JPH02146870U - - Google Patents
Info
- Publication number
- JPH02146870U JPH02146870U JP5297489U JP5297489U JPH02146870U JP H02146870 U JPH02146870 U JP H02146870U JP 5297489 U JP5297489 U JP 5297489U JP 5297489 U JP5297489 U JP 5297489U JP H02146870 U JPH02146870 U JP H02146870U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- resist
- covered
- board
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5297489U JPH02146870U (hu) | 1989-05-10 | 1989-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5297489U JPH02146870U (hu) | 1989-05-10 | 1989-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146870U true JPH02146870U (hu) | 1990-12-13 |
Family
ID=31573749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5297489U Pending JPH02146870U (hu) | 1989-05-10 | 1989-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146870U (hu) |
-
1989
- 1989-05-10 JP JP5297489U patent/JPH02146870U/ja active Pending