JPH02134553A - Short-circuit flaw detecting apparatus in electric plating line - Google Patents

Short-circuit flaw detecting apparatus in electric plating line

Info

Publication number
JPH02134553A
JPH02134553A JP28679388A JP28679388A JPH02134553A JP H02134553 A JPH02134553 A JP H02134553A JP 28679388 A JP28679388 A JP 28679388A JP 28679388 A JP28679388 A JP 28679388A JP H02134553 A JPH02134553 A JP H02134553A
Authority
JP
Japan
Prior art keywords
short
current
electrode
circuit
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28679388A
Other languages
Japanese (ja)
Other versions
JPH0543989B2 (en
Inventor
Toru Azuma
亨 東
Hideo Fujita
秀夫 藤田
Mamoru Kamiya
守 神谷
Tsutomu Sakimoto
崎本 勤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Nittetsu Densetsu Kogyo KK
Original Assignee
Nippon Steel Corp
Nittetsu Densetsu Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp, Nittetsu Densetsu Kogyo KK filed Critical Nippon Steel Corp
Priority to JP28679388A priority Critical patent/JPH02134553A/en
Publication of JPH02134553A publication Critical patent/JPH02134553A/en
Publication of JPH0543989B2 publication Critical patent/JPH0543989B2/ja
Granted legal-status Critical Current

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  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To make it possible to detect the occurrence of short-circuit flaws quickly by providing a current detecting means which detects the amount of the current flowing between an electrode and a current conducting roll and outputs the signal corresponding to the amount of the current. CONSTITUTION:An electric plating line is composed of the following parts: an electrode 14 which is connected to one electrode of a DC source 16; and a current conducting roll 12 in contact with a steel plate 10 which is connected to the other electrode. A current detecting means 50 detects the amount of a current flowing between the electrode 14 and the roll 12 and outputs the signal corresponding to said amount. A differential means 52 differentiates the signal and outputs the differentiated amount. A state holding means 56 holds the result of comparison of a comparing means 54 which judges whether the differentiated value is within a specified range or not and outputs the detected signal of a short-circuit flaw. When the detecting device is provided for every line which supplies current to the electrode of each cell, the place which is the cause of the short-circuit flaw can be immediately judged.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気メッキ中に両極がショートすることによ
り発生するショート疵の検出を行うためのショート疵検
出装置、特に鋼板の表面に連続的に亜鉛メッキ、合金メ
ッキ等の電気メッキ処理を行う電気メッキラインに適し
たショート疵検出装置に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a short-circuit detection device for detecting short-circuit defects caused by short-circuiting of both electrodes during electroplating, and particularly to a short-circuit detection device for detecting short-circuit defects that occur when both electrodes are short-circuited during electroplating. The present invention relates to a short flaw detection device suitable for electroplating lines that perform electroplating processes such as zinc plating and alloy plating.

近年、電気メッキラインにおける省エネ技術として種々
の開発がなされ、電極と鋼板との極間距離の短縮化が進
む中で、電極と鋼板が接触することにより発生するショ
ート疵の問題がより重大な問題となってきている。本発
明はそのようなショート疵の発生を自動的に検知するシ
ョート疵検出装置について言及する。
In recent years, various energy-saving technologies have been developed for electroplating lines, and as the distance between the electrode and the steel plate continues to shorten, the problem of short-circuit defects caused by contact between the electrode and the steel plate has become a more serious problem. It is becoming. The present invention refers to a short flaw detection device that automatically detects the occurrence of such short flaws.

(従来の技術〕 第6図は代表的な電気亜鉛メッキラインを表す図である
(Prior Art) FIG. 6 is a diagram showing a typical electrogalvanizing line.

メッキ前の鋼板10は図の左側より連続的に供給され、
通電ロール12とバックアップロール16に狭まれ多数
のセルを経て図の右方向へ送られる。上部電極141及
び下部電極142は鋼板10の両面にメッキ層を形成す
べく鋼板の10の上下に配置されている。交流電極lI
!X(単相又は3相)162の一端は各セルの通電ロー
ル12に接続され他端は各メッキ槽の上下電極141 
、142毎に設けられる整流回路161を経て各セルの
上下電極141,142にそれぞれ接続されている。亜
鉛イオンを含んだメッキ液については図示されていない
が、上下電極141.142付近から鋼板10の表面へ
向けて噴流され、ポンプで循環される。
The steel plate 10 before plating is continuously supplied from the left side of the figure,
It is narrowed between the energizing roll 12 and the backup roll 16 and sent to the right in the figure through a large number of cells. The upper electrode 141 and the lower electrode 142 are arranged above and below the steel plate 10 to form a plating layer on both sides of the steel plate 10. AC electrode II
! One end of the
, 142 are connected to the upper and lower electrodes 141 and 142 of each cell, respectively, through a rectifier circuit 161 provided for each cell. Although the plating solution containing zinc ions is not shown, it is jetted toward the surface of the steel plate 10 from the vicinity of the upper and lower electrodes 141 and 142, and is circulated by a pump.

このような構成により、図の左方向から連続的に供給さ
れる綱板10の上下面には析出した亜鉛の層が形成され
、図の右側へいく程メッキ層の厚みが増大していく。
With this configuration, a layer of precipitated zinc is formed on the upper and lower surfaces of the steel plate 10 that is continuously supplied from the left side of the figure, and the thickness of the plated layer increases toward the right side of the figure.

一般に、電気メッキラインで消費される電力には、メッ
キ反応そのものに消費される電力以外にも電極141,
142と鋼板10との間の電気抵抗によるジュール熱と
して消費される電力がかなりの割合を占めている。これ
を減少するためには電極と鋼板との間の距離を極力小さ
くして電気抵抗を減らすのが最良の手段であるので、前
述したように、この距離を短縮するための技術が種々開
発され、最近では8〜12論程度になってきている。
In general, the power consumed in an electroplating line includes, in addition to the power consumed by the plating reaction itself, the power consumed by the electrode 141,
A considerable proportion of the power is consumed as Joule heat due to the electrical resistance between the steel plate 142 and the steel plate 10. The best way to reduce this is to reduce the electrical resistance by minimizing the distance between the electrode and the steel plate, so as mentioned above, various techniques have been developed to shorten this distance. Recently, there have been about 8 to 12 theories.

そのため、上下電極141,142側からのメッキ液噴
流の圧力のバランスが悪い等の理由で鋼板10が上下に
ハンチングしたり、あるいは、鋼板と鋼板をつなぐ溶接
部分の形状が不良である等の理由で電極と鋼板とのショ
ートが発生する頻度は年々増加する傾向にある。電極と
鋼板とがショートすると一時的に大量の電流が流れ、接
触個所が溶融して鋼板の表面にショート疵が発生する。
Therefore, the steel plate 10 may hunt vertically due to an imbalance in the pressure of the plating liquid jets from the upper and lower electrodes 141 and 142 sides, or the shape of the welded part connecting the steel plates is defective. The frequency of short circuits between electrodes and steel plates tends to increase year by year. When the electrode and the steel plate are short-circuited, a large amount of current temporarily flows, melting the contact area and causing short-circuit flaws on the surface of the steel plate.

このショート疵には、単発的に発生するもの、鋼板のハ
ンチングにより連続的に発生するものがあり、結果、金
属の破片がローラ12 、16に付着したために周期的
に発生する押疵等がある。このようなショート疵の発生
を検出する手段としては、従来ではメッキ後の製品を目
視で検査する以外にはなかった。
These short-circuit flaws include those that occur singly and those that occur continuously due to hunting of the steel plate, and as a result, there are dents that occur periodically due to metal fragments adhering to the rollers 12 and 16. . Conventionally, the only way to detect the occurrence of such short-circuit defects was to visually inspect the plated product.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

目視による検査では発見が遅れがちになるばかりか、シ
ョート疵の原因になったセルを見付は出すことが困難で
ある。そのため、ショート疵のついた製品が大量に出て
しまい、歩留りが大幅に低下するという問題があった。
Visual inspection not only tends to delay discovery, but also makes it difficult to identify the cell that caused the short circuit. As a result, a large amount of products with short-circuit defects are produced, resulting in a problem that the yield is significantly reduced.

