JPH02155247A - Control method of head for wire bonding device - Google Patents
Control method of head for wire bonding deviceInfo
- Publication number
- JPH02155247A JPH02155247A JP63310320A JP31032088A JPH02155247A JP H02155247 A JPH02155247 A JP H02155247A JP 63310320 A JP63310320 A JP 63310320A JP 31032088 A JP31032088 A JP 31032088A JP H02155247 A JPH02155247 A JP H02155247A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- height
- lead
- wire
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/8212—Aligning
- H01L2224/82148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/82169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, e.g. nozzle
- H01L2224/8218—Translational movements
- H01L2224/82181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の製造工程において半導体チップ
の電極とリード間を導体線（ワイヤ）によって接続する
ワイヤボンディング装置のへ７Ｆ制御方法に関するもの
である。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for controlling the 7F of a wire bonding device that connects electrodes and leads of a semiconductor chip using conductor wires (wires) in the manufacturing process of semiconductor devices. It is.
第２図は通常のワイヤボンディング装置の工程を示す工
程図である。図において、２０は導体線にあたるワイヤ
、２１はクランパー、２２はキャピラリー ２３はボー
ル、２４は半導体装置のチップ、２５はリードである。FIG. 2 is a process diagram showing the steps of a conventional wire bonding apparatus. In the figure, 20 is a wire corresponding to a conductor line, 21 is a clamper, 22 is a capillary, 23 is a ball, 24 is a chip of a semiconductor device, and 25 is a lead.
さて、ボンディング開始時は同図（ａ）のようにワイヤ
２０の先端にボール２３が形成された状態にある。この
状態からキャピラリー２２が降下し、半導体チップ２４
上の接合点ｐ１で同図（ｂ）の状態でボンディングを行
なう。そして、ワイヤ２０は、キャピラリー２２が降下
するときに、図示していないワイヤスプールから繰り出
される。Now, when bonding is started, a ball 23 is formed at the tip of the wire 20, as shown in FIG. 2(a). From this state, the capillary 22 descends and the semiconductor chip 24
Bonding is performed at the upper bonding point p1 in the state shown in FIG. 3(b). Then, when the capillary 22 descends, the wire 20 is let out from a wire spool (not shown).
次に、ボンディング後のキャピラリー２２は所定の高さ
まで上昇し、同図（ｃ）のようにリード２５側に移動す
る。そして、キャピラリー２２が再び降下し、リード２
５上の接合点ｐ２に着地してボンディングを行なう （
同図（ｄ））。続いて、図示していないボンディングア
ームがキャピラリー２２と共に上昇、停止し、ワイヤ保
持用のクランバー２１を閉じてワイヤ２０を引きちぎる
状態となる（同図（ｅ））。そして、引きちぎられたワ
イヤ２０は先端が放電等によって加熱され、同図（ｆ）
のようにボール２３を形成する。この後、クランパー２
１を開き、所期状態の同図（ａ）から同一の動作を繰し
行なう。Next, the capillary 22 after bonding rises to a predetermined height and moves toward the lead 25 as shown in FIG. 2(c). Then, capillary 22 descends again and lead 2
Land at the bonding point p2 on 5 and perform bonding (
Figure (d)). Subsequently, the bonding arm (not shown) rises and stops together with the capillary 22, and the clamper 21 for holding the wire is closed to tear off the wire 20 (FIG. 2(e)). Then, the tip of the torn wire 20 is heated by electric discharge or the like, as shown in FIG.
Form the ball 23 as shown below. After this, clamper 2
1 and repeat the same operation starting from the desired state (a) in the same figure.
次に、上記の工程における従来の課題を説明する。まず
、第２図（Ｃ）において、キャピラリー２２の上昇は、
それぞれの接合点から正常なワイヤループで接合できる
ように、接合点ｐｉからのワイヤ引き出しを必要な所定
長さにする必要がある。また、同図（ｅ）においても、
キャピラリー２２から突出するワイヤ長さが所定長にな
るようにボンディングアームの停止位置を決定する必要
がある。これは、同図（ｆ）の工程で形成するボール径
の大きさが影響を受けるからである。Next, conventional problems in the above process will be explained. First, in FIG. 2(C), the rise of the capillary 22 is as follows.
It is necessary to draw out the wire from the junction point pi to a required predetermined length so that the wire can be joined with a normal wire loop from each junction point. Also, in the same figure (e),
It is necessary to determine the stopping position of the bonding arm so that the length of the wire protruding from the capillary 22 is a predetermined length. This is because the size of the diameter of the ball formed in the process shown in FIG. 2(f) is affected.
