JPH02147223A - Method for temperature control of mold clamping apparatus and device thereof - Google Patents
Method for temperature control of mold clamping apparatus and device thereofInfo
- Publication number
- JPH02147223A JPH02147223A JP6488689A JP6488689A JPH02147223A JP H02147223 A JPH02147223 A JP H02147223A JP 6488689 A JP6488689 A JP 6488689A JP 6488689 A JP6488689 A JP 6488689A JP H02147223 A JPH02147223 A JP H02147223A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- cooling medium
- die
- mold clamping
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000002826 coolant Substances 0.000 claims abstract description 31
- 238000001746 injection moulding Methods 0.000 claims description 5
- 238000004512 die casting Methods 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
く産業上の利用分野〉
本発明は射出成形機やダイカスト機の型締装置における
温度調整方法およびその装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a temperature adjustment method and device for a mold clamping device of an injection molding machine or a die casting machine.
〈従来装置〉
射出成形機を例に採シ説明すると、第５図に示すように
高温になる金型ｌおよび２は直接か或いは断熱板３およ
び４を介してダイプレート５および６に取付である。<Conventional device> Taking an injection molding machine as an example, as shown in FIG. be.
〈発明が解決しようとする課題〉
金型１および２が高温になると断熱板３および４がある
場合でも、ダイプレート５および６やタイバー７に熱が
伝わシ、ダイプレート５および６やタイバーが熱変形し
、温度変化によるダイプレート５および６同志の平行度
、タイバー７の寸法変化等影響は型締装置全体に及び、
型締装置全体の精度を不安定にし、製品の成形に悪影響
を与えている。<Problems to be Solved by the Invention> When the molds 1 and 2 reach high temperatures, even if there are heat insulating plates 3 and 4, the heat is transferred to the die plates 5 and 6 and the tie bars 7, and the die plates 5 and 6 and the tie bars are damaged. Thermal deformation and temperature changes affect the entire mold clamping device, such as the parallelism of die plates 5 and 6 and dimensional changes in tie bars 7.
This makes the accuracy of the entire mold clamping device unstable and has a negative impact on product molding.
本発明は前述の欠点を取除き、金型が温度変化してもダ
イプレートやタイバーが一定温度に制御され、型締装置
の精度が安定するようなダイプレートの温度調整方法お
よびその装置を提供することを目的とする。The present invention eliminates the above-mentioned drawbacks and provides a method and device for adjusting the temperature of a die plate, in which the die plate and tie bars are controlled to a constant temperature even when the temperature of the mold changes, and the precision of the mold clamping device is stabilized. The purpose is to
く課題を解決するための手段〉
前述の目的を達成するため、本発明は型締シリンダと固
定ダイプレートの間をタイバーで結び、その中間に設け
た移動ダイプレートを型締シリンダによりタイパーを案
内として進退させ、固定・移動の両ダイプレートに夫々
取付た金型の開閉を行う射出成形機或いはダイカスト機
の型締装置の温度調整方法であって、前記タイバー、両
ダイプレートおよび金型と各ダイプレートの間に設けた
温度調整板内部に孔を設け、温度管理した冷却媒体を夫
々貫流させることを特徴とする型締装置の温度調整方法
とした。また前記各金型とダイプレートの間に夫々設け
た金型に接する断熱体と予め温度管理された冷却媒体を
貫流させる温度調整板と、冷却媒体源と温度調整板の間
を結ぶ冷却媒体用の配管と、両ダイプレートに夫々設け
た温度検出を行う温度センサと、予めダイプレートの設
定値として温度設定しておく温度設定装置と、前記温度
センサによる検出値と温度設定装置に設定した温度とを
比較し、その偏差を零にするよう演算を行い電気信号を
発する比較器と、前記比較器からの電気信号によりその
開度を調節し、温度調整板を貫流させる冷却媒体の量を
調節する配管中に設けた流量調節弁とから成り、前記請
求項１）に記載する方法を行うための型締装置の温度調
整装置とし、更に前記温度調整板に代えて、移動・固定
の両ダイプレートとすることを特徴とする請求求項２）
記載の型締装置の温度調整装置とし、前記温度調整板に
代えて、タイバーとすることを特徴とする前記請求項２