したがって本発明の目的は、電気メッキラインにおける
ショート疵の発生をいち速く検出し、そして原因となっ
たメッキセルがいずれであるかも直ちに判明するショー
ト疵検出装置を提案することにある。
Therefore, it is an object of the present invention to provide a short-circuit detection device that can quickly detect the occurrence of short-circuit defects in an electroplating line and immediately determine which plating cell is the cause of the short-circuit defects.

〔課題を解決するための手段〕[Means to solve the problem]

第1図は本発明の電気メッキラインにおけるショート疵
検出装置の原理図である。図において、鋼板10の表面
に電気メッキ処理を施すための電気メッキラインは、直
流電流源16の一方の極に接続された電極14と他方の
極に接続され鋼板10に接触する通電ロール12とを具
備している。
FIG. 1 is a principle diagram of a short flaw detection device in an electroplating line according to the present invention. In the figure, an electroplating line for electroplating the surface of a steel plate 10 includes an electrode 14 connected to one pole of a DC current source 16 and a current-carrying roll 12 connected to the other pole and in contact with the steel plate 10. Equipped with:

本発明のショート疵検出装置の特徴は、電極14と通電
ロール12との間に流れる電流の量を検出し、電流の量
に応じた信号を出力する変流器、シャント等の電流検出
手段50と、信号を微分して微分値を出力する微分手段
52と、微分値が所定の範囲内にあるか否かを判定する
比較手段54と、比較手段54の比較結果を保持してシ
ョート疵検出信号を出力する状態保持手段56とを具備
する点にある。
The short flaw detection device of the present invention is characterized by a current detection means 50 such as a current transformer or a shunt that detects the amount of current flowing between the electrode 14 and the current-carrying roll 12 and outputs a signal according to the amount of current. , a differentiating means 52 that differentiates the signal and outputs a differential value, a comparing means 54 that determines whether the differential value is within a predetermined range, and a comparison result of the comparing means 54 is held to detect short flaws. The present invention also includes a state holding means 56 for outputting a signal.

〔作 用〕[For production]

ショート疵が発生する時には流れる電流が急激に変化す
る。この電流を電流検出手段50で検出し、微分手段5
2で微分し、比較手段54で所定の値と比較すればこの
急激な変化を検知することができ、この状態を状態保持
手段56で保持すればショート疵が発生したことを表す
ショート疵検出信号が得られる。このショート疵検出装
置を各セルの各電極に電流を供給するライン毎に設けれ
ばショート疵の原因となった個所を直ちに判断すること
ができる。
When a short circuit occurs, the flowing current changes rapidly. This current is detected by the current detection means 50, and the differentiating means 5
This rapid change can be detected by differentiating by 2 and comparing it with a predetermined value by the comparing means 54. If this state is maintained by the state holding means 56, a short flaw detection signal indicating that a short flaw has occurred can be generated. is obtained. If this short-circuit detection device is provided for each line that supplies current to each electrode of each cell, it is possible to immediately determine the location where the short-circuit has occurred.

〔実施例〕〔Example〕

第2図は電流検出手段50 (第1図)の−例として変
流器による場合の取り付は方法を表す図であり、変流器
501以外は従来のメッキラインにおける変圧整流回路
の構成を表している。本図は相数に関係なく1本の線で
表す単線結線図(スケルトン)で表されている。例えば
3,300ボルトの三相交流を三相変圧器163におい
て45ボルトに降下して大電流(20,000アンペア
程度)のとり出しを可能にし、コントローラ (図示せ
ず)から点弧が制御されるサイリスタ164によって直
流に変換されて、+側は上または下側の電極に供給され
側は通電ロールへ供給される。
FIG. 2 is a diagram showing how to install the current detection means 50 (FIG. 1) using a current transformer as an example, and except for the current transformer 501, the configuration is similar to that of a transformer rectifier circuit in a conventional plating line. represents. This figure is represented by a single line diagram (skeleton) that shows one line regardless of the number of phases. For example, a three-phase alternating current of 3,300 volts is stepped down to 45 volts at the three-phase transformer 163 to enable extraction of a large current (about 20,000 amperes), and ignition is controlled by a controller (not shown). The positive current is converted into direct current by a thyristor 164, and the positive side is supplied to the upper or lower electrode, and the positive side is supplied to the current-carrying roll.