これらの動作を安定に動作させるために、半導体チップ
２４及びリード２５の接合点に沿って予め下面高さを教
示記憶し、ボンディング時に、このデータを参照しなが
らボンディングアームを制御することが提案されている
。In order to operate these operations stably, it has been proposed to teach and memorize the lower surface height in advance along the junction point of the semiconductor chip 24 and the leads 25, and to control the bonding arm while referring to this data during bonding. ing.
第３図は特開昭５７−１８３０４７号公報に開示された
従来装置の構成を示す外観図である。図において、１３
は高さ検出器、１４はボンディングツール、１５はＸＹ
子テーブル１６は位置検出器、１７は速度検出器、１８
はボンディング制御部、１９はモータ、２０は第１高さ
記憶部、２１は第２高さ記憶部、２２はベレットである
。FIG. 3 is an external view showing the configuration of a conventional device disclosed in Japanese Unexamined Patent Publication No. 57-183047. In the figure, 13
is a height detector, 14 is a bonding tool, 15 is an XY
Child table 16 is a position detector, 17 is a speed detector, 18
19 is a bonding control section, 19 is a motor, 20 is a first height storage section, 21 is a second height storage section, and 22 is a bellet.
次に、動作について説明する。高さ検出器１３は、ボン
ディング前のベレット２２に対してボンディングツール
１４と同一の箇所を指すような位置関係でＸＹ子テーブ
ル５上に取付けられており、ボンディングに同期してボ
ンディング前のパッド及びリードの高さを検出する。検
出された高さは、各ボンディング点毎に次々と第１高さ
記憶部２０に書き込まれていき、全てのボンディングが
終わった時に第２高さ記憶部２１に保持された接合点高
さのデータを基に、ボンディングツールの速度プロファ
イルを発生させ、現在高さ位置を示す位置検出器１６と
現在速度を示す速度検出器１８とを帰還信号としてモー
タ１９を制御する。Next, the operation will be explained. The height detector 13 is mounted on the XY child table 5 in such a positional relationship that it points to the same location as the bonding tool 14 with respect to the beret 22 before bonding. Detect lead height. The detected height is written into the first height storage section 20 one after another for each bonding point, and when all bonding is completed, the height of the bonding point held in the second height storage section 21 is written. Based on the data, a speed profile of the bonding tool is generated, and the motor 19 is controlled using the position detector 16 indicating the current height position and the speed detector 18 indicating the current speed as feedback signals.
従来のワイヤボンディング装置のヘッド制御方法は、接
合点の高さを予め教示記憶させ、ボンディング実働時に
対する調整はマニュアルによるデータ変更で対処してい
た。しかし、実際のボンディング時では、チップ移載器
のベース高さの不均一やリードの押さえバラツキ、さら
には、チップの傾斜などの要因により、教示時と実働時
の接合点高さが常に一致した状態にあるとは限らず、各
接合点の高さにバラツキが生じていた。これらに対して
従来の方法では、実際のボンディング時にリアルタイム
に高さ補正をすることができず、その結果、ループ形状
の変形、ボール径の不安定化、及び加圧力変動による接
合状態の信頼性低下を引き起こしていた。また、予め接
合点の高さを教示記憶させるという作業があったため、
生産性が向上しないという欠点があった。In a conventional method for controlling the head of a wire bonding apparatus, the height of the bonding point is taught and stored in advance, and adjustments during actual bonding are made by manually changing the data. However, during actual bonding, due to factors such as uneven base height of the chip transfer device, variations in lead pressure, and chip inclination, the bonding point height during teaching and actual bonding does not always match. There were variations in the height of each junction point. In contrast, with conventional methods, it is not possible to correct the height in real time during actual bonding, resulting in deformation of the loop shape, instability of the ball diameter, and unreliability of the bonding state due to pressure fluctuations. was causing a decline. Also, since the height of the joining point had to be taught and memorized in advance,
The drawback was that productivity did not improve.
本発明は上記の欠点を解消するためになされたもので、
超高速なワイヤボンディングを達成すると共に、信頼性
の高いボンディングを実現するためのワイヤボンディン
グ装置のヘッド制御方法を得ることを目的としている。The present invention has been made to solve the above-mentioned drawbacks.
The purpose of this invention is to obtain a method for controlling the head of a wire bonding apparatus in order to achieve ultra-high-speed wire bonding and highly reliable bonding.
