JPH02133224U - - Google Patents

Info

Publication number
JPH02133224U
JPH02133224U JP4153989U JP4153989U JPH02133224U JP H02133224 U JPH02133224 U JP H02133224U JP 4153989 U JP4153989 U JP 4153989U JP 4153989 U JP4153989 U JP 4153989U JP H02133224 U JPH02133224 U JP H02133224U
Authority
JP
Japan
Prior art keywords
mold
connection structure
engaging protrusions
insertion hole
side surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4153989U
Other languages
Japanese (ja)
Other versions
JPH0450986Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989041539U priority Critical patent/JPH0450986Y2/ja
Publication of JPH02133224U publication Critical patent/JPH02133224U/ja
Application granted granted Critical
Publication of JPH0450986Y2 publication Critical patent/JPH0450986Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Mounting, Exchange, And Manufacturing Of Dies (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案が適用された金型の一例を示す
説明図、第2図は第1図に示す金型の断面説明図
、第3図は第1図に示す金型に設けられた本考案
の金型連結構造体の一例を示す説明図、第4図お
よび第5図は、本考案の好適な第2実施例の説明
図、第6図は本考案の好適な第3実施例の説明図
、第7図は従来の金型連結構造体の説明図である
。 10……上型、20……下型、50……連結部
、52……第1の係合突部、54……第2の係合
突部、56……第1の係合穴、58……第2の係
合穴、60……連結板、62……抜け止め部、7
0……第1の埋込みボルト、72……第2の埋込
みボルト、74……第1のピン挿通孔、76……
第2のピン挿通孔、78……第1の抜け止めピン
、80……第2の抜け止めピン。
Fig. 1 is an explanatory diagram showing an example of a mold to which the present invention is applied, Fig. 2 is a cross-sectional explanatory diagram of the mold shown in Fig. 1, and Fig. 3 is an explanatory diagram showing an example of a mold to which the present invention is applied. An explanatory diagram showing an example of the mold connection structure of the present invention, FIGS. 4 and 5 are explanatory diagrams of a second preferred embodiment of the present invention, and FIG. 6 is a preferred third embodiment of the present invention. FIG. 7 is an explanatory diagram of a conventional mold connection structure. 10... Upper mold, 20... Lower mold, 50... Connecting portion, 52... First engaging protrusion, 54... Second engaging protrusion, 56... First engaging hole, 58... Second engagement hole, 60... Connecting plate, 62... Retaining portion, 7
0...First embedded bolt, 72... Second embedded bolt, 74... First pin insertion hole, 76...
Second pin insertion hole, 78...first retaining pin, 80...second retaining pin.

Claims (1)

【実用新案登録請求の範囲】 (1) 上型及び下型の側面に複数の連結部を設け
上型及び下型を連結する金型連結構造体において
、 前記連結部は、 上型の側面に予め取付け固定された第1の係合
突部と、 下型の側面に予め取付け固定された第2の係合
突部と、 第1及び第2の係合穴に前記第1及び第2の係
合突部を着脱自在に係合し上型及び下型を連結す
る連結板と、 第1および第2の係合突部からの連結板の抜け
を防止する抜け止め部と、 を含むことを特徴とする金型連結構造体。 (2) 請求項(1)において、 前記第1及び第2の突部は、上型及び下型の側
面所定位置に突設された埋込ボルトからなること
を特徴とする金型連結構造体。 (3) 請求項(1),(2)のいずれかにおいて、 前記抜け止め部は、 前記第1及び第2の係合突部の少なくともいず
れか一方に設けられたピン挿通孔と、前記ピン挿
通孔に挿通される抜け止ピンとを含むことを特徴
とする金型連結構造体。 (4) 請求項(1)〜(3)のいずれかにおいて、 前記抜け止め部は、 前記第1および第2の係合突部の少なくともい
ずれか一方を鍵形状とし、 前記第1および第2の係合穴の少なくともいず
れか一方を鍵穴形状として成ることを特徴とする
金型連結構造体。
[Claims for Utility Model Registration] (1) In a mold connection structure that connects the upper and lower molds by providing a plurality of connecting parts on the side surfaces of the upper mold and the lower mold, the connecting parts are provided on the side surfaces of the upper mold. A first engagement protrusion that is attached and fixed in advance, a second engagement protrusion that is attached and fixed in advance to the side surface of the lower mold, and the first and second engagement holes that are inserted into the first and second engagement holes. A connecting plate that removably engages the engaging protrusion and connects the upper mold and the lower mold, and a retaining part that prevents the connecting plate from coming off from the first and second engaging protrusions. A mold connection structure featuring: (2) The mold connection structure according to claim (1), wherein the first and second protrusions are embedded bolts protruding from predetermined positions on the side surfaces of the upper mold and the lower mold. . (3) In either of claims (1) and (2), the retaining portion includes a pin insertion hole provided in at least one of the first and second engaging protrusions, and a pin insertion hole provided in at least one of the first and second engaging protrusions. A mold connection structure comprising a retaining pin inserted into an insertion hole. (4) In any one of claims (1) to (3), the retaining part has at least one of the first and second engaging protrusions in a key shape, and the first and second engaging protrusions have a key shape. A mold connection structure characterized in that at least one of the engagement holes is keyhole-shaped.
JP1989041539U 1989-04-07 1989-04-07 Expired JPH0450986Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989041539U JPH0450986Y2 (en) 1989-04-07 1989-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989041539U JPH0450986Y2 (en) 1989-04-07 1989-04-07

Publications (2)

Publication Number Publication Date
JPH02133224U true JPH02133224U (en) 1990-11-06
JPH0450986Y2 JPH0450986Y2 (en) 1992-12-01

Family

ID=31552291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989041539U Expired JPH0450986Y2 (en) 1989-04-07 1989-04-07

Country Status (1)

Country Link
JP (1) JPH0450986Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557305U (en) * 1978-06-27 1980-01-18
JPS5650523U (en) * 1979-08-15 1981-05-06

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52102139A (en) * 1976-02-20 1977-08-26 Kobayashi Seitai Sangyo Preventing method for generating high moisture content mushroom and its rolled paper in bottleecultured edible mushroom

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557305U (en) * 1978-06-27 1980-01-18
JPS5650523U (en) * 1979-08-15 1981-05-06

Also Published As

Publication number Publication date
JPH0450986Y2 (en) 1992-12-01

Similar Documents

Publication Publication Date Title
JPH0387613U (en)
JPS63106826U (en)
JPH02133224U (en)
JPS6397327U (en)
JPH0278635U (en)
JPH0284897U (en)
JPS61181711U (en)
JPH0329637U (en)
JPS6378148U (en)
JPS63106822U (en)
JPS62123108U (en)
JPH0284896U (en)
JPH0369558U (en)
JPS63106823U (en)
JPH02129547U (en)
JPH0225994U (en)
JPS63106825U (en)
JPH0437602U (en)
JPS62144403U (en)
JPS6380109U (en)
JPS63178117U (en)
JPH02110279U (en)
JPS62155935U (en)
JPS63143545U (en)
JPS6185170U (en)