第2図例において、電流検出のための変流器501は三
相変圧器163の一次側に挿入される。この場合、変圧
器163の励磁電流までも検出してしまうので、その分
、検出感度は劣る。
In the example of FIG. 2, a current transformer 501 for current detection is inserted on the primary side of a three-phase transformer 163. In this case, since even the excitation current of the transformer 163 is detected, the detection sensitivity is correspondingly inferior.

第3図は電流検出手段50 (第1図)の第2の例とし
てシャント502による場合を表している。
FIG. 3 shows a second example of the current detection means 50 (FIG. 1) in which a shunt 502 is used.

シャント502以外は第2図と同様である。The components other than the shunt 502 are the same as in FIG.

第3図の例において、シャント502による電流検出は
サイリスタ164で直流に変換された後に行われる。こ
の場合、第2図の例と異なり、変圧器163の励磁電流
の寄与は含まれないので検出感度が高い。
In the example of FIG. 3, current detection by shunt 502 is performed after being converted to direct current by thyristor 164. In this case, unlike the example shown in FIG. 2, the contribution of the excitation current of the transformer 163 is not included, so the detection sensitivity is high.

第4図は本発明に係るショート疵検出装置の一実施例か
ら第2図または第3図で示された電流検出手段に相当す
る部分を除いた回路図である。
FIG. 4 is a circuit diagram in which a portion corresponding to the current detecting means shown in FIG. 2 or 3 is removed from an embodiment of the short circuit flaw detection device according to the present invention.

演算増幅器ICI及びコンデンサC1、抵抗R1で構成
される微分回路は第1図の微分手段52を実現するもの
であり、単にCとRで構成されるバイパスフィルタでも
良いが、適切な定数を設定するのが難しいので、このよ
うな演算増幅器を使用した回路が望ましい。演算増幅器
IC2、抵抗R2゜R3、及びダイオードDIで構成さ
れる回路は信号を反転増幅すると共に検出器からの信号
の脈動による影響をダイオードD1で除去するためのも
のである。したがって、検出器として、第3図に表され
たような変圧器の二次側に設けられたシャントを採用す
るとすれば、この回路は不要である。
The differentiating circuit composed of the operational amplifier ICI, the capacitor C1, and the resistor R1 realizes the differentiating means 52 in FIG. Therefore, a circuit using such an operational amplifier is desirable. A circuit composed of an operational amplifier IC2, a resistor R2°R3, and a diode DI is used to invert and amplify the signal and to remove the influence of pulsation of the signal from the detector using the diode D1. Therefore, if a shunt provided on the secondary side of a transformer as shown in FIG. 3 is employed as a detector, this circuit is unnecessary.

演算増幅器IC3,IC4、抵抗R4〜8、及びダイオ
ードD2 、D3で構成される回路は微分値の+側及び
−側のいずれの側も1つのコンパレータで比較すること
で検出するために、微分値の絶対値を出力するものであ
る。演算増幅器IC5で構成される比較器は絶対値回路
の出力電圧が所定の値■。
The circuit consisting of operational amplifiers IC3 and IC4, resistors R4 to R8, and diodes D2 and D3 detects both the + and - sides of the differential value by comparing them with one comparator. It outputs the absolute value of . The output voltage of the absolute value circuit of the comparator constituted by the operational amplifier IC5 is a predetermined value ■.

を越えた時、論理°“0”信号を出力する。したがって
、IC3,IC4を中心として構成される絶対値回路と
IC5による比較器とで第1図の比較手段54が実現さ
れる。比較手段54の構成として、絶対値回路を通さな
い構成でも良い。すなわち、所定値■。との比較を行う
比較器と所定値−■。
When it exceeds 0, it outputs a logic “0” signal. Therefore, the comparison means 54 in FIG. 1 is realized by the absolute value circuit mainly composed of IC3 and IC4 and the comparator made of IC5. The comparison means 54 may have a structure that does not pass through the absolute value circuit. That is, the predetermined value ■. A comparator that performs a comparison with a predetermined value -■.

との比較を行う比較器とを2段設け、微分値が■。Two stages of comparators are provided to compare the differential value with ■.