本発明に係るワイヤボンディング装置のヘッド制御方法
は、ボンディング時に電極及びリードの接合点へのボン
ディングツールの着地を逐次検出し、そのときのボンデ
ィングツールの位置を読み取る手段を備え、ワイヤボン
ディング時のボンディングツールの上下動作及びヘッド
に付随する機構の動作を下面位置を基準にリアルタイム
に制御している。A head control method for a wire bonding apparatus according to the present invention includes means for successively detecting the landing of a bonding tool on a bonding point of an electrode and a lead during bonding, and reading the position of the bonding tool at that time. The vertical movement of the tool and the movement of the mechanism attached to the head are controlled in real time based on the position of the bottom surface.
ボンディング時に接合点の高さを逐次検出してヘッドの
動作を制御する。During bonding, the height of the bonding point is sequentially detected to control head operation.
以下、本発明の実施例を図について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示すヘッド制御方法を行な
うためのワイヤボンディング装置のブロック図である０
図において、１は接合点の接地を検出する下面検出器、
２はボンディングアームの上下位室を検出するエンコー
ダ等の位置検出器、３は位置検出器の検出信号を計数（
計測）してボンディングアームの現在の高さを保持する
現在値カウンタ、４は下面検出器ｌからの出力信号によ
って、その時の現在値カウンタ３の計数値を保持する下
面位置レジスタである。ここで、下面位置レジスタ４は
、パッドの下面位置データ及びリードの下面位置データ
を保持する２つのレジスタよりなり、パッド及びリード
への接地に応じて前記２つのレジスタを切り替えを行な
っている。５は現在値カウンタ３から下面位置レジスタ
４の値を減算する減算器であり、その結果の値は検出し
た下面位置基準からのボンディングアームの相対的な変
位量を示している。６はボンディングアームが動作切り
換え点の目標位置へ到達したか否かを比較判定する比較
器である。ここで、比較器６の出力は、シーケンス制御
部８に入力されシーケンスを動作させるトリガの役目を
する。これにより、第２図に示す一連のボンディング工
程はシーケンス制御部８の命令によって順次実行されて
い（。FIG. 1 is a block diagram of a wire bonding apparatus for carrying out a head control method showing one embodiment of the present invention.
In the figure, 1 is a bottom detector that detects the grounding of the junction point;
2 is a position detector such as an encoder that detects the upper and lower chambers of the bonding arm, and 3 is a position detector that counts the detection signal of the position detector (
A current value counter 4 holds the current height of the bonding arm by measuring the current height of the bonding arm. Reference numeral 4 designates a lower surface position register that holds the current count value of the current value counter 3 based on the output signal from the lower surface detector 1. Here, the lower surface position register 4 is composed of two registers that hold the lower surface position data of the pad and the lower surface position data of the lead, and switches between the two registers according to the grounding of the pad and the lead. A subtracter 5 subtracts the value of the lower surface position register 4 from the current value counter 3, and the resulting value indicates the relative displacement amount of the bonding arm from the detected lower surface position reference. A comparator 6 compares and determines whether the bonding arm has reached the target position of the operation switching point. Here, the output of the comparator 6 is input to the sequence control section 8 and serves as a trigger for operating the sequence. As a result, the series of bonding steps shown in FIG. 2 are sequentially executed according to the instructions from the sequence control section 8 (
７はシーケンス制御部からの動作の切り換え点位置を格
納する目標値バッファ、９はシーケンス制御部８からメ
カドライブ部１０及びボンディングヘッドの上下動作を
制御する速度制御部１１への動作開始と停止及び下面位
置レジスタの切り換えを指示する制御データを格納する
出カバソファである。メカドライブ部１０はクランパ等
を開閉させるためのソレノイドやりニアモータの電流制
御をする。速度制御部１１は所定のヘッド上下動作をさ
せ、接合点への降下やワイヤルーピングするための速度
プロファイルを発生させて駆動モータ１２を制御する。Reference numeral 7 indicates a target value buffer for storing operation switching point positions from the sequence control unit, and reference numeral 9 indicates operation start and stop information from the sequence control unit 8 to the mechanical drive unit 10 and the speed control unit 11 that controls the vertical movement of the bonding head. This is an output sofa that stores control data that instructs switching of the bottom position register. The mechanical drive section 10 controls the current of a solenoid and a near motor for opening and closing a clamper and the like. The speed control unit 11 controls the drive motor 12 by causing the head to move up and down in a predetermined manner, generating a speed profile for lowering to the junction point and wire looping.
