JPH02150101A - Microplane patch antenna - Google Patents
Microplane patch antennaInfo
- Publication number
- JPH02150101A JPH02150101A JP30437088A JP30437088A JPH02150101A JP H02150101 A JPH02150101 A JP H02150101A JP 30437088 A JP30437088 A JP 30437088A JP 30437088 A JP30437088 A JP 30437088A JP H02150101 A JPH02150101 A JP H02150101A
- Authority
- JP
- Japan
- Prior art keywords
- patch antenna
- dielectric
- antenna
- ultra
- microplane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 abstract description 4
- 239000003989 dielectric material Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 102100026459 POU domain, class 3, transcription factor 2 Human genes 0.000 description 1
- 101710133394 POU domain, class 3, transcription factor 2 Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Waveguide Aerials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、音声１画像、データ等の各種無線通信に用
いる平面パッチアンテナの内、ＩＣカード、小型携帯無
線機器、その他無線機等、実装上超小型化された平面パ
ッチアンテナが必要とされる分野に用いる超小型平面パ
ンチアンテナに関する。[Detailed Description of the Invention] [Field of Industrial Application] This invention is a planar patch antenna used for various wireless communications such as audio, images, data, etc. The present invention relates to an ultra-compact planar punch antenna used in fields where an ultra-compact planar patch antenna is required.
本発明は、前述の各種無線通信に用いるアンテナにおい
て、放射器、誘電体、グランドプレーンからなる平面パ
ッチアンテナのｔＮ ｉｆｆ電体に高誘電率（εｒ＝２
４〜３６、又はそれ以上）、例えば、セラミ、り等の誘
電体を用いる事により、従来の標準的誘電体、テフロン
系誘電体（εｒ＝２．６）又はレジン系誘電体（ｔ ｒ
＝４．５）、さらには、アルミナセラミック系（εｒ
＝９．８）等を用いた平面パッチアンテナに比較して寸
法を１７４〜１／２の超小型化を可能とした、超小型平
面パッチアンテナを実現しようとしたものである。The present invention provides an antenna for use in various wireless communications described above, in which the tNiff electric body of a planar patch antenna consisting of a radiator, a dielectric, and a ground plane has a high dielectric constant (εr=2
4 to 36 or more), e.g., ceramic, phosphor, etc., can be used to convert conventional standard dielectrics, Teflon-based dielectrics (εr=2.6), or resin-based dielectrics (t r
= 4.5), and furthermore, alumina ceramic (εr
This is an attempt to realize an ultra-compact planar patch antenna that can be made ultra-small in size by 174 to 1/2 compared to a planar patch antenna using, for example, a flat patch antenna using an antenna (=9.8) or the like.
従来、平面パッチアンテナに用いる誘電体としては、前
述の標準的誘電体、テフロン系誘電体（εｒ＝２．６）
、レジン系誘電体（εｒ ＝４．５）、又は、アルミナ
セラミック系誘電体（εｒ ＝９．８）等がＩ ＢＥＥ
論文、１を子通信学会論文、又は、テレビジョン学会論
文等で、種々発表され知られていた。前述の低誘電率誘
電体を使用して小型化を実現する手法としては、１／４
λ型の平面パッチアンテナとすることが、電子通信学
会やその他の学会の論文等で発表され知られていた。Conventionally, dielectrics used in planar patch antennas include the standard dielectric mentioned above and Teflon dielectric (εr=2.6).
, resin dielectric (εr = 4.5), alumina ceramic dielectric (εr = 9.8), etc.
It has been published and known in various ways, such as in the paper 1 of the Communication Society of Japan, or the paper of the Television Society. As a method of realizing miniaturization using the aforementioned low-permittivity dielectric material,
The use of a λ-type planar patch antenna was announced in papers from the Institute of Electronics and Communication Engineers and other academic societies and was known.
