JPH0213746U - - Google Patents
Info
- Publication number
- JPH0213746U JPH0213746U JP9229288U JP9229288U JPH0213746U JP H0213746 U JPH0213746 U JP H0213746U JP 9229288 U JP9229288 U JP 9229288U JP 9229288 U JP9229288 U JP 9229288U JP H0213746 U JPH0213746 U JP H0213746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- lead frame
- lead
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000005452 bending Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9229288U JPH0213746U (fr) | 1988-07-11 | 1988-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9229288U JPH0213746U (fr) | 1988-07-11 | 1988-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213746U true JPH0213746U (fr) | 1990-01-29 |
Family
ID=31316739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9229288U Pending JPH0213746U (fr) | 1988-07-11 | 1988-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213746U (fr) |
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1988
- 1988-07-11 JP JP9229288U patent/JPH0213746U/ja active Pending