JPH02133308U - - Google Patents
Info
- Publication number
- JPH02133308U JPH02133308U JP4176389U JP4176389U JPH02133308U JP H02133308 U JPH02133308 U JP H02133308U JP 4176389 U JP4176389 U JP 4176389U JP 4176389 U JP4176389 U JP 4176389U JP H02133308 U JPH02133308 U JP H02133308U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- outer peripheral
- semiconductor wafer
- dicing tape
- semiconductor wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 4
- 235000012431 wafers Nutrition 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 2
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176389U JPH02133308U (ko) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176389U JPH02133308U (ko) | 1989-04-10 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02133308U true JPH02133308U (ko) | 1990-11-06 |
Family
ID=31552710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4176389U Pending JPH02133308U (ko) | 1989-04-10 | 1989-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133308U (ko) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009064885A (ja) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | ダイシング用補助部材 |
| JP2013021110A (ja) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | 円板状被加工物の加工方法 |
| JP2013021109A (ja) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | 粘着シート及び粘着シートを用いた円板状被加工物の加工方法 |
| JP2013247136A (ja) * | 2012-05-23 | 2013-12-09 | Disco Abrasive Syst Ltd | テープ及び該テープを使用した板状物の加工方法 |
| JP2015050445A (ja) * | 2013-09-05 | 2015-03-16 | 古河電気工業株式会社 | 粘着テープおよび半導体装置の製造方法 |
-
1989
- 1989-04-10 JP JP4176389U patent/JPH02133308U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009064885A (ja) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | ダイシング用補助部材 |
| JP2013021110A (ja) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | 円板状被加工物の加工方法 |
| JP2013021109A (ja) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | 粘着シート及び粘着シートを用いた円板状被加工物の加工方法 |
| JP2013247136A (ja) * | 2012-05-23 | 2013-12-09 | Disco Abrasive Syst Ltd | テープ及び該テープを使用した板状物の加工方法 |
| JP2015050445A (ja) * | 2013-09-05 | 2015-03-16 | 古河電気工業株式会社 | 粘着テープおよび半導体装置の製造方法 |