しかし、平面パッチアンテナの共振寸法計算を、テレビ
ジョン学界誌Ｖｏ１．３８．隘１１ （１９８４）に記
載されている方法及び円形の平面パッチアンテナの計算
式、ｒ ｒ ｐ ＝ （Ｃ／２ ａＦＴＴ）（方形）又
はｆ ｒ ｃ ＝ （ｘｌｌ／ ２ ｒｒ ａＦＴＴ）
Ｃ（円形）（ｆｒｐ、ｆｒｃ：共振周波数、ａ：バッ
チ寸法、Ｃ：光速、 Ｘ１１＝１．８ 、４１：主モ
ードの固有値〕を引用し７て計算を行った場合、誘電率
εｒが計算式の分母側にあり、このεｒの値によってバ
ッチ寸法ａが決まるため、従来のようなテフロン系誘電
体（εｒ＝２．６）、レジン系誘電体（εｒ＝４．５
） 、又は、アルミナセラミック系誘電体（εｒ ＝９
．８ ）等の低誘電率誘電体を用いた平面パッチアンテ
ナでは、ＩＣカード、小型携帯無線機器、その他色線機
等、実装上超小型化が必要な機器には、大きすぎて組み
込み実装ができない等の欠点があった。また、小型化の
手法として、前記低誘電率誘電体による１／４ λ型の
平面パッチアンテナが有るが、この１／４ λ型子面パ
ッチアンテナを製作する」二で放射器の端面とグランド
プレーンとの間をショート加工する等、加工が複雑とな
ったり、小型化のために高周波特性が劣化する等の欠点
が有った。However, the resonant dimension calculation of a planar patch antenna is not explained in Television Academic Journal Vol. 1.38. 11 (1984) and the calculation formula for a circular planar patch antenna, r r p = (C/2 aFTT) (rectangular) or f r c = (xll/2 r r aFTT)
C (circle) (frp, frc: resonant frequency, a: batch size, C: speed of light, It is on the denominator side of the equation, and the batch size a is determined by the value of εr.
), or alumina ceramic dielectric (εr = 9
．． Planar patch antennas using low-permittivity dielectric materials such as 8) are too large to be incorporated into devices that require ultra-miniaturization, such as IC cards, small portable wireless devices, and other colored wire devices. There were other drawbacks. In addition, as a method of miniaturization, there is a 1/4 λ type planar patch antenna using the low-permittivity dielectric mentioned above, but in order to manufacture this 1/4 λ type plane patch antenna, the end face of the radiator and the ground There were drawbacks such as complicated processing, such as short-circuiting between planes, and deterioration of high frequency characteristics due to miniaturization.
そこで、この発明は、前述のＩＣカード、小型携帯無線
機器、その他色線機等、実装上超小型化が必要な機器に
、低誘電率の誘電体を用いた平面パッチアンテナでは大
きすぎて組み込み実装ができない等の欠点を解決するた
めに放射器、誘電体。Therefore, this invention was developed to incorporate a planar patch antenna using a dielectric material with a low permittivity into devices that require ultra-miniaturization for implementation, such as the aforementioned IC cards, small portable wireless devices, and other colored wire devices. radiators and dielectrics to solve the drawbacks such as not being able to be mounted.
グランドプレーンからなる平面バンチアンテナにおいて
、該誘電体を従来のようなテフロン系Ｐ ｉｔ体（εｒ
＝２．６）、 レジン系誘電体（εｒ−４，５）。In a planar bunch antenna consisting of a ground plane, the dielectric material is a conventional Teflon-based Pit material (εr
=2.6), resin-based dielectric (εr-4,5).
又は、アルミナセラミック系誘電体（εｒ ＝９．８）
等の低誘電率誘電体を用いず、従来、誘電体共振器、フ
ィルター素子としてのみに用いられていた高誘電￥１（
εｒ−２４〜３６、又はそれ以上）、例えばセラミ、り
誘電体を用いることにより、超小型化が可能となり、Ｉ
Ｃカード、小型携帯無線機器。Or alumina ceramic dielectric (εr = 9.8)
Conventionally, high-permittivity ￥1 (
εr-24 to 36 or more), for example, by using ceramic or dielectric material, ultra-miniaturization becomes possible, and I
C card, small portable radio device.
