JPH02133330U - - Google Patents
Info
- Publication number
- JPH02133330U JPH02133330U JP4171289U JP4171289U JPH02133330U JP H02133330 U JPH02133330 U JP H02133330U JP 4171289 U JP4171289 U JP 4171289U JP 4171289 U JP4171289 U JP 4171289U JP H02133330 U JPH02133330 U JP H02133330U
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin film
- sheet
- buffer sheet
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Wrappers (AREA)
- Laminated Bodies (AREA)
Description
第１図〜第３図は、本考案の導電性緩衝シート
を示す。第１図は、エンボスシート２及び透明導
電性フイルム１を貼り合わせた導電性緩衝シート
の例である。第２図は、エンボスシート２に熱可
塑性樹脂フイルム４を貼り合わせた緩衝シート５
の一方の面に透明導電性フイルム１を貼り合わせ
た例である。第３図は、緩衝シート５の凸状突起
の頂面に透明導電性フイルム１を接着した導電性
緩衝シートの例である。第４図は、第１図に示し
た導電性緩衝シートを重ね合わせ、且つ、周囲６
に沿つて熱融着した電子部品包装用袋７である。
第５図は、第３図に示した導電性緩衝シートを重
ね合わせ、且つ、周囲６に沿つて熱融着した電子
部品包装用袋８である。
１……透明導電性フイルム、２……エンボスシ
ート、３……凸状突起、４……熱可塑性樹脂フイ
ルム、５……緩衝シート、６……本考案の導電性
緩衝シートを用いた電子部品包装用袋において、
周辺部の接着部分を示す。７……第１図の導電性
緩衝シートからなる電子部品包装用袋、８……第
３図の導電性緩衝シートからなる電子部品包装用
袋。
1 to 3 show the conductive buffer sheet of the present invention. FIG. 1 shows an example of a conductive buffer sheet in which an embossed sheet 2 and a transparent conductive film 1 are laminated together. Figure 2 shows a buffer sheet 5 made by laminating a thermoplastic resin film 4 to an embossed sheet 2.
This is an example in which a transparent conductive film 1 is bonded to one surface of the . FIG. 3 shows an example of a conductive buffer sheet in which the transparent conductive film 1 is adhered to the top surface of the convex projections of the buffer sheet 5. FIG. 4 shows the conductive buffer sheets shown in FIG.
This is an electronic component packaging bag 7 that is heat-sealed along the sides.
FIG. 5 shows an electronic component packaging bag 8 in which the conductive buffer sheets shown in FIG. 3 are overlapped and heat-sealed along the periphery 6. 1... Transparent conductive film, 2... Embossed sheet, 3... Convex projection, 4... Thermoplastic resin film, 5... Buffer sheet, 6... Electronic component using the conductive buffer sheet of the present invention In packaging bags,
The adhesive area around the periphery is shown. 7... A bag for packaging electronic parts made of the conductive buffer sheet shown in FIG. 1, 8... A bag for packaging electronic parts made of the conductive buffer sheet shown in FIG. 3.
Claims (1)
包した透明導電性フイルム１を、 (b) 熱可塑性樹脂フイルムに多数の凸状突起
３を形成してなるエンボスシート２の少なくとも
一方の面に貼り合わせた、 導電性緩衝シート。 (2) (a) 熱可塑性樹脂フイルムに金属繊維を埋
包した透明導電性フイルム１と、 (b) 熱可塑性樹脂フイルムに多数の凸状突起
３を形成してなるエンボスシート２の少なくとも
一方の面に熱可塑性樹脂フイルム４を貼り合わせ
た緩衝シート５を、 貼り合わせた導電性緩衝シート。[Claims for Utility Model Registration] (1) (a) A transparent conductive film 1 in which metal fibers are embedded in a thermoplastic resin film, (b) A large number of convex protrusions 3 formed in a thermoplastic resin film. A conductive buffer sheet is attached to at least one side of the embossed sheet 2. (2) At least one of (a) a transparent conductive film 1 in which metal fibers are embedded in a thermoplastic resin film, and (b) an embossed sheet 2 in which a large number of convex protrusions 3 are formed in a thermoplastic resin film. A conductive buffer sheet made by bonding a buffer sheet 5 with a thermoplastic resin film 4 bonded to its surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4171289U JPH0628267Y2 (en) | 1989-04-11 | 1989-04-11 | Transparent conductive buffer sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4171289U JPH0628267Y2 (en) | 1989-04-11 | 1989-04-11 | Transparent conductive buffer sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02133330U true JPH02133330U (en) | 1990-11-06 |
| JPH0628267Y2 JPH0628267Y2 (en) | 1994-08-03 |
Family
ID=31552616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4171289U Expired - Lifetime JPH0628267Y2 (en) | 1989-04-11 | 1989-04-11 | Transparent conductive buffer sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0628267Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086925A (en) * | 2001-09-12 | 2003-03-20 | Matsushita Electric Ind Co Ltd | Printed board with moisture-proofing structure and its manufacturing method |
| JP2010264651A (en) * | 2009-05-14 | 2010-11-25 | Dainippon Printing Co Ltd | Worked article, rolled web, and method for producing worked article |
-
1989
- 1989-04-11 JP JP4171289U patent/JPH0628267Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086925A (en) * | 2001-09-12 | 2003-03-20 | Matsushita Electric Ind Co Ltd | Printed board with moisture-proofing structure and its manufacturing method |
| JP2010264651A (en) * | 2009-05-14 | 2010-11-25 | Dainippon Printing Co Ltd | Worked article, rolled web, and method for producing worked article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0628267Y2 (en) | 1994-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |