JPH02138461U - - Google Patents
Info
- Publication number
- JPH02138461U JPH02138461U JP4710789U JP4710789U JPH02138461U JP H02138461 U JPH02138461 U JP H02138461U JP 4710789 U JP4710789 U JP 4710789U JP 4710789 U JP4710789 U JP 4710789U JP H02138461 U JPH02138461 U JP H02138461U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- chip components
- wiring board
- printed wiring
- mounting chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4710789U JPH02138461U (de) | 1989-04-20 | 1989-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4710789U JPH02138461U (de) | 1989-04-20 | 1989-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138461U true JPH02138461U (de) | 1990-11-19 |
Family
ID=31562753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4710789U Pending JPH02138461U (de) | 1989-04-20 | 1989-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138461U (de) |
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1989
- 1989-04-20 JP JP4710789U patent/JPH02138461U/ja active Pending