次に、本実施例の動作を説明する。予めシーケンス制御
部８にはワイヤボンディングのシーケンスプログラムが
格納され、目標バッファ７及び出カバソファ９には１ス
テツプ目のデータが保持されている。このデータ内容に
従ってメカドライバ部１０は作動し、ボンディングツー
ルのメカニズムが所望の状態に維持される。そして、併
せて速度制御部１１が起動され、第１接合点（パッド）
に向かってボンディングツールが降下する。このとき、
下面位置レジスタ４はパッド側のレジスタが選択され前
回保持した隣接するパッド高さを基準とする変位量に従
ってシーケンスが開始され、ボンディングツールの制御
が行なわれる。次に、キャピラリーがパッドの接合点に
着地し、下面検出器１が作動するとレジスタの内容はパ
ッドの現在高さに更新され、以降のシーケンスは最新の
着地高さを基準とする変位量に従ってシーケンスが開始
される。このため、第１接合点ボンディング後のループ
形成では、常に一定量のワイヤ引き出しが可能となる。Next, the operation of this embodiment will be explained. A sequence program for wire bonding is stored in advance in the sequence control unit 8, and data for the first step is held in the target buffer 7 and the output buffer sofa 9. The mechanical driver section 10 operates according to the contents of this data, and the mechanism of the bonding tool is maintained in a desired state. At the same time, the speed control unit 11 is activated, and the first joint point (pad)
The bonding tool descends towards the At this time,
In the lower surface position register 4, the pad side register is selected and a sequence is started according to the amount of displacement based on the previously held height of the adjacent pad, and the bonding tool is controlled. Next, when the capillary lands on the pad junction and the bottom detector 1 is activated, the contents of the register are updated to the current height of the pad, and the subsequent sequence is sequenced according to the amount of displacement based on the latest landing height. is started. Therefore, in loop formation after the first bonding point bonding, it is possible to always draw out a certain amount of wire.
次に、ボンディングツールがワイヤ引き出しを行ない起
動の頂点に到達すると、下面位置レジスタ４はリード側
のレジスタに切り替わり、前回保持したリード高さを基
準とする。Next, when the bonding tool pulls out the wire and reaches the peak of activation, the lower surface position register 4 is switched to the lead side register, and the previously held lead height is used as a reference.
そして、シーケンスの開始がされ、第２接合点（リード
）に向かって、ボンディングツールの降下が行なわれる
。キャピラリーがリードに着地すると下面位置レジスタ
４の内容が、リード着地高さに更新される。この後のシ
ーケンスは、最新のリード着地高さを基準に開始される
。従って、第２接合点ボンディング後のテール長の引き
出しが常に所望の値を保つことができ、安定なボール形
成ができる。ボール形成後のシーケンス制御部８は、所
期ステップに復帰され同様のシーケンスを繰り返して行
なう。Then, the sequence is started and the bonding tool is lowered toward the second bonding point (lead). When the capillary lands on the lead, the contents of the lower surface position register 4 are updated to the lead landing height. The subsequent sequence is started based on the latest lead landing height. Therefore, the tail length extension after the second bonding point can always be maintained at a desired value, and a stable ball can be formed. After the ball is formed, the sequence control section 8 returns to the desired step and repeats the same sequence.
このように本実施例におけるワイヤボンディング装置の
ヘッド制御方法は、ヘッドの速度制御の切り換え及びク
ランパ等のヘッドに付随する種々機構の動作タイミング
を接合点の高さを基準とする相対高さ位置に基づいて発
生させ、順次シーケンスを進めていくことができる。As described above, the head control method of the wire bonding apparatus in this embodiment changes the speed control of the head and the operation timing of various mechanisms attached to the head such as the clamper at relative height positions with respect to the height of the bonding point. The sequence can be advanced sequentially.
また、実ボンディング時に変動する接合点の高さに適応
してボンディングヘッドをリアルタイムに制御できるよ
うに構成したので、常にワイヤループ形状並びに接合条
件を最良なソフトランディング時間の短縮が可能となる
。このため、ワイヤボンディングの信鯨性と生産性の大
幅な向上が図られ、その結果、半導体装置の製品信鯨性
と歩留まりの向上を図ることができる。Furthermore, since the bonding head can be controlled in real time to adapt to the height of the bonding point that changes during actual bonding, it is possible to always optimize the wire loop shape and bonding conditions to shorten the soft landing time. Therefore, reliability and productivity of wire bonding can be greatly improved, and as a result, product reliability and yield of semiconductor devices can be improved.
