JPH02133255A - Wiring method for vehicle lighting fixture - Google Patents

Wiring method for vehicle lighting fixture

Info

Publication number
JPH02133255A
JPH02133255A JP63283945A JP28394588A JPH02133255A JP H02133255 A JPH02133255 A JP H02133255A JP 63283945 A JP63283945 A JP 63283945A JP 28394588 A JP28394588 A JP 28394588A JP H02133255 A JPH02133255 A JP H02133255A
Authority
JP
Japan
Prior art keywords
wiring
synthetic resin
metal
mold
injection molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63283945A
Other languages
Japanese (ja)
Inventor
Hideo Naito
内藤 日出男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ichikoh Industries Ltd
Original Assignee
Ichikoh Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ichikoh Industries Ltd filed Critical Ichikoh Industries Ltd
Priority to JP63283945A priority Critical patent/JPH02133255A/en
Publication of JPH02133255A publication Critical patent/JPH02133255A/en
Pending legal-status Critical Current

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  • Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To eliminate generation of a wiring mistake further enabling automatization to be attained by putting a wiring foil film between two or more metal molds for injection molding synthetic resin injection molding a synthetic resin- made member and securing a metal layer to the synthetic resin made member. CONSTITUTION:A wiring foil film 81 of long scale is linked extending between a female metal mold 82 and a male metal mold 83, and a moving base 84, supporting the metal mold 83, is advanced holding the wiring foil film 81 performing die matching. Next advancing an injector 85, a synthetic resin-made member, for instance, lamp housing 1 performs injection molding by a synthetic resin material, next when the mold is released, a metal wiring layer 81f, formed on a base film 81a of the wiring foil film 81 through a mold releasing layer 81b, is exfoliated from the base film 81a and secured to the resin-made member 1. Here position alignment of the wiring layer 81f to the metal molds 82, 83 is performed with detection by a photo sensor 87. Thus eliminating the necessity for wiring base board storage space in the synthetic resin-made member, no after work is required further enabling miswiring to be prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、車両用灯具に係り、詳しくはハウジング、カ
バー、ケース等の樹脂製部材上に電気回路のパターンを
一体に構成して車両用灯具に配線する方法に関するもの
である。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a vehicular lamp, and more specifically, an electric circuit pattern is integrally formed on a resin member such as a housing, a cover, or a case. This relates to a method of wiring a light fixture.

〔従来の技術〕[Conventional technology]

従来の車両用灯具(例えば室内灯)には、第5図に示す
ように電気回路にコードを使用したものと、第6図に示
すように電気回路に配線プレートを使用したものとがあ
る。
BACKGROUND OF THE INVENTION Conventional vehicle lamps (for example, interior lights) include those that use a cord for the electric circuit as shown in FIG. 5, and those that use a wiring plate for the electric circuit as shown in FIG.

第5図および第6図中、1は絶縁性の樹脂製部材として
のハウジングで、この従来例のハウジング1は長方形の
薄皿形状をなす、このハウジング1の一端部に1段下が
った凹部10を設け、その凹部100表面にrONJ 
、rOFFJ 、rDOORJの文字を付す。一方、前
記ハウジング1の他端部寄りの箇所に開孔11を設け、
このハウジング1の中央部から他端部にかけて係合爪1
2を3個設ける。
In FIGS. 5 and 6, reference numeral 1 denotes a housing as an insulating resin member, and the housing 1 of this conventional example has a rectangular thin plate shape. rONJ is provided on the surface of the recess 100.
, rOFFJ, rDOORJ are attached. On the other hand, an opening 11 is provided at a location near the other end of the housing 1,
An engaging claw 1 extends from the center of the housing 1 to the other end.
Provide three pieces of 2.

2はレンズで、このレンズ2は長方形の薄皿形状をなし
、前記ハウジング1の係合爪12に着脱可能に係合する
Reference numeral 2 denotes a lens, and this lens 2 has a rectangular thin plate shape and is removably engaged with the engaging claw 12 of the housing 1.

1対の3はバネ性および導電性を有するバルブホルダで
、この2枚のバルブホルダ3を前記ハウジング1の開孔
IIの相対向する縁にそれぞれ取付ける、この2枚のバ
ルブホルダ3にバルブ30を着脱可能に取付ける。
A pair of valve holders 3 have spring properties and conductivity, and these two valve holders 3 are respectively attached to opposing edges of the opening II of the housing 1. A valve 30 is attached to the two valve holders 3. Attach removably.