その他色線機等、実装上超小型化が必要な機器への平面
パッチアンテナの実装を実現した。We have also realized the implementation of planar patch antennas in equipment that requires ultra-miniaturization for implementation, such as color line machines.
前述のように高誘電体で構成された超小型平面パッチア
ンテナを実現出来ることにより、電気的特性は従来の低
誘電率誘電体を用いた平面パッチアンテナと遜色なく、
寸法的には１７４〜ｌ／２となり、無接触型無線方式Ｉ
Ｃカードに平面アンテナの組み込みが可能となり、さら
には、ハンディ−ターミナル等小型携帯無線機器、その
他色ＶＡ機等、実装上超小型化が必要な機器の実現が可
能となった。また、無線機器よりアンテナの突起を無く
すことも可能となった。As mentioned above, by realizing an ultra-compact planar patch antenna made of a high dielectric material, the electrical characteristics are comparable to those of conventional planar patch antennas using a low dielectric material.
The dimensions are 174 to 1/2, and it is a contactless wireless system I.
It has become possible to incorporate a planar antenna into a C card, and furthermore, it has become possible to realize devices that require ultra-miniaturization for implementation, such as small portable wireless devices such as handheld terminals, and other color VA devices. It has also become possible to eliminate antenna protrusions from wireless devices.
（実施例〕
以下にこの発明の実施例を図面に基づいて説明する。第
１図は、この発明にかかわる断面図であり、高誘電体素
材３の片面にグランドプレーン２となる銅の薄板を接着
剤等を塗布し圧力をかけ圧接する。さらに、この高誘電
体素材のもう一方の面に放射器４となる銅の薄板を接着
剤等を塗布し圧力をかけ圧接し、両面銅箔基板様に製作
するや前述の共振寸法計算式により放射器の寸法を求め
、フォトエツチング法等により該両面銅箔基板の放射器
面を仕上げ、放射器４を製作する。尚、誘電体の両面に
銅のｇｔ板を圧接するかわりに、該誘電体の両面を電解
メツキ法等により両面銅箔基板様の導体面を製作する方
法も可能である。無線機器より伝送路を接続するための
コネクター１、または同軸ケーブル１ａの外装部をグラ
ンドプレーン２に半田等で固着する。コネクター１、ま
たは同軸ケーブル１ａの芯線はグランドプレーン２より
絶縁し、高誘電率の誘電体３を貫通して放射器４のイン
ピーダンス整合点に半田等で接合され、また、別な手法
として、第２図に示すように前述のフォトエツチング法
等により放射器を製作と同時に、放射器と同一平面に、
放射器端面と誘電体３の端面３ａの間にインピーダンス
整合の計算式：Ｚ−膳−Ｚｉ（Ｚ：整合インピーダンス
、ＺＯ：アンテナインピーダンス、Ｚｉ：接続伝送路イ
ンピーダンス）、Ｌ−実効波長／４で求められるＱマツ
チ整合回路５を設け、無線機器より伝送路を接続するた
めのコネクター１、または同軸ケーブル１ａを、Ｑマツ
チ整合回路５を設けた近傍のアンテナ側面に配置し、外
装部を裏面のグランドブレーン２に、芯線をＱマツチ整
合回路の一端に半田等で固着する。(Example) An example of the present invention will be described below based on the drawings. Fig. 1 is a cross-sectional view related to the present invention, in which a thin copper plate serving as a ground plane 2 is placed on one side of a high dielectric material 3. Apply adhesive, etc., and apply pressure to bond.Furthermore, on the other side of this high dielectric material, apply adhesive, etc. to a thin copper plate that will become the radiator 4, and apply pressure to bond it, forming a double-sided copper foil board. After manufacturing the radiator as shown in FIG. Instead of pressure-welding a copper GT plate, it is also possible to fabricate a conductor surface similar to a double-sided copper foil board by electrolytic plating or the like on both sides of the dielectric.Connector 1 for connecting a transmission path from a wireless device , or fix the exterior part of the coaxial cable 1a to the ground plane 2 with solder or the like.The connector 1 or the core wire of the coaxial cable 1a is insulated from the ground plane 2, passes through the high dielectric constant dielectric 3, and connects to the radiator 4. As another method, as shown in Fig. 2, the radiator is manufactured by the photo-etching method described above, and at the same time, the radiator is bonded to the impedance matching point of the
Calculation formula for impedance matching between the radiator end face and the end face 3a of the dielectric 3: Z-Zen-Zi (Z: matching impedance, ZO: antenna impedance, Zi: connection transmission line impedance), L-effective wavelength/4 The required Q-match matching circuit 5 is provided, and the connector 1 or coaxial cable 1a for connecting the transmission line from the wireless device is placed on the side of the antenna near where the Q-match matching circuit 5 is provided, and the exterior part is placed on the back side. A core wire is fixed to one end of the Q-match matching circuit on the ground brain 2 with solder or the like.