以上説明したように本発明は、ボンディング時に電極及
びリードの接合点へのボンディングツールの着地を逐次
検出し、そのときのボンディングツールの位置を読み取
る手段を備え、ワイヤボンディング時のボンディングツ
ールの上下動作及びヘッドに付随する機構の動作を下面
位置を基準にリアルタイムに制御しているため、チップ
の傾斜などの要因により、各接合点の高さにバラツキが
生じていても、安定してボンディングすることができる
。As explained above, the present invention includes a means for sequentially detecting the landing of the bonding tool on the bonding point of the electrode and the lead during bonding, and reading the position of the bonding tool at that time, and the vertical movement of the bonding tool during wire bonding. Since the operation of the mechanism attached to the head is controlled in real time based on the bottom surface position, stable bonding can be performed even if the height of each bonding point varies due to factors such as chip inclination. Can be done.
また、リアルタイムにボンディングツールの上下動作及
びヘッドに付随する機構の動作を制御しているため、従
来のようにループ形状の変形、ボール径の不安定化、及
び加圧力変動による接合状態の信幀性低下を引き起こす
ことがない。さらに、予め接合点の高さを教示記憶させ
るという作業がないため、生産性を向上することができ
る。In addition, since the vertical movement of the bonding tool and the movement of the mechanism attached to the head are controlled in real time, it is possible to prevent loop shape deformation, instability of the ball diameter, and fluctuations in the bonding state due to fluctuations in pressure force, unlike conventional methods. Does not cause sexual decline. Furthermore, since there is no need to teach and memorize the height of the joining point in advance, productivity can be improved.
第１図は本発明に係る一実施例を示したワイヤボンディ
ング装置のブロック図、第２図は通常のワイヤボンディ
ングの工程図、第３図は従来装置を示す外観図である。
１・・・下面検出器、２・・・位置検出器、３・・・現
在値カウンタ、４・・・下面位置レジスタ、５・・・減
算器、６・・・比較器、７・・・目標値バッファ、７・
・・目標値バ・ソファ、８・・・シーケンス制御部、９
・・・出カバ・ソファ、１０・・・メカドライブ部、１
１・・・速度制御部、１２・・・駆動モータ。FIG. 1 is a block diagram of a wire bonding apparatus showing an embodiment of the present invention, FIG. 2 is a process diagram of normal wire bonding, and FIG. 3 is an external view of a conventional apparatus. 1... Bottom surface detector, 2... Position detector, 3... Current value counter, 4... Bottom surface position register, 5... Subtractor, 6... Comparator, 7... Target value buffer, 7.
...Target value sofa, 8...Sequence control section, 9
... Cover Sofa, 10 ... Mecha Drive Club, 1
1... Speed control section, 12... Drive motor.
Claims (1)
ワイヤボンディング装置において、ボンディング時に電
極及びリードの接合点へのボンディングツールの着地を
逐次検出し、そのときのボンディングツールの位置を読
み取る手段を備え、 ワイヤボンディング時のボンディングツールの上下動作
及びヘッドに付随する機構の動作を下面位置を基準にリ
アルタイムに制御することを特徴とするワイヤボンディ
ング装置のヘッド制御方法。[Claims] In a wire bonding device that connects an electrode of a semiconductor chip and an external lead with a conductor wire, during bonding, the landing of a bonding tool on the joining point of the electrode and the lead is sequentially detected, and the bonding tool is connected at that time. A method for controlling a head of a wire bonding apparatus, comprising: means for reading a position; and controlling the vertical movement of a bonding tool during wire bonding and the movement of a mechanism attached to the head in real time based on a bottom surface position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63310320A JPH0831492B2 (en) | 1988-12-07 | 1988-12-07 | Head control method for wire bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63310320A JPH0831492B2 (en) | 1988-12-07 | 1988-12-07 | Head control method for wire bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02155247A true JPH02155247A (en) | 1990-06-14 |
| JPH0831492B2 JPH0831492B2 (en) | 1996-03-27 |
Family
ID=18003814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63310320A Expired - Lifetime JPH0831492B2 (en) | 1988-12-07 | 1988-12-07 | Head control method for wire bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831492B2 (en) |
-
1988
- 1988-12-07 JP JP63310320A patent/JPH0831492B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831492B2 (en) | 1996-03-27 |
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