4は絶縁性材質からなるスイッチレバーで、このスイッ
チレバー4のほぼ中央を前記ハウジング1の中央部の凹
部lO寄りの箇所にリベット40により回動可能に取付
け、スイッチレバー4の一端部をハウジング1の凹部1
0側に位置させ、かつスイッチレバー4の他端部をハウ
ジング1の中央部側に位置させる。このスイッチレバー
4の他端に導電性のボール41を転勤自在に装着する。
Reference numeral 4 denotes a switch lever made of an insulating material, and the switch lever 4 is rotatably attached to a location near the recess 10 in the center of the housing 1 with a rivet 40, and one end of the switch lever 4 is attached to the housing 1. recess 1
0 side, and the other end of the switch lever 4 is located on the center side of the housing 1. A conductive ball 41 is attached to the other end of the switch lever 4 so as to be freely transferable.

51、52.53.54は導電性の第1.第2.第3゜
第4のスイッチ用コンタクトで、この4個のコンタクト
51.52.53.54を前記ハウジング1のほぼ中央
部に、前記スイッチレバー4の他端の円軌跡上に等間隔
に前記スイッチレバー4のボール41と弾性接触するよ
うに取付ける。
51, 52, 53, and 54 are conductive 1st. Second. 3rd゜Fourth switch contacts, these four contacts 51, 52, 53, 54 are placed approximately in the center of the housing 1, and are equally spaced on the circular locus of the other end of the switch lever 4 for the switch. It is attached so as to make elastic contact with the ball 41 of the lever 4.

第5図において、図中61および62は第1.第2のコ
ードで、この第1コード61の両端を前記第2のコンタ
クト52と前記1枚のバルブホルダ3とにそれぞれ接続
する。一方、第2コード62の一端を前記第1コンタク
ト51に接続し、その第2コード62の他端にターミナ
ル60を接続する。63は前記第2コンタクト52と第
3コンタクト53とを接続する導電性の接続板である。
In FIG. 5, 61 and 62 are 1st. A second cord connects both ends of the first cord 61 to the second contact 52 and the one valve holder 3, respectively. On the other hand, one end of the second cord 62 is connected to the first contact 51, and the other end of the second cord 62 is connected to the terminal 60. Reference numeral 63 denotes a conductive connection plate that connects the second contact 52 and the third contact 53.

一方、第6図において、図中71および72は第1゜第
2の配線プレートで、この第1配線プレート71の両端
を前記第2.第3コンタクト52.53と1枚のバルブ
ホルダ3とにそれぞれ接続する。一方、第2配線プレー
ト72の一端を前記第1コンタクト51に接続する。
On the other hand, in FIG. 6, reference numerals 71 and 72 denote first and second wiring plates, and both ends of the first wiring plate 71 are connected to the second and second wiring plates. The third contacts 52 and 53 are connected to one valve holder 3, respectively. On the other hand, one end of the second wiring plate 72 is connected to the first contact 51.

上述の第5図および第6図中において、第1コンタクト
51を電源に接続し、第4コンタクト54を図示しない
ドアの開閉により開閉する電気回路に接続する。
In FIGS. 5 and 6 described above, the first contact 51 is connected to a power source, and the fourth contact 54 is connected to an electric circuit that is opened and closed by opening and closing a door (not shown).

かくして、スイッチレバー4を図示の位置に位置させる
と、ボール41が第2.第3コンタクト52゜53に接
触し、電気回路は開状態にあり、バルブ30は消灯する
Thus, when the switch lever 4 is positioned at the position shown, the ball 41 is moved to the second position. The third contacts 52 and 53 are contacted, the electric circuit is open, and the bulb 30 is turned off.

次に、スイッチレバー4を図示の位置から反時計方向に
回動させると、ボール41が第1.第2コンタクト51
.52に接触し、電気回路は閉状態となり、バルブ30
が点灯する。
Next, when the switch lever 4 is rotated counterclockwise from the illustrated position, the ball 41 is moved to the first position. Second contact 51
.. 52, the electric circuit is closed, and the valve 30
lights up.

また、スイッチレバー4を図示の位置から時計方向に回
動させると、ボール41が第3.第4コンタクト53.
54に接触し、上述の電気回路と接続し、ドアの開閉に
より上述の電気回路が開閉し、バルブ30が消灯9点灯
する。
Further, when the switch lever 4 is rotated clockwise from the illustrated position, the ball 41 is moved to the third position. Fourth contact 53.
54 and is connected to the above-mentioned electric circuit, and when the door is opened and closed, the above-mentioned electric circuit is opened and closed, and the bulb 30 is turned off and turned on.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところが、上述の従来の車両用灯具は、合成樹脂製部材
としてのハウジング1と、電気回路を構成するコード6
1.62又は配線プレート71.72とをそれぞれ別個
に製造し、組立工程において、ハウジング1にコード6
1.62又は配線プレート71.72を組付けるもので
あるから、組付2組立が繁雑であり、自動組立が難しく
、又配線ミスの虞れがある。
However, the above-mentioned conventional vehicle lamp includes a housing 1 as a synthetic resin member and a cord 6 constituting an electric circuit.
1.62 or the wiring plate 71.72, respectively, and in the assembly process, the code 6 is attached to the housing 1.
1.62 or the wiring plate 71.72, the two assemblies are complicated, automatic assembly is difficult, and there is a risk of wiring errors.

合成樹脂製部材と電気回路とを一体に製造し、組付1組
立が簡単で自動化が容易で配線ミスのない車両用灯具を
構成するために、合成樹脂製部材と別体に構成した配線
基板を該合成樹脂製部材に取り付ける方法(以下、試案
という)も考えられる。
A wiring board that is manufactured separately from the synthetic resin components and electrical circuits in order to construct a vehicle light that is easy to assemble, easy to automate, and eliminates wiring errors. A method (hereinafter referred to as a "proposal") of attaching the material to the synthetic resin member is also conceivable.

第7図(A)は上記試案に係る配線基板80の斜視図で
ある。
FIG. 7(A) is a perspective view of a wiring board 80 according to the above-described draft.

この配線基板80には、前記従来例(第6図)の配線プ
レートと類似する形状の導電パターン80a。
This wiring board 80 includes a conductive pattern 80a having a shape similar to that of the wiring plate of the conventional example (FIG. 6).

80bが設けられている。そのB−B断面を第7図(B
)に示す。
80b is provided. The B-B cross section is shown in Figure 7 (B
).

基板本体80cの上に、導電パターン形状の金属層80
dが成層され、保護層80eで覆われている。
A metal layer 80 in the shape of a conductive pattern is disposed on the substrate body 80c.
d is layered and covered with a protective layer 80e.

上記の保護層80cには礼状の空隙80e−1が設けら
れて金属層80dが局部的に露出している。この露出部
はハンダ付に利用される。
A thank-you void 80e-1 is provided in the protective layer 80c, and the metal layer 80d is locally exposed. This exposed portion is used for soldering.

ところが、上記試案に係る配線方法においては、イ0合
成樹脂製の部材(例えばランプハウジング)を射出成形
した後に配線基板を取り付けるための時間と労力とを要
する。
However, the wiring method according to the above proposal requires time and effort to attach the wiring board after injection molding the synthetic resin member (for example, the lamp housing).

口0合成樹脂製部材(例えばランプハウジング)の中に
配線基板を収納するためのスペースが必要であり、合成
樹脂製部材の薄形化を妨げる。
A space is required to house the wiring board in the synthetic resin member (for example, a lamp housing), which prevents the synthetic resin member from becoming thinner.

ハ、配線基板取付部は略平面状をなし、かつ、障害物の
無いことを要する等、合成樹脂製部材(例えばランプハ
ウジング)に制約が有る。
C. There are restrictions on synthetic resin members (for example, lamp housings), such as the need for the wiring board mounting portion to be substantially planar and free of obstacles.

どいつだ不具合を伴う。It always comes with some problems.

本発明は上述の事情に鑑みて為されたもので、自動化が
容易で配線ミスの虞れが無いという試案の長所を損ねる
ことなく該試案の方法を改良し、合成樹脂製部材の中に
配線基板を収納する空間を設ける必要が無く、 合成樹脂製部材の射出成形と同時に配線が形成されて、
射出成形後に加工工程を設ける必要の無い、 車両用灯具の配線方法を提供することを目的とする。
The present invention has been made in view of the above-mentioned circumstances, and improves the method of the prototype without sacrificing the advantages of the prototype, such as easy automation and no risk of wiring mistakes, and wires wires inside synthetic resin members. There is no need to create a space to store the board, and the wiring is formed at the same time as the injection molding of the synthetic resin member.
The purpose of the present invention is to provide a wiring method for vehicle lights that does not require any processing steps after injection molding.

