JPH0215643A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the assembling cost through repeated use of components by a method wherein a semiconductor element in a stud-type semiconductor device and a spring, the spring applying pressure to and being in contact with a first electrode provided with a bottom-equipped cylinder, are fixed immovable to said bottom-equipped cylinder using a cylindrical screw, and a cap is welded along its flange to said bottom-equipped cylinder using welding rings. CONSTITUTION:A threaded section 12 is provided along the inner circumference of an opening in a first electrode bottom-equipped cylinder 11a, and a flange 13 equipped with a welding ring 13a is provided along the outer circumference. To a part of the circumference of the welding ring 13a facing the outer circumference of a cylinder 11a, a flange 15 is welded, equipped with a welding ring 15a capable of engagement with the welding ring 13a. A semiconductor element 2 is held between electrodes 4 and 11, subjected to pressure exerted by a cylinder equipped with a threaded section 16a engaging the threaded section 12, which cylinder may for example be a Fe-Ni alloy cylinder 14a. The first electrode 11 of an already-assembled semiconductor device may be repeatedly used after unscrewing a cylinder 10 from the bottom-equipped cylinder 11a and dewelding a cap 14 (welding ring 15a) from the electrode 11 (welding ring 13a).

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a stand-type semiconductor device in which a semiconductor element is pressed and held by a spring.

[Conventional technology]

Conventionally, this type of semiconductor device has been constructed as shown in FIG. To explain this based on the same figure, in the same figure, what is indicated by reference numeral 1 is a bottomed cylinder 1a on which a semiconductor element 2 is placed on the bottom surface, and a protrusion 1b on the inner circumferential surface of this bottomed cylinder 1a. a first electrode made of Cu or Fe-Ni alloy; 3 a cap welded to the first electrode l and closing the opening of the bottomed tube 1a; 4 a cap 1;
A second electrode 6 is provided around the second electrode 4 and has a flange 4a which is provided inside the bottomed cylinder 1a and is pressed into contact with the semiconductor element 2 by a disc spring 5 as a spring. This is an insulating tube made of Teflon that is interposed between the flange 4a and the disc spring 5. Further, 7 is a tube for sealing N2 gas into the cap 3 and the bottomed cylinder 1a. By filling N2 gas from this tube 7, the characteristics of the semiconductor element 2 are stabilized. The cap 3 includes a cylindrical body 3a made of Fe-Ni alloy, a ring 3b made of ceramic, and a Cu
and a relay tube 3C, each of which is brazed to each other.

In this way, a semiconductor device can be assembled.

First, the semiconductor element 2 is placed on the bottom surface of the bottomed cylinder 1a of the electrode 1. Next, an electrode 4 is placed on this semiconductor element 2. After that, an insulating tube 6 is placed on the flange 4a of this electrode 4.
1 disc springs 5 are placed one after another, and with a predetermined pressure applied to the disc springs 5, the projections 1 are placed on the bottomed cylinder 1a by staking.
b. Then, after closing the opening of the bottomed tube 1a with the cap 3 and welding it to the electrode 1, the tube body 7
N2 gas is then filled into the electrode 1.

In this way, a semiconductor device can be assembled.

[Problem to be solved by the invention]

By the way, in this type of semiconductor device, the bottomed cylinder 1a
Since the second electrode 4 is held by the bottom surface and the protrusion 1b, and the welding surface between the first electrode part and the cap 3 is set to a small size, once the semiconductor device is assembled, for example, Components such as electrode 1 could not be used again. As a result, when assembling the semiconductor device again by collecting component parts from the assembled semiconductor device, it becomes necessary to newly manufacture the expensive electrode 1, resulting in a problem that the assembly cost increases.

The present invention has been made in view of the above circumstances, and provides a semiconductor that eliminates the need to newly manufacture a first electrode when assembling a semiconductor device by reusing component parts, thereby reducing assembly costs. It provides equipment.

[Means to solve the problem]

A semiconductor device according to the present invention includes: a first electrode having a bottomed tube on the bottom surface of which a semiconductor element is placed; a cap welded to the first electrode to close an opening of the bottomed tube; A second electrode is provided inside the cap and the bottomed cylinder and is pressed into contact with the semiconductor element by a spring, and the second electrode is provided around the second electrode and fixed above the spring, and has a threaded portion on its peripheral surface. A cylindrical body, a threaded portion screwed into the threaded portion of the cylindrical body is provided on the circumferential surface of the bottomed tube, and a flange having a welding ring that fits on the circumferential surface of the cap is provided, and the welding ring of this flange is provided. A part of the cylinder faces the circumferential surface of the bottomed cylinder.

