JPH02142572U - - Google Patents
Info
- Publication number
- JPH02142572U JPH02142572U JP5160589U JP5160589U JPH02142572U JP H02142572 U JPH02142572 U JP H02142572U JP 5160589 U JP5160589 U JP 5160589U JP 5160589 U JP5160589 U JP 5160589U JP H02142572 U JPH02142572 U JP H02142572U
- Authority
- JP
- Japan
- Prior art keywords
- board
- copper foil
- base
- wiring
- fixing hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5160589U JPH02142572U (en, 2012) | 1989-05-02 | 1989-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5160589U JPH02142572U (en, 2012) | 1989-05-02 | 1989-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142572U true JPH02142572U (en, 2012) | 1990-12-04 |
Family
ID=31571187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5160589U Pending JPH02142572U (en, 2012) | 1989-05-02 | 1989-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142572U (en, 2012) |
-
1989
- 1989-05-02 JP JP5160589U patent/JPH02142572U/ja active Pending