally, for image input/output of facsimiles, etc., a scanner using a COD or 1x sensor for image input, and a thermal head, inkjet, laser printer, etc. for image output are generally installed separately. Therefore, a drive circuit and a control circuit are required on each of the input side and the output side, which increases the size of the device as a whole, which is a factor in increasing costs.

In order to eliminate such inconveniences, various schemes for integrating input and output ports for one image have been proposed in the past.

For example, as shown in Japanese Unexamined Patent Publication No. 57-37970, the input part of a photoelectric conversion element and the heating part of a heating resistor separated by a predetermined distance are simultaneously coated to reduce the size. As shown in Japanese Patent No. 38060, an optical information reading section, a resistance heating element, and a resistance heating element control section are disposed and integrated on the same substrate through a lamination process, thereby achieving miniaturization. As shown in Publication No. 57-38061, an optical information reading section and a resistance heating element are disposed on the same substrate in a lamination process, and a common control section for both is provided on the substrate and integrated. As shown in Japanese Unexamined Patent Publication No. 57-38062, an optical information reading section and a resistance heating element are disposed on the same substrate in a lamination process,
In addition, the resistance heating element control section is made smaller by bonding it to the substrate as an IC chip, and as shown in Japanese Patent Application Laid-Open No. 57-37969, the input section is made of a photodiode and an input element to generate one heat generation. The part is composed of a heating resistor and an output element to simplify the structure and reduce the size.
Alternatively, as shown in Japanese Unexamined Patent Application Publication No. 59-81966, there is an attempt to reduce the size by integrally providing an original exposure section, an image sensor section, and a printing section on the same insulating substrate.

However, the integrated configurations exemplified in these examples are mere ideas and have not yet been proposed as practical configurations as devices or systems, and some of the systems are immature.

By the way, when looking at image input devices, instead of the conventional CCD that requires a large reduction optical system, devices that use a 1-magnification sensor are attracting attention because they can be made more compact and cost-effective (Nikkei Electronics “Facsimile contact image sensor Jl 19 is being actively developed.
82.4.264), image input devices using same-magnification sensors also have many peripheral parts, so the reality is that sufficient compactness and cost reduction have not been achieved.

As a method for solving this problem, a fully contact type 1-magnification sensor as shown in FIG. 5 has been proposed in Japanese Patent Publication No. 58-14073. The illumination light h passes through the illumination window 2 provided in the light shielding layer 1, the transparent substrate 3, and the transparent protective layer 4.
ν is incident on the surface (original surface) of the original 5, and the reflected light from this original surface is received by the photoelectric conversion element 6 on the transparent substrate 3, thereby converting image information into an electrical signal. Due to this.

It is believed that higher S/N, higher resolution, smaller device size, lower cost, etc. can be achieved compared to conventional devices.

Problems to be Solved by the Invention However, in reality, the document 5 and the conveyance roller (not shown) directly rub the transparent protective layer 4, so scratches on the transparent protective layer 4 cannot be avoided. , it has become clear that the S/N and resolution deteriorate over time.

For this reason, the present applicant has developed an edge-reading type 1-magnification optical sensor that reads image information with the document perpendicular to the substrate and its edge by providing a photoelectric conversion element array perpendicular to the document surface. proposed by.

However, even if such measures are taken, in the end, they only concern the image input section, and when considered as an integrated input/output device, they remain as mere conventional ideas as mentioned above. .

Means for Solving the Problem A plurality of photoelectric conversion elements each having a light-receiving surface facing the document surface are mounted on the same substrate having one end surface facing the document surface and the other end surface facing the recording paper on one end surface thereof. A signal processing circuit having a series circuit of an amplifier circuit, a peak hold circuit, and a switching element connected individually to each photoelectric conversion element, and a heat generating section facing the recording paper. A heat generating resistor array is provided in which heat generating resistors are individually connected to each switching element and arranged on the other end face side.

When light is incident on the document surface from a light source with a document facing one end of the working board and recording paper facing the other end, the reflected light from the document surface is reflected by the photoelectric conversion element using the edge reading method. Each photoelectric conversion element in the column receives light and converts the image information into an electrical signal.

This electrical signal is amplified by each corresponding amplifier circuit in the signal processing circuit, and then converted into a voltage pulse signal according to image information by each corresponding peak hold circuit. Each switching element is operated by this voltage pulse signal,
The corresponding heating resistor is made to generate heat, and by the edge recording method,
Recording is performed on opposing recording paper. In other words, the heating resistor is directly controlled using the photoelectric conversion output that is read by the photoelectric conversion element array and processed by the signal processing circuit, making it possible to use a compact and low-cost image input/output device. In addition, since parallel processing is performed for each photoelectric conversion element and heating resistor, high-speed processing is possible even with a slow response.

Embodiment An embodiment of the present invention will be explained based on FIGS. 1 to 4. FIGS. 2 and 3 schematically show the concept of the image input/output device according to this embodiment. First, an elongated substrate 10 having insulating properties is provided. Because this substrate 10 is an end-face reading/recording system, as shown in FIG. It is set so as to be close to or in contact with the recording surface of the recording paper 12 to be recorded. On such a substrate 1o, first, a photoelectric conversion element row 14 is provided, which is located on the one end surface 10a side and is formed by arranging a large number of photoelectric conversion elements 13 in the longitudinal direction at fine equal pitches. Here, the photoelectric conversion element 13 has a thin film structure, and its light receiving surface 13a faces the document surface, that is, is parallel to one end surface 10a. Each photoelectric conversion element 1 in such a photoelectric conversion element array 14
Between 3 and 3, incident light hν from a light source (not shown) is transmitted to original 1.
A light guide path 15 for guiding the light to the light source 1 is formed. On the other hand, a large number of heating resistors 16 are arranged on the substrate 10 on the side of the other end surface 10b and arranged in the longitudinal direction at fine equal pitches, the same number as the photoelectric conversion elements 13 and corresponding to each other with 1=1. A heating resistor array 17 is provided. Here, this heating resistor 16 also has a thin film structure, and its heating portion 16a faces the recording paper 12, that is, is parallel to the other end surface 10b. Furthermore, on the substrate 10,
A signal processing circuit 18 is provided between the photoelectric conversion element array 14 and the heating resistor array 17. This signal processing circuit 1
8, as shown in FIG. 1, an amplifier circuit (preamplifier) 19 and a peak hold circuit 20 are individually connected to each photoelectric conversion element 13, and the output of the peak hold circuit 20 is connected to the gate and connected to the drain side. A series circuit with a switching transistor 21 as a depression type switching element to which each heating resistor 16 is connected is provided for each photoelectric conversion element 13/heating resistor 16 pair.

Therefore, each pixel includes a photoelectric conversion element 13 and an amplifier circuit 19.
- peak hold circuit 20 - switching transistor 21 - 16 pairs of heating resistors are ensured.

Note that each part is electrically connected by appropriate wiring electrodes. To explain a part of it, for example, one side of each photoelectric conversion element 13 is commonly wired to a common electrode 22 and grounded via a switch element 23. Further, each amplifier circuit 19 is connected to a power supply V via a sensor bias power supply line 24.
Commonly connected to the The source side of each switching transistor 21 is commonly connected to a power supply v2 via a power supply line 25. Further, one side of each heating resistor 16 is commonly wired to a common electrode 26 and grounded.

In addition, the photoelectric conversion element array 14, the signal processing circuit 18, the heating resistor array 17, and even the light guide path 15 and the protective film (not shown) for the entire device are formed using a thin film process mainly composed of Si or the like. It can be created on the substrate 10.

In such a configuration, the input pulse (-V□.

t) charges the capacitor C in parallel to each photoelectric conversion element 13. The light hv that enters the original 11 from the light source through the light guide path 15 becomes reflected light according to image information on the original surface, and enters the photoelectric conversion element 13 via the light receiving surface 13a. As a result, the capacitance corresponding to the density of image information during the accumulation time T is discharged.

