JPH02131350U - - Google Patents
Info
- Publication number
- JPH02131350U JPH02131350U JP1989040167U JP4016789U JPH02131350U JP H02131350 U JPH02131350 U JP H02131350U JP 1989040167 U JP1989040167 U JP 1989040167U JP 4016789 U JP4016789 U JP 4016789U JP H02131350 U JPH02131350 U JP H02131350U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- module
- outwardly
- filled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989040167U JP2518775Y2 (ja) | 1989-04-05 | 1989-04-05 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989040167U JP2518775Y2 (ja) | 1989-04-05 | 1989-04-05 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02131350U true JPH02131350U (US20020051482A1-20020502-M00012.png) | 1990-10-31 |
| JP2518775Y2 JP2518775Y2 (ja) | 1996-11-27 |
Family
ID=31549724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989040167U Expired - Lifetime JP2518775Y2 (ja) | 1989-04-05 | 1989-04-05 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2518775Y2 (US20020051482A1-20020502-M00012.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004535532A (ja) * | 2001-03-07 | 2004-11-25 | シーメンス アクチエンゲゼルシヤフト | メカトロニックトランスミッション制御装置 |
| JP2014146723A (ja) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | パワー半導体装置 |
| US8869775B2 (en) | 2010-02-09 | 2014-10-28 | Denso Corporation | Fuel supply apparatus |
| DE112014006676B4 (de) * | 2014-06-25 | 2021-01-07 | Hitachi, Ltd. | Leistungsmodulvorrichtung |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154158U (US20020051482A1-20020502-M00012.png) * | 1981-03-20 | 1982-09-28 | ||
| JPS6420740U (US20020051482A1-20020502-M00012.png) * | 1987-07-29 | 1989-02-01 |
-
1989
- 1989-04-05 JP JP1989040167U patent/JP2518775Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57154158U (US20020051482A1-20020502-M00012.png) * | 1981-03-20 | 1982-09-28 | ||
| JPS6420740U (US20020051482A1-20020502-M00012.png) * | 1987-07-29 | 1989-02-01 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004535532A (ja) * | 2001-03-07 | 2004-11-25 | シーメンス アクチエンゲゼルシヤフト | メカトロニックトランスミッション制御装置 |
| US8869775B2 (en) | 2010-02-09 | 2014-10-28 | Denso Corporation | Fuel supply apparatus |
| JP2014146723A (ja) * | 2013-01-30 | 2014-08-14 | Hitachi Power Semiconductor Device Ltd | パワー半導体装置 |
| DE112014006676B4 (de) * | 2014-06-25 | 2021-01-07 | Hitachi, Ltd. | Leistungsmodulvorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2518775Y2 (ja) | 1996-11-27 |
