JPH02133038U - - Google Patents

Info

Publication number
JPH02133038U
JPH02133038U JP1989042012U JP4201289U JPH02133038U JP H02133038 U JPH02133038 U JP H02133038U JP 1989042012 U JP1989042012 U JP 1989042012U JP 4201289 U JP4201289 U JP 4201289U JP H02133038 U JPH02133038 U JP H02133038U
Authority
JP
Japan
Prior art keywords
light receiving
integrated circuit
lead frame
receiving element
receiving unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989042012U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989042012U priority Critical patent/JPH02133038U/ja
Publication of JPH02133038U publication Critical patent/JPH02133038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Optical Communication System (AREA)

Description

【図面の簡単な説明】
第１図及び第２図はこの考案の一実施例に係る
光伝送用受信ユニツトを示す正面図と断面図、第
３図はこの考案の変形例を示す正面図、第４図は
同じく他の変形例を示す側面図、第５図ａ，ｂは
更に他の変形例を示す正面図と側面図、第６図は
従来の光伝送用受信ユニツトを示す正面透視図、
第７図は第６図の従来の光伝送用受信ユニツトを
光受信モジユールに実装した状態を示す断面図、
第８図は他の従来の光伝送用受信ユニツトを示す
断面図である。 １……リードフレーム、２……受光素子、３…
…集積回路素子、４……モールド絶縁体、５……
外部端子、１２……シールド板、１３……接地リ
ード用外部端子、１４……受光部、１５……透孔
。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレームに受光素子と集積回路素子が取
    付けられ、更にこれら受光素子、集積回路素子及
    びリードフレームの大部分が光学的に透明なモー
    ルド絶縁体により覆われてなる光伝送用受信ユニ
    ツトにおいて、 上記リードフレームの一部が上記モールド絶縁
    体より露出して一体に延長されてシールド板が形
    成され、このシールド板は少なくとも上記受光素
    子の受光部を除き受光素子と集積回路素子のそれ
    ぞれ所定部分を覆うように構成されてなることを
    特徴とする光伝送用受信ユニツト。
JP1989042012U 1989-04-12 1989-04-12 Pending JPH02133038U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989042012U JPH02133038U (ja) 1989-04-12 1989-04-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989042012U JPH02133038U (ja) 1989-04-12 1989-04-12

Publications (1)

Publication Number Publication Date
JPH02133038U true JPH02133038U (ja) 1990-11-05

Family

ID=31553180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989042012U Pending JPH02133038U (ja) 1989-04-12 1989-04-12

Country Status (1)

Country Link
JP (1) JPH02133038U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497360U (ja) * 1991-01-21 1992-08-24
JP2007300055A (ja) * 2006-05-02 2007-11-15 Everlight Electronics Co Ltd 表面実装モジュールのパッケージ構造
JP4708014B2 (ja) * 2004-12-27 2011-06-22 ローム株式会社 光半導体装置
JP2013098463A (ja) * 2011-11-04 2013-05-20 Auto Network Gijutsu Kenkyusho:Kk 光電変換モジュール、及び光コネクタ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497360U (ja) * 1991-01-21 1992-08-24
JP4708014B2 (ja) * 2004-12-27 2011-06-22 ローム株式会社 光半導体装置
JP2007300055A (ja) * 2006-05-02 2007-11-15 Everlight Electronics Co Ltd 表面実装モジュールのパッケージ構造
JP2013098463A (ja) * 2011-11-04 2013-05-20 Auto Network Gijutsu Kenkyusho:Kk 光電変換モジュール、及び光コネクタ

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