JPH0216262U - - Google Patents
Info
- Publication number
- JPH0216262U JPH0216262U JP1988091912U JP9191288U JPH0216262U JP H0216262 U JPH0216262 U JP H0216262U JP 1988091912 U JP1988091912 U JP 1988091912U JP 9191288 U JP9191288 U JP 9191288U JP H0216262 U JPH0216262 U JP H0216262U
- Authority
- JP
- Japan
- Prior art keywords
- support arm
- clamp
- move
- down along
- driving means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Molten Solder (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988091912U JPH077022Y2 (ja) | 1988-07-13 | 1988-07-13 | 予備半田装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988091912U JPH077022Y2 (ja) | 1988-07-13 | 1988-07-13 | 予備半田装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0216262U true JPH0216262U (en:Method) | 1990-02-01 |
| JPH077022Y2 JPH077022Y2 (ja) | 1995-02-22 |
Family
ID=31316369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988091912U Expired - Lifetime JPH077022Y2 (ja) | 1988-07-13 | 1988-07-13 | 予備半田装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077022Y2 (en:Method) |
-
1988
- 1988-07-13 JP JP1988091912U patent/JPH077022Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH077022Y2 (ja) | 1995-02-22 |