JPH02136351U - - Google Patents

Info

Publication number

JPH02136351U

JPH02136351U JP4636989U JP4636989U JPH02136351U JP H02136351 U JPH02136351 U JP H02136351U JP 4636989 U JP4636989 U JP 4636989U JP 4636989 U JP4636989 U JP 4636989U JP H02136351 U JPH02136351 U JP H02136351U

Authority

JP

Japan

Prior art keywords

motherboard

circuit board

printed circuit

aluminum

connection

Prior art date

1989-04-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
• 229910052782 aluminium Inorganic materials 0.000 claims description 6
• 230000003014 reinforcing effect Effects 0.000 claims description 3
• 238000005476 soldering Methods 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1