JPH02146865U - - Google Patents
Info
- Publication number
- JPH02146865U JPH02146865U JP5259689U JP5259689U JPH02146865U JP H02146865 U JPH02146865 U JP H02146865U JP 5259689 U JP5259689 U JP 5259689U JP 5259689 U JP5259689 U JP 5259689U JP H02146865 U JPH02146865 U JP H02146865U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- printed circuit
- view
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5259689U JPH02146865U (enExample) | 1989-05-09 | 1989-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5259689U JPH02146865U (enExample) | 1989-05-09 | 1989-05-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146865U true JPH02146865U (enExample) | 1990-12-13 |
Family
ID=31573029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5259689U Pending JPH02146865U (enExample) | 1989-05-09 | 1989-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146865U (enExample) |
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1989
- 1989-05-09 JP JP5259689U patent/JPH02146865U/ja active Pending