JPH02136330U - - Google Patents
Info
- Publication number
- JPH02136330U JPH02136330U JP4492589U JP4492589U JPH02136330U JP H02136330 U JPH02136330 U JP H02136330U JP 4492589 U JP4492589 U JP 4492589U JP 4492589 U JP4492589 U JP 4492589U JP H02136330 U JPH02136330 U JP H02136330U
- Authority
- JP
- Japan
- Prior art keywords
- cassette storage
- cassette
- sealing material
- pod
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003566 sealing material Substances 0.000 claims 2
- 239000004743 Polypropylene Substances 0.000 claims 1
- -1 polypropylene Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4492589U JP2509914Y2 (ja) | 1989-04-17 | 1989-04-17 | カセット収納ポッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4492589U JP2509914Y2 (ja) | 1989-04-17 | 1989-04-17 | カセット収納ポッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02136330U true JPH02136330U (me) | 1990-11-14 |
JP2509914Y2 JP2509914Y2 (ja) | 1996-09-04 |
Family
ID=31558657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4492589U Expired - Fee Related JP2509914Y2 (ja) | 1989-04-17 | 1989-04-17 | カセット収納ポッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2509914Y2 (me) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311536A (ja) * | 2006-05-18 | 2007-11-29 | Covalent Materials Corp | 半導体装置の製造方法、半導体基板の製造方法および半導体基板 |
-
1989
- 1989-04-17 JP JP4492589U patent/JP2509914Y2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311536A (ja) * | 2006-05-18 | 2007-11-29 | Covalent Materials Corp | 半導体装置の製造方法、半導体基板の製造方法および半導体基板 |
Also Published As
Publication number | Publication date |
---|---|
JP2509914Y2 (ja) | 1996-09-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |