JPH02142517U - - Google Patents
Info
- Publication number
- JPH02142517U JPH02142517U JP5219489U JP5219489U JPH02142517U JP H02142517 U JPH02142517 U JP H02142517U JP 5219489 U JP5219489 U JP 5219489U JP 5219489 U JP5219489 U JP 5219489U JP H02142517 U JPH02142517 U JP H02142517U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- thickness
- capacitor
- metal terminals
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000003985 ceramic capacitor Substances 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は本考案に係るセラミツクコンデンサの
側断面図、第２図は同コンデンサのインパルス破
壊電圧特性を示す特性図である。
１……セラミツク素体、２，３……電極層、４
，５……金属端子、６，７……半田層。
FIG. 1 is a side sectional view of a ceramic capacitor according to the present invention, and FIG. 2 is a characteristic diagram showing the impulse breakdown voltage characteristics of the same capacitor. 1... Ceramic element body, 2, 3... Electrode layer, 4
, 5... Metal terminal, 6, 7... Solder layer.
Claims (1)
両面に形成する電極層２，３と、セラミツク素体
１の大きさに対して所定の直径、厚みを有する金
属端子４，５と、この金属端子４，５を各電極層
２，３に固着する半田層６，７とを備えるセラミ
ツクコンデンサにおいて、上記半田層６，７の厚
みを０．０７〜０．２３mmに設定したことを特徴
とするセラミツクコンデンサ。 A ceramic body 1, electrode layers 2 and 3 formed on both sides of the ceramic body 1, metal terminals 4 and 5 having a predetermined diameter and thickness with respect to the size of the ceramic body 1, and the metal terminals. A ceramic capacitor comprising solder layers 6 and 7 for fixing 4 and 5 to each electrode layer 2 and 3, characterized in that the thickness of the solder layers 6 and 7 is set to 0.07 to 0.23 mm. capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5219489U JPH02142517U (en) | 1989-05-02 | 1989-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5219489U JPH02142517U (en) | 1989-05-02 | 1989-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142517U true JPH02142517U (en) | 1990-12-04 |
Family
ID=31572295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5219489U Pending JPH02142517U (en) | 1989-05-02 | 1989-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142517U (en) |
-
1989
- 1989-05-02 JP JP5219489U patent/JPH02142517U/ja active Pending