The next input pulse charges the same amount of charge as the capacitance discharged during the previous scanning period, and this becomes a photoelectric conversion output that converts image information into an electrical signal. Such a photoelectric conversion element 13
The photoelectric conversion output from is amplified by a corresponding amplifier circuit 19. The output amplified by the amplifier circuit 19 is waveform-shaped by the corresponding peak hold circuit 20 into a voltage pulse signal according to image information. Such a voltage pulse signal from the peak hold circuit 20 is given as a gate input signal of the corresponding switching transistor 21, and a source-drain current corresponding to the image information flows to the heating resistor 16 connected to the drain side. , this heating resistor 16 generates heat. Here, the heating resistor 16 may be a heating element used in a thermal printer head or a transfer material excitation or dissolution element. If thermal paper is used as the recording paper 12, The end face recording method using heat generated by the heat generating portion 16a of the heat generating resistor 16 enables thermal recording as is. If plain paper is used, a thermal transfer method or a heat generating part 16a is used.
A method may be adopted in which heat-melting ink is placed close to the ink, or a method in which the heating resistor is provided with a function of exciting liquid ink to fly.

As described above, according to this embodiment, the end face recording is performed by directly controlling the heating resistor 16 using the photoelectric conversion output which is read by the photoelectric conversion element array 14 side using the end face reading method and processed by the signal processing circuit 18. The method is simple in that it is recorded on the recording paper 12. Therefore, as described above, the image input/output device can be applied to a silicon process and can be mass-produced at low cost. Also, between the original 11 and the recording paper 12 shown in FIG.
It is also possible to make the width of 0 (device) as small as about 5 ms at most. In addition, since parallel processing is performed for each pixel, even if the circuit configuration has a low-speed response for each pixel, it can be processed at high speed as a whole.For example, 1 kHz.
In the case of IK motion, processing of 1 ms/1 line is possible.

Moreover, analog output is possible, and multi-gradation is also possible. Furthermore, it is possible to increase the density to 400 dpi or more and to provide color.

Effects of the Invention As described above, the present invention includes a plurality of photoelectric conversion elements each having a light-receiving surface facing the document surface on the same substrate having one end surface facing the document surface and the other end surface facing the recording paper. A photoelectric conversion element array arranged on one end surface side, a signal processing circuit having a series circuit of an amplifier circuit, a peak hold circuit, and a switching element individually connected to each photoelectric conversion element, and facing the recording paper. A heating resistor array is provided in which heating resistors are individually connected to each switching element and are arranged on the other end face side. It is a simple device that directly controls the heating resistor using the photoelectric conversion output signal-processed by the signal processing circuit and records it on the recording paper using the edge recording method.It is a simple device that can be used as an image input/output device in a compact and large-volume manner. It is possible to reduce production costs, and because parallel processing is performed for each photoelectric conversion element and heat generating resistor, even with a slow response circuit configuration, the overall process can be performed at high speed. Densification.

Colorization is also possible.

[Brief explanation of the drawing]

FIG. 1 is a circuit diagram showing an embodiment of the present invention, FIG. 2 is a schematic perspective view of the device, FIG. 3 is a sectional view taken along line A-A, and FIG.
The figure is a timing chart, and FIG. 5 is a schematic sectional view showing a conventional example. 10... Substrate, 10a... One end surface, 10b... Other end surface. DESCRIPTION OF SYMBOLS 11... Original document, 12... Recording paper, 13... Photoelectric conversion element, 13a... Light receiving surface, 14... Photoelectric conversion element row, 16... Heating resistor, 16a... Heat generation Part, 17
... Heating resistor array, 18... Signal processing circuit, 19.
...Amplification circuit, 20...Peak hold circuit, 21.
...Switching element applicant Co., Ltd.
Riko-α name” Diagram Z Aichi Diagram 7

Claims (1)

[Claims] A photoelectric conversion device comprising: a substrate having one end surface facing the document surface and the other end surface facing the recording paper; and a plurality of photoelectric conversion elements each having a light-receiving surface facing the document surface arranged on one end surface side of the substrate. a signal processing circuit provided on the substrate having a series circuit of an amplifier circuit, a peak hold circuit, and a switching element individually connected to each photoelectric conversion element; a heat generating resistor array in which a heat generating resistor having a heat generating part connected to the recording paper and facing the recording paper is arranged on the other end surface side of the substrate, and the light reflected from the document surface is transmitted to each of the photoelectric conversion element arrays. The photoelectric conversion element receives light and converts the image information into an electric signal, and after amplifying this electric signal in each of the amplification circuits, a voltage pulse signal corresponding to the image information is obtained by each of the peak hold circuits, and this voltage pulse signal operating each of the switching elements by
An image input/output device characterized by causing a corresponding heating resistor to generate heat.