）記載の型締装置の温度調整装置とした。Means for Solving the Problems> In order to achieve the above-mentioned object, the present invention connects a mold clamping cylinder and a fixed die plate with a tie bar, and guides a tieper with a movable die plate provided in the middle by the mold clamping cylinder. A method for adjusting the temperature of a mold clamping device of an injection molding machine or a die casting machine, in which the mold clamping device of an injection molding machine or a die casting machine is moved forward and backward to open and close molds attached to fixed and movable die plates, respectively. A method for adjusting the temperature of a mold clamping device is characterized in that holes are provided inside the temperature adjusting plates provided between the die plates, and a temperature-controlled cooling medium is allowed to flow through each hole. In addition, a heat insulator in contact with the mold is provided between each of the molds and the die plate, a temperature adjustment plate through which a pre-temperature-controlled cooling medium flows, and cooling medium piping connecting between the cooling medium source and the temperature adjustment plate. , a temperature sensor for detecting temperature provided on each die plate, a temperature setting device that sets the temperature in advance as a set value of the die plate, and a value detected by the temperature sensor and the temperature set in the temperature setting device. A comparator that performs calculations to make the deviation zero and emits an electrical signal; and piping that adjusts its opening degree based on the electrical signal from the comparator and adjusts the amount of cooling medium flowing through the temperature adjustment plate. and a flow rate control valve provided therein, as a temperature control device for a mold clamping device for carrying out the method described in claim 1), and furthermore, in place of the temperature control plate, both movable and fixed die plates are provided. Claim 2)
The temperature adjusting device of the mold clamping device according to claim 2, characterized in that the temperature adjusting plate is replaced by a tie bar.
) was used as a temperature adjustment device for the mold clamping device.
く実施例〉
次に本発明の１実施例を金型とダイプレートの間に設け
た温度調整板を例に採り、第１図および第２図により説
明すると、１ｌは固定金型１２を取付た固定ダイプレー
トである。１３は移動ダイプレートで移動金型１４を取
付てある。両金型１２および１４と両ダイプレート１１
および１３との間には夫々金型に接して断熱板１５およ
び１６と、温度調整板１７および１８が設けておる。前
記温度調整板１７および１８には第２図に示すように貫
流孔１９および２０が設けてあり、温度管理された冷却
媒体が配管２１より質流するようになっている。前記配
管２１は冷却媒体源２２と温度調整板１７および１８を
結んでいて、冷却媒体の流量を調整する流量調整弁２３
および２４が設けてある。２５および２６は夫々ダイプ
レート１１およびｌ３に設けた温度検出用のセンサであ
る。２７および２８は予めダイプレートの設定値として
温度設定しておく温度設定装置である。２９および３０
は比較器で前記温度センサ２５および２６で検出した温
度値ＴＦと、予め設定装置２７および２８に設定した温
度値Ｔｓとを比較し、その偏差（ ＴＰ Ｔｌ１ ）
＝ ０となるように制御量を電気信号に変換し、増巾
器３１および３２を介して前記流量調整弁２３および２
４に夫々作用し、流量調整弁２３および２４のその開度
を制御し、冷却媒体の流量を制御するようになりている
０次にタイバーに冷却媒体を貫流させる実施例について
第３図および第４図により説明する。説明に当り、前実
施例で説明した部材は同一番号を付し、説明を省略し、
本実施で新に用いた部材のみ新番号を付し、説明を行う
。４０はタイバーで型締シリンダ４１と固定ダイプレー
ト１１の間を結んでおり、両端部はタイバーナツト４２
により締付である。Embodiment> Next, an embodiment of the present invention will be explained using FIGS. 1 and 2, taking as an example a temperature regulating plate provided between a mold and a die plate. This is a fixed die plate. Reference numeral 13 denotes a movable die plate to which a movable die 14 is attached. Both molds 12 and 14 and both die plates 11
Insulating plates 15 and 16 and temperature adjusting plates 17 and 18 are provided between the molds and 13, respectively, in contact with the mold. The temperature adjustment plates 17 and 18 are provided with flow holes 19 and 20, as shown in FIG. 2, so that a temperature-controlled cooling medium flows through the piping 21. The pipe 21 connects the cooling medium source 22 and the temperature adjustment plates 17 and 18, and has a flow rate adjustment valve 23 that adjusts the flow rate of the cooling medium.
and 24 are provided. 25 and 26 are temperature detection sensors provided on the die plates 11 and l3, respectively. Reference numerals 27 and 28 are temperature setting devices that set the temperature in advance as a set value for the die plate. 29 and 30
The comparator compares the temperature value TF detected by the temperature sensors 25 and 26 with the temperature value Ts set in advance in the setting devices 27 and 28, and calculates the deviation (TP Tl1 ).
The control amount is converted into an electric signal such that
FIGS. 3 and 3 show an embodiment in which the cooling medium flows through the zero-order tie bars, which act on the flow rate regulating valves 23 and 24, respectively, to control the opening degrees of the flow rate regulating valves 23 and 24, and thereby control the flow rate of the cooling medium. This will be explained with reference to Figure 4. In the explanation, the members explained in the previous example are given the same numbers and the explanation is omitted.
Only the members newly used in this implementation will be given new numbers and explained. A tie bar 40 connects the mold clamping cylinder 41 and the fixed die plate 11, and both ends are tied with tie bar nuts 42.
It is tightened by
前記タイバー４０には中心部に貫通孔４３が設け′Ｃあ
シ、図示してない冷却媒体源からの配管４４および４５
が両端部に連結されている。従って冷却媒体源から供給
される冷却媒体は、矢印ａのように配管４４から貫通孔
４３、続いて配管４５を通シ冷却媒体源へ戻るようにな
っている。４６は温度センサでタイバー４０の温度を検
知するものである。これはタイバー４０に限らず、前実
施例のようにダイプレート１１又は１３に取付ても良い
。４７は比較器で温度設定装置４８に設定しておくタイ
バー４０又はダイプレート１１および１３の温度と温度
センサ４６からの検知温度を比較し、その偏差を零とす
るような電気信号を増巾器４９を介して流量調整弁５０
に送り、同流量調整弁５０の開度を制御し、配管４４を
通る冷却媒体の流量を制御するものである。The tie bar 40 is provided with a through hole 43 in the center thereof, and pipes 44 and 45 from a cooling medium source (not shown) are provided.
are connected to both ends. Therefore, the coolant supplied from the coolant source returns to the coolant source from the pipe 44 through the through hole 43 and then through the pipe 45 as indicated by arrow a. A temperature sensor 46 detects the temperature of the tie bar 40. This is not limited to the tie bar 40, but may be attached to the die plate 11 or 13 as in the previous embodiment. 47 is a comparator that compares the temperature of the tie bar 40 or die plates 11 and 13 set in the temperature setting device 48 with the detected temperature from the temperature sensor 46, and sends an electric signal that makes the deviation to zero to an amplifier. Flow rate adjustment valve 50 via 49
The flow rate of the cooling medium passing through the pipe 44 is controlled by controlling the opening degree of the flow rate regulating valve 50.
前述の実施例においてはタイバーに貫通孔を設け、回礼
に冷却媒体を貫流させたが、これに限らず第４図のよう
にタイバー５１に行き止りの孔５２を設け、回礼５２に
回礼５２よシ細径の管５３を挿入し、矢印すのように冷
却媒体を管内に供給し、先端部で孔５２へ流出し、矢印
Ｃのように孔５２と管５３の外径面との間に形成された
隙間を介してタイバー５１の外部へ冷却媒体を排出する
ことも出来る。In the embodiment described above, through holes were provided in the tie bars to allow the cooling medium to flow through the loops, but the present invention is not limited to this, as shown in FIG. A small-diameter tube 53 is inserted, and a cooling medium is supplied into the tube as shown by the arrow C, flows out into the hole 52 at the tip, and is placed between the hole 52 and the outer diameter surface of the tube 53 as shown by the arrow C. The cooling medium can also be discharged to the outside of the tie bar 51 through the formed gap.
