JPH02132948U - - Google Patents
Info
- Publication number
- JPH02132948U JPH02132948U JP1989041780U JP4178089U JPH02132948U JP H02132948 U JPH02132948 U JP H02132948U JP 1989041780 U JP1989041780 U JP 1989041780U JP 4178089 U JP4178089 U JP 4178089U JP H02132948 U JPH02132948 U JP H02132948U
- Authority
- JP
- Japan
- Prior art keywords
- reflow chip
- reflow
- pad
- chip structure
- bonding apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041780U JPH02132948U (enExample) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041780U JPH02132948U (enExample) | 1989-04-10 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132948U true JPH02132948U (enExample) | 1990-11-05 |
Family
ID=31552743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989041780U Pending JPH02132948U (enExample) | 1989-04-10 | 1989-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132948U (enExample) |
-
1989
- 1989-04-10 JP JP1989041780U patent/JPH02132948U/ja active Pending