JPH02146471U - - Google Patents

Info

Publication number

JPH02146471U

JPH02146471U JP5512489U JP5512489U JPH02146471U JP H02146471 U JPH02146471 U JP H02146471U JP 5512489 U JP5512489 U JP 5512489U JP 5512489 U JP5512489 U JP 5512489U JP H02146471 U JPH02146471 U JP H02146471U

Authority

JP

Japan

Prior art keywords

electronic component

copper foil

component mounting

mounting board

base film

Prior art date

1989-05-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
• 239000011889 copper foil Substances 0.000 claims description 4
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1