JPH02141046U - - Google Patents
Info
- Publication number
- JPH02141046U JPH02141046U JP4871889U JP4871889U JPH02141046U JP H02141046 U JPH02141046 U JP H02141046U JP 4871889 U JP4871889 U JP 4871889U JP 4871889 U JP4871889 U JP 4871889U JP H02141046 U JPH02141046 U JP H02141046U
- Authority
- JP
- Japan
- Prior art keywords
- flooring material
- wooden flooring
- pasting
- back side
- soundproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 238000009408 flooring Methods 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims 1
Landscapes
- Floor Finish (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4871889U JPH02141046U (cs) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4871889U JPH02141046U (cs) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02141046U true JPH02141046U (cs) | 1990-11-27 |
Family
ID=31565783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4871889U Pending JPH02141046U (cs) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02141046U (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101276525B1 (ko) * | 2010-03-15 | 2013-06-18 | (주)엘지하우시스 | 우드 칩 인레이드와 인쇄 복합구조를 갖는 ｐｌａ 바닥재 |
| KR101286339B1 (ko) * | 2010-03-15 | 2013-07-15 | (주)엘지하우시스 | Ｐｌａ 수지를 사용한 우드 칩 인레이드 바닥재 |
-
1989
- 1989-04-25 JP JP4871889U patent/JPH02141046U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101276525B1 (ko) * | 2010-03-15 | 2013-06-18 | (주)엘지하우시스 | 우드 칩 인레이드와 인쇄 복합구조를 갖는 ｐｌａ 바닥재 |
| KR101286339B1 (ko) * | 2010-03-15 | 2013-07-15 | (주)엘지하우시스 | Ｐｌａ 수지를 사용한 우드 칩 인레이드 바닥재 |