JPH02146435U - - Google Patents
Info
- Publication number
- JPH02146435U JPH02146435U JP1989056605U JP5660589U JPH02146435U JP H02146435 U JPH02146435 U JP H02146435U JP 1989056605 U JP1989056605 U JP 1989056605U JP 5660589 U JP5660589 U JP 5660589U JP H02146435 U JPH02146435 U JP H02146435U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- constant thickness
- semiconductor
- semiconductor pellets
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056605U JPH02146435U (enExample) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056605U JPH02146435U (enExample) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146435U true JPH02146435U (enExample) | 1990-12-12 |
Family
ID=31580582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989056605U Pending JPH02146435U (enExample) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146435U (enExample) |
-
1989
- 1989-05-16 JP JP1989056605U patent/JPH02146435U/ja active Pending