を超えるかあるいは一■。′を下回る時に論理°“0゛
゛信号を出力する構成としても良い。NANDゲー目C
6,IC7とで構成されるフリップフロップは第1図の
状態保持手段50を実現するもので、IC4の出力が一
瞬でも“O゛°となるとIC6の片側の入力が°“0゛
となりその出力には“1′が現れ、入力が“°1”に戻
ってもその値が保持され、疵検出信号となる。SWlは
初期状態としてIC6の出力を“0゛にリセットするた
めのスイッチである。
or more than one ■. It is also possible to have a configuration that outputs a logic "0" signal when the voltage falls below 0.NAND gate C
6 and IC7 realizes the state holding means 50 shown in Fig. 1. When the output of IC4 becomes "0°" even for a moment, the input on one side of IC6 becomes "0" and its output becomes "0". "1" appears, and even if the input returns to "°1", that value is held and becomes a flaw detection signal. SWl is a switch for resetting the output of IC6 to "0" as the initial state. .

このようにフリップフロップで構成する以外に、状態保
持手段50としては、単安定マルチバイブレークで構成
して所定の時間だけ信号を出力する形としても良い。
In addition to being constituted by a flip-flop as described above, the state holding means 50 may be constituted by a monostable multi-by-break, which outputs a signal only for a predetermined time.

第5図は第4図の回路で観測された各部の信号の波形で
あって、第4図の回路の動作結果を表すものである。(
A)〜(D)欄はそれぞれ第4図中A−D点において観
測された信号を表している。
FIG. 5 shows waveforms of signals at various parts observed in the circuit shown in FIG. 4, and represents the operation results of the circuit shown in FIG. (
Columns A) to (D) represent signals observed at points A to D in FIG. 4, respectively.

(A)欄の信号は検出器からの信号である。なお、この
信号は第2図のように変圧器の一次側に設けられた変流
器からの信号である。図中Xで表す時点までは変流器の
出力には規則的な脈動があるのみであるが、X点におい
てショート疵が発生したために電流が急激に上昇し、そ
の後、当該セルへの通電が停止されるので急激に下がり
、0となっている。(B)4Mの信号は第4図のICI
の出力であるが、(A)欄の信号を微分し、正負を反転
した信号が現れている。(C)欄の信号はIC4の出力
である。 (A) 4rJのXで示す位置に鋭い信号が
現れている。 (D)lの信号はIC6の出力であり、
ショート疵検出と同時にLレベルからHレベルへ変化し
、それが保持されている。
The signal in column (A) is the signal from the detector. Note that this signal is a signal from a current transformer provided on the primary side of the transformer as shown in FIG. Up to the point indicated by X in the diagram, there is only regular pulsation in the output of the current transformer, but a short circuit occurs at point X, so the current increases rapidly, and after that, the current flow to the cell is stopped. Since it is stopped, it suddenly drops to 0. (B) The 4M signal is the ICI in Figure 4.
In this output, a signal obtained by differentiating the signal in column (A) and inverting the sign appears. The signal in column (C) is the output of IC4. (A) A sharp signal appears at the position indicated by X in 4rJ. (D) The signal of l is the output of IC6,
Simultaneously with the detection of a short flaw, the level changes from L level to H level, and this level is maintained.

〔発明の効果〕〔Effect of the invention〕

以上述べたように本発明によれば、ショート疵を発生し
たセルを早期に発見することが可能となり、さらにそれ
により、自動的に当該セルへの通電を停止するかあるい
は電極を解放することによってショート疵の発生量を最
小限に抑えることが可能になると同時に、電極の劣化あ
るいはロールの疵摩耗を最小限に防止することができて
、整備費コスト削減への多大な寄与が期待できる。
As described above, according to the present invention, it is possible to detect a cell in which a short circuit has occurred at an early stage. It is possible to minimize the amount of short-circuit defects, and at the same time, it is possible to prevent deterioration of the electrode or wear of the roll due to defects, which can be expected to make a significant contribution to reducing maintenance costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の原理図、 第2図は本発明に係るショート疵検出装置における電流
検出手段の第1の例を表す図、第3図は本発明に係るシ
ョート疵検出装置における電流検出手段の第2の例を表
す図、第4図は本発明に係るショート疵検出装置の実施
例を表す図、 第5図は第4図の回路の動作を表す図、第6図は代表的
な電気メッキラインを表す図。 図において、 10・・・鋼板、      12・・・通電ロール、
14・・・電極、     50・・・電流検出手段、
54・・・比較手段、   501・・・変流器、50
2・・・シャント。 鄭
Fig. 1 is a diagram showing the principle of the present invention, Fig. 2 is a diagram showing a first example of current detection means in the short flaw detection device according to the present invention, and Fig. 3 is a diagram showing current detection in the short flaw detection device according to the present invention. FIG. 4 is a diagram representing an embodiment of the short circuit flaw detection device according to the present invention; FIG. 5 is a diagram representing the operation of the circuit shown in FIG. 4; FIG. 6 is a representative diagram. A diagram showing a typical electroplating line. In the figure, 10... steel plate, 12... energizing roll,
14... Electrode, 50... Current detection means,
54... Comparison means, 501... Current transformer, 50
2...Shunt. Zheng

