JPH02138457U - - Google Patents

Info

Publication number

JPH02138457U

JPH02138457U JP4773189U JP4773189U JPH02138457U JP H02138457 U JPH02138457 U JP H02138457U JP 4773189 U JP4773189 U JP 4773189U JP 4773189 U JP4773189 U JP 4773189U JP H02138457 U JPH02138457 U JP H02138457U

Authority

JP

Japan

Prior art keywords

molded

circuit board

terminal block

resin substrate

terminal

Prior art date

1989-04-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 3
• 239000011347 resin Substances 0.000 claims description 3
• 229920005989 resin Polymers 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims 2
• 238000005476 soldering Methods 0.000 description 1