JPH02135904U - - Google Patents
Info
- Publication number
- JPH02135904U JPH02135904U JP4325489U JP4325489U JPH02135904U JP H02135904 U JPH02135904 U JP H02135904U JP 4325489 U JP4325489 U JP 4325489U JP 4325489 U JP4325489 U JP 4325489U JP H02135904 U JPH02135904 U JP H02135904U
- Authority
- JP
- Japan
- Prior art keywords
- magnetic head
- lead wire
- insulating tube
- grounded
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Description
第１図は本考案に係る磁気ヘツドに接続された
リード線の絶縁チユーブの一実施例を示す斜視図
、第２図は磁気ヘツド支持構造を示す平面図、第
３図は従来の絶縁チユーブを示す斜視図である。
１……磁気ヘツド、３……磁気ヘツドコア、４
……リード線、７……絶縁チユーブ、８……内層
、９……外層、１０……中間層。
Fig. 1 is a perspective view showing an embodiment of an insulating tube for a lead wire connected to a magnetic head according to the present invention, Fig. 2 is a plan view showing a magnetic head support structure, and Fig. 3 is a diagram showing a conventional insulating tube. FIG. 1...Magnetic head, 3...Magnetic head core, 4
... Lead wire, 7 ... Insulating tube, 8 ... Inner layer, 9 ... Outer layer, 10 ... Intermediate layer.
Claims (1)
増幅回路に接続されたリード線を磁気ヘツドコア
に巻回してなる磁気ヘツドにおいて、前記リード
線を被覆する絶縁チユーブを３層構造とするとと
もに、内外層をそれぞれ絶縁部材により形成し、
中間層を接地可能な導電部材で形成したことを特
徴とする磁気ヘツド。 In a magnetic head that is provided in a magnetic disk device and is formed by winding a lead wire, each end of which is connected to an amplifier circuit, around a magnetic head core, the insulating tube that covers the lead wire has a three-layer structure, and the inner and outer layers are respectively Formed by an insulating member,
A magnetic head characterized in that the intermediate layer is formed of a conductive material that can be grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4325489U JPH02135904U (en) | 1989-04-13 | 1989-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4325489U JPH02135904U (en) | 1989-04-13 | 1989-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02135904U true JPH02135904U (en) | 1990-11-13 |
Family
ID=31555514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4325489U Pending JPH02135904U (en) | 1989-04-13 | 1989-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02135904U (en) |
-
1989
- 1989-04-13 JP JP4325489U patent/JPH02135904U/ja active Pending