〈発明の効果〉
以上のように構成されているため、冷却媒体源からの冷
却媒体は温度調整板やタイバー内を貫流し、温度設定装
置に設定された温度となるように冷却媒体の流量を流量
調整弁が制御しているので、ダイプレートやタイバーは
金型の温度変化にもがかわらず常に一定温度に保たれ、
型締装置全体の精度も安定し、精密成形も可能となった
。<Effects of the Invention> With the above structure, the cooling medium from the cooling medium source flows through the temperature adjusting plate and the tie bar, and the flow rate of the cooling medium is adjusted to the temperature set in the temperature setting device. Since the flow rate adjustment valve controls the die plate and tie bars, they are always kept at a constant temperature despite changes in mold temperature.
The accuracy of the entire mold clamping device has become stable, and precision molding has become possible.
前述の実施例においては、温度調整板、タイバーについ
て温度制御する例を述たが、その他ダイプレート自身に
貫流孔を設け、前述の実施例のように制御は可能である
。In the above-mentioned embodiment, an example was described in which the temperature was controlled using the temperature adjustment plate and the tie bar, but it is also possible to provide through-holes in the die plate itself and perform the control as in the above-mentioned embodiment.
第１図は本発明の１実施例を示す図。第２図は第１図の
断面Ｉ−Ｉ図。第３図は本発明の他の実施例を示す図。
第４図はさらに他の実施例を示す図。第５図は従来例の
説明図。
１１・・・固定ダイプレート、１２・・・固定金型、１
３・・・移動ダイプレート、１４・・・移動金型、１５
．１６・・・断熱板、１７．１８・・・温度調整板、１
９．２０・・・貫流孔、２１．４４．４５・・・配管、
２３，２４．５０・・・流量調整弁、２５゜２６．４６
・・・温度検出用センサ、２７，２８．４８・・・温度
設定装置、２９，３０．４７・・・比較器、４０．５１
・・・タイバー４１・・・型締シリンダ、４３・・・貫
通孔、５２・・・孔、５３・・・管。FIG. 1 is a diagram showing one embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II in FIG. FIG. 3 is a diagram showing another embodiment of the present invention. FIG. 4 is a diagram showing still another embodiment. FIG. 5 is an explanatory diagram of a conventional example. 11... Fixed die plate, 12... Fixed mold, 1
3... Moving die plate, 14... Moving mold, 15
．． 16...Insulation board, 17.18...Temperature adjustment board, 1
9.20... Through hole, 21.44.45... Piping,
23,24.50...Flow rate adjustment valve, 25°26.46
...Temperature detection sensor, 27,28.48...Temperature setting device, 29,30.47...Comparator, 40.51
Tie bar 41 Mold clamping cylinder, 43 Through hole, 52 Hole, 53 Pipe.
Claims (1)
結び、その中間に設けた移動ダイプレートを型締シリン
ダによりタイバーを案内として進退させ、固定・移動の
両ダイプレートに夫々取付た金型の開閉を行う射出成形
機或いはダイカスト機の型締装置の温度調整方法であっ
て、前記タイバー、両ダイプレートおよび金型と各ダイ
プレートの間に設けた温度調整板内部に孔を設け、温度
管理した冷却媒体を夫々貫流させることを特徴とする型
締装置の温度調整方法。 ２）前記各金型とダイプレートの間に夫々設けた金型に
接する断熱体と予め温度管理された冷却媒体を貫流させ
る温度調整板と、冷却媒体源と温度調整板の間を結ぶ冷
却媒体用の配管と、両ダイプレートに夫々設けた温度検
出を行う温度センサと、予めダイプレートの設定値とし
て温度設定しておく温度設定装置と、前記温度センサに
よる検出値と温度設定装置に設定した温度とを比較し、
その偏差を零にするよう演算を行い電気信号を発する比
較器と、前記比較器からの電気信号によりその開度を調
節し、温度調整板を貫流させる冷却媒体の量を調節する
配管中に設けた流量調節弁とから成り、前記請求項１）
に記載する方法を行うための型締装置の温度調整装置。 ３）前記温度調整板に代えて、移動・固定の両ダイプレ
ートとすることを特徴とする前記請求項２）記載の型締
装置の温度調整装置。 ４）前記温度調整板に代えて、タイバーとすることを特
徴とする前記請求項２）記載の型締装置の温度調整装置
。[Claims] 1) A mold clamping cylinder and a fixed die plate are connected by a tie bar, and a movable die plate provided in the middle is moved forward and backward by the mold clamping cylinder using the tie bar as a guide, so that both fixed and movable die plates are connected. A method for adjusting the temperature of a mold clamping device of an injection molding machine or a die casting machine that opens and closes the molds attached thereto, the method comprising: controlling the temperature inside the tie bar, both die plates, and the temperature adjusting plate provided between the mold and each die plate; A method for adjusting the temperature of a mold clamping device, characterized by providing holes and allowing a temperature-controlled cooling medium to flow through each hole. 2) A heat insulator in contact with the mold