〔課題を解決するための手段〕[Means to solve the problem]

上記の目的を達成するために創作した本発明の配線方法
の基本的原理は、 導電パターンの形状を有する金属の薄層を含む多層の箔
膜を構成し、 上記の箔膜を金型間に挟みこんで合成樹脂製部材の射出
成形を行い、 成形された合成樹脂製部材の表面に前記金属の薄層を固
着させる。
The basic principle of the wiring method of the present invention created to achieve the above object is to construct a multilayer foil film containing a thin layer of metal in the shape of a conductive pattern, and to place the above foil film between molds. Injection molding of the synthetic resin member is performed by sandwiching the metal parts, and the thin metal layer is fixed to the surface of the molded synthetic resin member.

上記の固着を確実に行わせるため、金属の薄層に接着剤
層を成層しておく 上記の接着剤としては、合成樹脂製部材と同形の合成樹
脂よりなり、常温で粘着性を有しないものが好適である
In order to ensure the above-mentioned adhesion, an adhesive layer is layered on the thin metal layer.The above-mentioned adhesive is made of synthetic resin of the same shape as the synthetic resin member and does not have tackiness at room temperature. is suitable.

〔作用〕[Effect]

上記の手段によれば、 導電パターン形状の金属薄層が合成樹脂製部材(例えば
ランプハウジング)にインモールドされるので、射出成
形と同時に配線が完了し、射出成形後の加工を要しない
According to the above means, since the metal thin layer in the shape of a conductive pattern is in-molded into a synthetic resin member (for example, a lamp housing), wiring is completed at the same time as injection molding, and no processing is required after injection molding.

上記と同様の理由により、合成樹脂製部材(例えばラン
プハウジング)内に配線基板を収納するためのスペース
を必要とせず、該合成樹脂製部材の薄形化に好適である
For the same reason as above, there is no need for space for housing the wiring board in the synthetic resin member (for example, a lamp housing), and this is suitable for making the synthetic resin member thinner.

上記と同様の理由により、配線すべき個所近傍について
の合成樹脂製部材の形状に制約がなく。
For the same reason as above, there are no restrictions on the shape of the synthetic resin member near the location where the wiring is to be made.

近接する障害物の制約も受けない。It is not restricted by nearby obstacles.

〔実施例〕〔Example〕

第1図は、本発明方法を適用してランプハウジング内に
配線を設ける実施例の工程図である。
FIG. 1 is a process diagram of an embodiment in which wiring is provided within a lamp housing by applying the method of the present invention.

第2図、第3図について後述する構造の、長尺の配線箔
膜81を、金型(雌)82と金型(雉)83との間に張
り渡し、 金型(雄)83を支持している移動ベース84を矢印a
の如く前進させ、 第1図(B)に示す如く配線箔膜81を挟みつけて型合
わせし、 (A)図に示したインジェクタ85を矢印すの如く前進
させて合成樹脂材によってハウジング1(第1図(B)
)を射出成形する。
A long wiring foil film 81 having a structure to be described later with reference to FIGS. 2 and 3 is stretched between a mold (female) 82 and a mold (pheasant) 83 to support the mold (male) 83. Arrow a indicates the moving base 84
The wiring foil film 81 is sandwiched and molded together as shown in FIG. 1(B), and the injector 85 shown in FIG. 1(A) is moved forward as shown by the arrow and the housing 1 ( Figure 1 (B)
) is injection molded.

上記の配線箔膜81の平面図を第2図に示す。A plan view of the above wiring foil film 81 is shown in FIG.

第7図(試案)に示した導電パターン80a、 80b
と略同形状の導電パターン81D+−81DZが配列さ
れている(破線で描いたのは、第3図について後述する
如く保護層などで覆われているからである。
Conductive patterns 80a and 80b shown in FIG. 7 (draft)
Conductive patterns 81D+-81DZ having substantially the same shape are arranged (the reason why they are drawn with broken lines is that they are covered with a protective layer etc. as will be described later with reference to FIG. 3).

第3図は上記配線箔膜81の断面を模式的に描いた説明
図である。
FIG. 3 is an explanatory diagram schematically depicting a cross section of the wiring foil film 81. As shown in FIG.

81aはポリエステル製のベースフィルムである。81a is a polyester base film.

