JPH02137721U - - Google Patents
Info
- Publication number
- JPH02137721U JPH02137721U JP4619889U JP4619889U JPH02137721U JP H02137721 U JPH02137721 U JP H02137721U JP 4619889 U JP4619889 U JP 4619889U JP 4619889 U JP4619889 U JP 4619889U JP H02137721 U JPH02137721 U JP H02137721U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- member made
- slider member
- wafer
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Description
第１図及び第２図は本考案の実施例の説明図で
、第１図は複数の摺動子を連結した第１のフープ
材と、複数の端子を連結した第２のフープ材との
接合手段を示す分解斜視図、第２図は接触片をイ
ンサート成形したウエハーの斜視図、第３図及び
第４図は従来例の説明図で、第３図は複数の接触
片を連結したフープ材の斜視図、第４図は接触片
をインサート成形したウエハーの斜視図である。
１０……摺動子、１１……第１のフープ材（摺動
子部材）、１５……取付孔、１６……取付部、１
７……端子、１８……第２のフープ材（端子部材
）、２１……突出し、２２……取付部、２３……
ウエハー、２４……接触片。
1 and 2 are explanatory diagrams of an embodiment of the present invention, and FIG. 1 shows a first hoop material connecting a plurality of sliders and a second hoop material connecting a plurality of terminals. FIG. 2 is a perspective view of a wafer with insert molded contact pieces; FIGS. 3 and 4 are explanatory diagrams of conventional examples; and FIG. 3 is a hoop in which a plurality of contact pieces are connected. FIG. 4 is a perspective view of a wafer on which a contact piece is insert-molded.
10... Slider, 11... First hoop material (slider member), 15... Mounting hole, 16... Mounting part, 1
7...Terminal, 18...Second hoop material (terminal member), 21...Protrusion, 22...Mounting portion, 23...
Wafer, 24... contact piece.
Claims (1)
摺動子部材より板厚の厚い金属板より成る端子部
材とを位置決め手段を介して接合し、その接合部
分をインサート成形してウエハーを形成したこと
を特徴とするスイツチ。 A slider member made of a thin metal plate and a terminal member made of a metal plate thicker than the slider member are joined via a positioning means, and the joined part is insert molded to form a wafer. A switch characterized by having been formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4619889U JPH02137721U (en) | 1989-04-21 | 1989-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4619889U JPH02137721U (en) | 1989-04-21 | 1989-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137721U true JPH02137721U (en) | 1990-11-16 |
Family
ID=31561067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4619889U Pending JPH02137721U (en) | 1989-04-21 | 1989-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137721U (en) |
-
1989
- 1989-04-21 JP JP4619889U patent/JPH02137721U/ja active Pending
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