JPH02140847U - - Google Patents

Info

Publication number
JPH02140847U
JPH02140847U JP5130789U JP5130789U JPH02140847U JP H02140847 U JPH02140847 U JP H02140847U JP 5130789 U JP5130789 U JP 5130789U JP 5130789 U JP5130789 U JP 5130789U JP H02140847 U JPH02140847 U JP H02140847U
Authority
JP
Japan
Prior art keywords
wire
bonding tool
hole
pressurizing
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5130789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5130789U priority Critical patent/JPH02140847U/ja
Publication of JPH02140847U publication Critical patent/JPH02140847U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary

Landscapes

  • Wire Bonding (AREA)
JP5130789U 1989-04-27 1989-04-27 Pending JPH02140847U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5130789U JPH02140847U (fr) 1989-04-27 1989-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5130789U JPH02140847U (fr) 1989-04-27 1989-04-27

Publications (1)

Publication Number Publication Date
JPH02140847U true JPH02140847U (fr) 1990-11-26

Family

ID=31570630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5130789U Pending JPH02140847U (fr) 1989-04-27 1989-04-27

Country Status (1)

Country Link
JP (1) JPH02140847U (fr)

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