81bはワックスで構成した離型層である。81b is a release layer made of wax.

81cはアクリル樹脂製の保護層であって、金属層81
dを覆っている。この保護層81cには礼状の空隙81
cm1が設けられ、金属層81dの微小区域を露出させ
る。この露出部はハンダ付のために設けたものであって
、第2図のハンダ付部81Hに対応する。
81c is a protective layer made of acrylic resin, and the metal layer 81
It covers d. This protective layer 81c has a gap 81 for a thank you note.
cm1 is provided to expose a minute area of the metal layer 81d. This exposed portion is provided for soldering and corresponds to the soldering portion 81H in FIG. 2.

第2図の状態においては、前記礼状の空隙81cm1は
離型剤(ワックス)で埋められており、金属層のハンダ
付部は離型されたときに露出する。
In the state shown in FIG. 2, the void 81 cm1 of the thank you note is filled with a mold release agent (wax), and the soldered portion of the metal layer is exposed when the mold is released.

前記の金属層Bidは、銅を蒸着処理して構成した。The metal layer Bid was formed by depositing copper.

銅は電気抵抗が少なく、ハンダ付が容易で、化学的に安
定で、耐熱性が有るので好適である。
Copper is suitable because it has low electrical resistance, is easy to solder, is chemically stable, and has heat resistance.

第2図に示したように、配線箔膜は長尺のテープ状をな
し、導電パターン81D+、81Dzの配列ピッチに合
わせて位置決めマーク81M1 、81M2が配列され
ている。
As shown in FIG. 2, the wiring foil film has a long tape shape, and positioning marks 81M1 and 81M2 are arranged in accordance with the arrangement pitch of the conductive patterns 81D+ and 81Dz.

第1図(A)の工程において、光電センサ87が前記位
置決めマーク81M+、81M2を検出し、導電パター
ンを金型に対して正しく位置せしめる。
In the process shown in FIG. 1(A), the photoelectric sensor 87 detects the positioning marks 81M+ and 81M2, and correctly positions the conductive pattern with respect to the mold.

第1図(B)のようにしてハウジング1を射出成形し、
同図(C)のように型開きしてハウジング1を取り出す
と、配線箔膜81を構成している多層構造の内、ベース
フィルム81aと離型層81bとを残して、その他の層
はハウジング1の表面に固着し、配線層81fが形成さ
れる。
Injection mold the housing 1 as shown in FIG. 1(B),
When the mold is opened and the housing 1 is taken out as shown in FIG. 1, and a wiring layer 81f is formed.

第4図(B)は上記配線層81f付近の断面図である。FIG. 4(B) is a cross-sectional view of the vicinity of the wiring layer 81f.

接着層81eはハウジング1と同系の合成樹脂であるた
め相溶性が良く、融着していて境界が不明瞭になってい
る。
Since the adhesive layer 81e is made of the same synthetic resin as the housing 1, it has good compatibility and is fused, making the boundary unclear.

保護層81cの礼状の空隙81cmtは金属層81dの
微小部分を露出させて、ハンダ付を可能ならしめている
The thank-you gap 81cmt in the protective layer 81c exposes a minute portion of the metal layer 81d, making soldering possible.

