JPH02146918U - - Google Patents

Info

Publication number
JPH02146918U
JPH02146918U JP5685189U JP5685189U JPH02146918U JP H02146918 U JPH02146918 U JP H02146918U JP 5685189 U JP5685189 U JP 5685189U JP 5685189 U JP5685189 U JP 5685189U JP H02146918 U JPH02146918 U JP H02146918U
Authority
JP
Japan
Prior art keywords
annular
bellows
wiring
intermediate member
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5685189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5685189U priority Critical patent/JPH02146918U/ja
Publication of JPH02146918U publication Critical patent/JPH02146918U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Joints That Cut Off Fluids, And Hose Joints (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る配線用管継手の実施例を
示す縦断側面図、第2図はその分解斜視図、第3
図はその一部たるリングを示す正面図、第4図は
従来の配線用管継手を示す縦断側面図である。 1……配線用管、2……蛇腹管、2a……谷部
、3……環状コネクタ、4……環状袋ナツト、5
……パツキン、6……リング、M……中間部材。
Fig. 1 is a vertical cross-sectional side view showing an embodiment of the wiring pipe joint according to the present invention, Fig. 2 is an exploded perspective view thereof, and Fig. 3 is an exploded perspective view thereof.
The figure is a front view showing a ring which is a part of the ring, and FIG. 4 is a longitudinal sectional side view showing a conventional wiring pipe joint. 1... Wiring pipe, 2... Bellows pipe, 2a... Valley, 3... Annular connector, 4... Annular cap nut, 5
...Putskin, 6...Ring, M...Intermediate member.

Claims (1)

【実用新案登録請求の範囲】 配線用管1相互間に配置される伸縮吸収用の蛇
腹管2と、 該蛇腹管2の端部に前記配線用管1に個別に直
結された状態で配置される環状コネクタ3と、 該環状コネクタ3との螺合締結によつて前記蛇
腹管2の端部を中間部材Mを介して係止する環状
袋ナツト4とを備える配線用管継手であつて、 前記中間部材Mが、前記蛇腹管2端末に一端側
が接当し且つ他端面が前記環状コネクタ3側に接
当した状態で配置される円環状のパツキン5と、
前記蛇腹管2の端部の谷部2aに内周部が係入せ
しめられた状態で配置される二つ割円環状又はC
の字環状のリング6との組合わせからなる配線用
管継手。
[Claims for Utility Model Registration] A bellows pipe 2 for expansion/contraction absorption arranged between the wiring pipes 1; A wiring pipe joint comprising: an annular connector 3; and an annular cap nut 4 that locks the end of the bellows pipe 2 via an intermediate member M by screwing the annular connector 3 together. an annular packing 5 in which the intermediate member M is arranged with one end side in contact with the terminal of the bellows tube 2 and the other end side in contact with the annular connector 3 side;
A two-split annular or C shape whose inner circumference is inserted into the trough 2a at the end of the bellows tube 2.
A wiring pipe joint consisting of a combination with an annular ring 6.
JP5685189U 1989-05-16 1989-05-16 Pending JPH02146918U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5685189U JPH02146918U (en) 1989-05-16 1989-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5685189U JPH02146918U (en) 1989-05-16 1989-05-16

Publications (1)

Publication Number Publication Date
JPH02146918U true JPH02146918U (en) 1990-12-13

Family

ID=31581046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5685189U Pending JPH02146918U (en) 1989-05-16 1989-05-16

Country Status (1)

Country Link
JP (1) JPH02146918U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028413B2 (en) * 1975-12-09 1985-07-04 富士通株式会社 Semiconductor integrated circuit device
JPS6038018B2 (en) * 1976-06-21 1985-08-29 株式会社日立製作所 Reduced pressure heat treatment furnace for semiconductor wafers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028413B2 (en) * 1975-12-09 1985-07-04 富士通株式会社 Semiconductor integrated circuit device
JPS6038018B2 (en) * 1976-06-21 1985-08-29 株式会社日立製作所 Reduced pressure heat treatment furnace for semiconductor wafers

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