Claims (1)

【特許請求の範囲】 1、鋼板(10)の表面に電気メッキ処理を施すための
電気メッキラインであって、直流電流源(16)の一方
の極に接続された電極(14)と、他方の極に接続され
該鋼板(10)に接触する通電ロール(12)とを具備
する電気メッキラインにおけるショート疵の発生を検出
するショート疵検出装置において、 該電極(14)と該通電ロール(12)との間に流れる
電流の量を検出し、該電流の量に応じた信号を出力する
電流検出手段(50)と、 該信号を微分して微分値を出力する微分手段(52)と
、 該微分値が所定の範囲内にあるか否かを判定する比較手
段(54)と、 該比較手段(54)の比較結果を保持して疵検出信号を
出力する状態保持手段(56)とを具備することを特徴
とする電気メッキラインにおけるショート疵検出装置。
[Claims] 1. An electroplating line for electroplating the surface of a steel plate (10), comprising an electrode (14) connected to one pole of a direct current source (16), and the other A short flaw detection device for detecting the occurrence of short flaws in an electroplating line, which includes an energizing roll (12) connected to a pole of the electrode (14) and in contact with the steel plate (10). ), and a current detection means (50) that detects the amount of current flowing between the two and outputs a signal corresponding to the amount of current; and a differentiator (52) that differentiates the signal and outputs a differential value. Comparing means (54) for determining whether the differential value is within a predetermined range; and state holding means (56) for holding the comparison result of the comparing means (54) and outputting a flaw detection signal. A short flaw detection device in an electroplating line, comprising:
JP28679388A 1988-11-15 1988-11-15 Short-circuit flaw detecting apparatus in electric plating line Granted JPH02134553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28679388A JPH02134553A (en) 1988-11-15 1988-11-15 Short-circuit flaw detecting apparatus in electric plating line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28679388A JPH02134553A (en) 1988-11-15 1988-11-15 Short-circuit flaw detecting apparatus in electric plating line

Publications (2)

Publication Number Publication Date
JPH02134553A true JPH02134553A (en) 1990-05-23
JPH0543989B2 JPH0543989B2 (en) 1993-07-05

Family

ID=17709113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28679388A Granted JPH02134553A (en) 1988-11-15 1988-11-15 Short-circuit flaw detecting apparatus in electric plating line

Country Status (1)

Country Link
JP (1) JPH02134553A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04191400A (en) * 1990-11-27 1992-07-09 Nippon Steel Corp Short flaw detector
DE102007053451A1 (en) 2007-11-07 2009-05-28 Thyssenkrupp Steel Ag Method for detecting band stops of band against coating electrodes of band coating system, involves generating current signal depending upon value of electrical current for coating band
US10739386B2 (en) 2015-05-21 2020-08-11 Nec Corporation Storage battery monitoring device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04191400A (en) * 1990-11-27 1992-07-09 Nippon Steel Corp Short flaw detector
DE102007053451A1 (en) 2007-11-07 2009-05-28 Thyssenkrupp Steel Ag Method for detecting band stops of band against coating electrodes of band coating system, involves generating current signal depending upon value of electrical current for coating band
US10739386B2 (en) 2015-05-21 2020-08-11 Nec Corporation Storage battery monitoring device

Also Published As

Publication number Publication date
JPH0543989B2 (en) 1993-07-05

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