第4図(A)は射出成形されたハウジング1の斜視図で
ある。前述の金属層81dが該ハウジング1内面に固着
されて導電パターン81D、、81D2を形成している
FIG. 4(A) is a perspective view of the injection-molded housing 1. The aforementioned metal layer 81d is fixed to the inner surface of the housing 1 to form conductive patterns 81D, 81D2.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明の配線方法によれば合成樹
脂製部材(例えばランプハウジング)の中に配線基板を
収納するスペースを必要とせず、合成樹脂製部材の射出
成形と同時に配線が行われるので射出成形後の加工を必
要とせず、しかも誤配線の虞れが無いという優れた実用
的効果を奏する。
As explained above, according to the wiring method of the present invention, there is no need for a space for storing a wiring board in a synthetic resin member (for example, a lamp housing), and wiring can be performed at the same time as injection molding of the synthetic resin member. Therefore, there is no need for processing after injection molding, and there is no risk of incorrect wiring, which is an excellent practical effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る配線方法の一実施例を示す工程図
である。 第2図は上記実施例における配線箔膜の平面図、第3図
は同じく断面図である。 第4図は上記実施例の作用、効果を説明するための図で
あって、同図(A)は射出成形した合成樹脂製部材の斜
視図、(B)はその部分的断面図である。 第5図及び第6図は、それぞれ従来例を説明するための
斜視図である。 第7図は試案に係る配線方法を示し、同図(A)は配線
基板の斜視図、同図(B)はそのB−B断面図である。 81・・・配線箔膜、81a・・・ベースフィルム、8
1b・・・離型層、81c・・・保護層、 81cm1
・・・礼状の空隙、81d・・・金属層、81e・・・
接着層、82・・・金型(雌)、83・・・金型(雄)
、84・・・ベース、85・・・インジェクタ、87・
・・光電センサ。 第2図
FIG. 1 is a process diagram showing an embodiment of the wiring method according to the present invention. FIG. 2 is a plan view of the wiring foil film in the above embodiment, and FIG. 3 is a sectional view thereof. FIG. 4 is a diagram for explaining the function and effect of the above embodiment, in which (A) is a perspective view of an injection-molded synthetic resin member, and (B) is a partial sectional view thereof. FIGS. 5 and 6 are perspective views for explaining conventional examples, respectively. FIG. 7 shows a wiring method according to a tentative plan, and FIG. 7(A) is a perspective view of a wiring board, and FIG. 7(B) is a sectional view taken along line B-B. 81... Wiring foil film, 81a... Base film, 8
1b...Release layer, 81c...Protective layer, 81cm1
...Gap in thank you note, 81d...Metal layer, 81e...
Adhesive layer, 82... Mold (female), 83... Mold (male)
, 84... base, 85... injector, 87...
...Photoelectric sensor. Figure 2

Claims (1)

【特許請求の範囲】[Claims] 1.ハウジング,カバー,ケース等の合成樹脂製部材と
、その合成樹脂製部材上に一体に配設して電気回路のパ
ターンを構成する導電性部材の層を設けて車両用灯具に
配線する方法において、導電パターンの形状に構成した
金属層と、接着剤層とを有する配線箔膜を構成し、 前記合成樹脂製部材射出成形用の複数の金型の間に上記
配線箔膜を挟みこんで合成樹脂製部材を射出成形し、 前記の金属層を合成樹脂製部材に固着せしめることを特
徴とする車両用灯具の配線方法。
1. In a method of wiring a vehicle lamp by providing a synthetic resin member such as a housing, a cover, a case, and a layer of a conductive member that is integrally arranged on the synthetic resin member to form an electric circuit pattern, A wiring foil film is formed that has a metal layer configured in the shape of a conductive pattern and an adhesive layer, and the wiring foil film is sandwiched between a plurality of molds for injection molding of the synthetic resin member. 1. A method for wiring a vehicle lamp, comprising injection molding a synthetic resin member and fixing the metal layer to the synthetic resin member.
JP63283945A 1988-11-11 1988-11-11 Wiring method for vehicle lighting fixture Pending JPH02133255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63283945A JPH02133255A (en) 1988-11-11 1988-11-11 Wiring method for vehicle lighting fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63283945A JPH02133255A (en) 1988-11-11 1988-11-11 Wiring method for vehicle lighting fixture

Publications (1)

Publication Number Publication Date
JPH02133255A true JPH02133255A (en) 1990-05-22

Family

ID=17672258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63283945A Pending JPH02133255A (en) 1988-11-11 1988-11-11 Wiring method for vehicle lighting fixture

Country Status (1)

Country Link
JP (1) JPH02133255A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316941B2 (en) * 1979-04-16 1988-04-12 Ricoh Kk
JPS63116496A (en) * 1986-11-04 1988-05-20 ミツク電子工業株式会社 Manufacture of simple wiring board
JPS63132499A (en) * 1986-11-25 1988-06-04 古河電気工業株式会社 Manufacture of circuit board
JPS63258095A (en) * 1987-04-15 1988-10-25 キヤノン株式会社 Resin molded product with conductor pattern and method of molding

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316941B2 (en) * 1979-04-16 1988-04-12 Ricoh Kk
JPS63116496A (en) * 1986-11-04 1988-05-20 ミツク電子工業株式会社 Manufacture of simple wiring board
JPS63132499A (en) * 1986-11-25 1988-06-04 古河電気工業株式会社 Manufacture of circuit board
JPS63258095A (en) * 1987-04-15 1988-10-25 キヤノン株式会社 Resin molded product with conductor pattern and method of molding

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