provided between each of the molds and the die plate, a temperature adjustment plate through which a pre-temperature-controlled cooling medium flows, and a cooling medium connecting between the cooling medium source and the temperature adjustment plate. The piping, a temperature sensor that detects the temperature provided on each die plate, a temperature setting device that sets the temperature in advance as a set value of the die plate, and a value detected by the temperature sensor and the temperature set in the temperature setting device. Compare the
A comparator that performs calculations to make the deviation zero and emits an electric signal, and a comparator installed in the piping that adjusts its opening degree based on the electric signal from the comparator and adjusts the amount of cooling medium flowing through the temperature adjustment plate. Claim 1)
A temperature adjustment device for a mold clamping device for carrying out the method described in . 3) The temperature adjusting device for a mold clamping device according to claim 2, characterized in that the temperature adjusting plate is replaced by both a movable and a fixed die plate. 4) The temperature adjusting device for a mold clamping device according to claim 2, wherein a tie bar is used in place of the temperature adjusting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6488689A JPH02147223A (en) | 1988-07-18 | 1989-03-16 | Method for temperature control of mold clamping apparatus and device thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63-178684 | 1988-07-18 | ||
| JP17868488 | 1988-07-18 | ||
| JP6488689A JPH02147223A (en) | 1988-07-18 | 1989-03-16 | Method for temperature control of mold clamping apparatus and device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02147223A true JPH02147223A (en) | 1990-06-06 |
Family
ID=26406016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6488689A Pending JPH02147223A (en) | 1988-07-18 | 1989-03-16 | Method for temperature control of mold clamping apparatus and device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02147223A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002282667A (en) * | 2001-03-28 | 2002-10-02 | Nagase Kasei Kogyo Kk | Stirring apparatus |
| JP2006142647A (en) * | 2004-11-19 | 2006-06-08 | Sumitomo Heavy Ind Ltd | Mold clamping device |
| JP2008229884A (en) * | 2007-03-16 | 2008-10-02 | Nissei Plastics Ind Co | Mold clamping device of injection molding machine |
| TWI584934B (en) * | 2012-11-29 | 2017-06-01 | Sumitomo Heavy Industries | Injection molding machine |
Citations (1)
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|---|---|---|---|---|
| JPS6345018A (en) * | 1987-06-12 | 1988-02-26 | Toyo Mach & Metal Co Ltd | Piping structure of cooling water in injection molding machine |
-
1989
- 1989-03-16 JP JP6488689A patent/JPH02147223A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6345018A (en) * | 1987-06-12 | 1988-02-26 | Toyo Mach & Metal Co Ltd | Piping structure of cooling water in injection molding machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002282667A (en) * | 2001-03-28 | 2002-10-02 | Nagase Kasei Kogyo Kk | Stirring apparatus |
| JP2006142647A (en) * | 2004-11-19 | 2006-06-08 | Sumitomo Heavy Ind Ltd | Mold clamping device |
| JP2008229884A (en) * | 2007-03-16 | 2008-10-02 | Nissei Plastics Ind Co | Mold clamping device of injection molding machine |
| TWI584934B (en) * | 2012-11-29 | 2017-06-01 | Sumitomo Heavy Industries | Injection molding machine |
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