以上のような実施において、高誘電率の誘電体を用いる
事により、低誘電率の誘電体を使用して製作した平面パ
ッチアンテナに比較して１７４〜１／２の寸法となる超
小型な平面パッチアンテナを実現し、ＩＣカード、小型
携帯無線機器、その地熱線機等、実装上超小型化が必要
な機器に平面パッチアンテナを実装可能とした。さらに
、前述の１７４λ型平面パッチアンテナに同様の手法を
用いるとさらに超小型化が可能なことは言うまでもない
。In the implementation described above, by using a dielectric material with a high dielectric constant, an ultra-small planar antenna whose size is 174 to 1/2 that of a planar patch antenna fabricated using a dielectric material with a low dielectric constant is created. By realizing a patch antenna, we have made it possible to mount a planar patch antenna on devices that require ultra-miniaturization, such as IC cards, small portable wireless devices, and geothermal wire devices. Furthermore, it goes without saying that the above-described 174λ type planar patch antenna can be further miniaturized by using a similar method.
この発明は以上説明したように、放射器、誘電体、グラ
ンドブレーンからなる平面パンチアンテナにおいて、高
誘電率誘電体、例えば、セラミック誘電体（εｒ−２４
〜３６、又はそれ以上）を用いる事により低誘電率誘電
体で製作した平面パッチアンテナに比較して１７４〜１
／２の寸法となる超小型な平面パッチアンテナの実現を
可能とし、さらに、高誘電率誘電体を用い１／４ λ型
子面パッチアンテナを製作する手法によってもより超小
型化が可能となる。超小型化平面パッチアンテナをＩＣ
カード、小型携帯無線機器、その地熱線機等、実装上ア
ンテナに超小型化が必要な機器に組み込む事により、各
種無線機器をさらに小型化することに効果がある。また
、将来的に、ある周波数帯を使用する腕時計型環無線機
に平面パッチアンテナ組み込むことも可能となる。As explained above, the present invention is applicable to a planar punch antenna consisting of a radiator, a dielectric, and a ground plane, in which a high permittivity dielectric, such as a ceramic dielectric (εr-24
174 to 1 compared to a planar patch antenna fabricated with a low-permittivity dielectric.
It is possible to realize an ultra-compact planar patch antenna with dimensions of /2, and even further miniaturization is possible by using a method of manufacturing a 1/4 λ type surface patch antenna using a dielectric with a high permittivity. . IC for ultra-compact planar patch antenna
By incorporating it into devices such as cards, small portable wireless devices, and geothermal wire devices that require ultra-miniaturized antennas for mounting, it is effective in further miniaturizing various wireless devices. In the future, it will also be possible to incorporate a planar patch antenna into a wristwatch-type ring radio that uses a certain frequency band.
第１図は本発明にかかる超小型パッチアンテナの断面図
、第２図はＱマツチ整合回路を設けた平面図である。
１・・・・コネクター
１ａ・・・同軸ケーブル
２・・・・グランドブレーン
３・・・・誘電体
４・・・・放射器
以上
３持斃漆
出願人 セイコー電子工業株式会社
代理人 弁理士 林 敬 之 肋木発明１５係る
超小型パラ壬アンテナの断面図第１図
Ｑマツチ整合回路を“Ｕけｆ二千■閃
第２図FIG. 1 is a cross-sectional view of an ultra-small patch antenna according to the present invention, and FIG. 2 is a plan view in which a Q-match matching circuit is provided. 1...Connector 1a...Coaxial cable 2...Ground brain 3...Dielectric 4...Radiator and above 3 Mochio Lacquer Applicant Seiko Electronic Industries Co., Ltd. Agent Patent attorney Hayashi Takayuki A cross-sectional view of an ultra-small parasitic antenna according to Invention No. 15. Figure 1.