(Function) In the present invention, the first electrode of the assembled semiconductor device can be used again by releasing the screwed state between the cylinder and the bottomed pipe and the welded state between the cap and the welding ring.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.

FIG. 1 is a cross-sectional view showing a semiconductor device according to the present invention. In the figure, the same members and members corresponding to those in FIG. 2 are designated by the same reference numerals, and detailed explanations thereof will be omitted. In the figure, a threaded portion 12 is provided on the inner circumferential surface of the opening of a bottomed cylinder 11a in the first electrode designated by reference numeral 11, and a flange 13 having a weld ring 13a is provided on the outer circumferential surface. A part of the circumferential surface of the weld ring 13a of this flange 13 faces the outer circumferential surface of the bottomed cylinder 11a. Reference numeral 14 denotes a cap having the same function as the cap 3, and includes a cylindrical body 14a made of, for example, an Fe-Ni alloy.
, a ring 14b made of, for example, ceramic and a relay tube 14c made of, for example, Cu. Of these, the welding ring 13a is provided on the outer peripheral surface of the cylinder 14a.
A ferrule 15 is provided which has a weld ring 15a that fits into the ferrule. Reference numeral 16 denotes a cylindrical body having a threaded portion 16a on its outer peripheral surface that is screwed into the threaded portion 12, and is detachably attached to the first electrode 11.
The structure is such that the semiconductor element 2 is held under pressure therebetween.

Therefore, in the present invention, the cylinder body 16 and the bottomed cylinder 11
The screwed state of a and the cap 14 (welding ring 15a)
By releasing the welded state of the electrode 11 (welding ring 13a), the first electrode 11 of the assembled semiconductor device can be reused. There is no need to newly manufacture the electrode 11.

Next, a method for assembling a semiconductor device according to the present invention will be explained.

First, the semiconductor element 2 is placed on the bottom surface of the bottomed cylinder 11a of the electrode 11.
Place. Next, an electrode 4 is placed on this semiconductor element 2. Thereafter, the insulating tube 62 and the disc spring 5 are sequentially placed on the flange 4a of the electrode 4, and the screw parts 12 and 16a are screwed together while applying a predetermined pressure to the disc spring 5, thereby forming the cylinder. The body 16 is attached to the electrode 11. Then, the opening of the bottomed tube 11a is closed with the cap 14, and after welding a part of the rewelding rings 13a and 15a, NZ gas is sealed into the electrode 11 from the tube body 7.

In this way, a semiconductor device can be assembled.

〔Effect of the invention〕

As explained above, according to the present invention, there is provided a first electrode having a bottomed tube on which a semiconductor element is placed, and a first electrode that is welded to the first electrode to close the opening of the bottomed tube. A cap, a second electrode provided inside the cap and the bottomed cylinder and pressed into contact with the semiconductor element by a spring, and a screw provided on the circumferential surface of the second electrode provided around the second electrode and fixed above the spring. A cylindrical body having a section,
A threaded part that is screwed into the threaded part of this cylinder is provided on the circumferential surface of the bottomed cylinder, and a flange having a welding ring that fits on the circumferential surface of the cap is provided, and a part of the welded ring of the flange is attached to the bottomed cylinder. Since it is opposed to the circumferential surface of the cylinder, the first electrode of the assembled semiconductor device can be used again by releasing the screwed state between the cylinder body and the bottomed cylinder and the welded state between the cap and the welding ring. . Therefore, since there is no need to newly manufacture the first electrode when assembling the semiconductor device by reusing the component parts, the assembly cost can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a semiconductor device according to the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor device. 2... Semiconductor element, 4... Second electrode, 5...
... Disc spring, 11... First electrode, lla...
Bottomed cylinder, 12... threaded part, 13... flange,
13a...Welding ring, 14...Cap, 14a...Cylinder body, 15...Flange, 1
5a...Welding ring, 16...Cylinder body, 16
a...Threaded part. Figure 1 Agent Masuo Hitoiwa TBA Shisuke Park

Claims (1)

[Claims] a first electrode having a bottomed tube on which a semiconductor element is placed; a cap welded to the first electrode to close an opening of the bottomed tube; the cap and the bottomed tube; a second electrode provided inside the semiconductor element and pressed into contact with the semiconductor element by a spring; and a cylindrical body provided around the second electrode and fixed above the spring and having a threaded portion on its peripheral surface. A threaded portion that is screwed into the threaded portion of the cylinder is provided on the circumferential surface of the bottomed tube, and a flange having a welding ring that fits on the circumferential surface of the cap is provided, and a part of the welding ring of this flange is provided. A semiconductor device characterized in that: is opposed to the circumferential surface of the bottomed cylinder.