JPH02129769U - - Google Patents
Info
- Publication number
- JPH02129769U JPH02129769U JP5774988U JP5774988U JPH02129769U JP H02129769 U JPH02129769 U JP H02129769U JP 5774988 U JP5774988 U JP 5774988U JP 5774988 U JP5774988 U JP 5774988U JP H02129769 U JPH02129769 U JP H02129769U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- hybrid
- residual portion
- electronic component
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5774988U JPH02129769U (fi) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5774988U JPH02129769U (fi) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129769U true JPH02129769U (fi) | 1990-10-25 |
Family
ID=31582743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5774988U Pending JPH02129769U (fi) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129769U (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0566999U (ja) * | 1992-02-21 | 1993-09-03 | 昭和電工株式会社 | 回路用基板 |
-
1988
- 1988-04-28 JP JP5774988U patent/JPH02129769U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0566999U (ja) * | 1992-02-21 | 1993-09-03 | 昭和電工株式会社 | 回路用基板 |