Claims (1)
アンテナにおいて、該誘電体に高誘電率の誘電体を用い
る事により超小型化を可能とした超小型平面パッチアン
テナ。An ultra-compact planar patch antenna consisting of a radiator, a dielectric, and a ground plane, which can be miniaturized by using a dielectric with a high dielectric constant as the dielectric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30437088A JPH02150101A (en) | 1988-12-01 | 1988-12-01 | Microplane patch antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30437088A JPH02150101A (en) | 1988-12-01 | 1988-12-01 | Microplane patch antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02150101A true JPH02150101A (en) | 1990-06-08 |
Family
ID=17932205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30437088A Pending JPH02150101A (en) | 1988-12-01 | 1988-12-01 | Microplane patch antenna |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02150101A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2684235A1 (en) * | 1991-11-25 | 1993-05-28 | Gemplus Card Int | INTEGRATED CIRCUIT CARD COMPRISING MEANS OF PROTECTING THE INTEGRATED CIRCUIT. |
| JPH05166018A (en) * | 1991-12-12 | 1993-07-02 | Fujitsu Ltd | Non-contact ic card |
| EP0734063A3 (en) * | 1991-02-19 | 1997-01-29 | Gemplus Card Int | Integrated circuit micromodule obtained by continuous assembly of patterned strips |
| JPH09232856A (en) * | 1996-02-22 | 1997-09-05 | Matsushita Electric Ind Co Ltd | Planar antenna |
| EP1195845A2 (en) * | 2000-10-09 | 2002-04-10 | Philips Corporate Intellectual Property GmbH | Miniaturised microwave antenna |
| KR100372727B1 (en) * | 1994-06-28 | 2003-05-23 | 소니 케미카루 가부시키가이샤 | Antenna for short distance communication and its manufacture and use |
| US7741999B2 (en) | 2006-06-15 | 2010-06-22 | Kathrein-Werke Kg | Multilayer antenna of planar construction |
| US7821460B2 (en) | 2006-08-17 | 2010-10-26 | Kathrein-Werke Kg | Tunable patch antenna of planar construction |
-
1988
- 1988-12-01 JP JP30437088A patent/JPH02150101A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0734063A3 (en) * | 1991-02-19 | 1997-01-29 | Gemplus Card Int | Integrated circuit micromodule obtained by continuous assembly of patterned strips |
| FR2684235A1 (en) * | 1991-11-25 | 1993-05-28 | Gemplus Card Int | INTEGRATED CIRCUIT CARD COMPRISING MEANS OF PROTECTING THE INTEGRATED CIRCUIT. |
| JPH05166018A (en) * | 1991-12-12 | 1993-07-02 | Fujitsu Ltd | Non-contact ic card |
| KR100372727B1 (en) * | 1994-06-28 | 2003-05-23 | 소니 케미카루 가부시키가이샤 | Antenna for short distance communication and its manufacture and use |
| JPH09232856A (en) * | 1996-02-22 | 1997-09-05 | Matsushita Electric Ind Co Ltd | Planar antenna |
| EP1195845A2 (en) * | 2000-10-09 | 2002-04-10 | Philips Corporate Intellectual Property GmbH | Miniaturised microwave antenna |
| EP1195845A3 (en) * | 2000-10-09 | 2004-01-02 | Philips Intellectual Property & Standards GmbH | Miniaturised microwave antenna |
| US7741999B2 (en) | 2006-06-15 | 2010-06-22 | Kathrein-Werke Kg | Multilayer antenna of planar construction |
| US7821460B2 (en) | 2006-08-17 | 2010-10-26 | Kathrein-Werke Kg | Tunable patch antenna of planar construction |
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