JPH02129703U - - Google Patents
Info
- Publication number
- JPH02129703U JPH02129703U JP3930989U JP3930989U JPH02129703U JP H02129703 U JPH02129703 U JP H02129703U JP 3930989 U JP3930989 U JP 3930989U JP 3930989 U JP3930989 U JP 3930989U JP H02129703 U JPH02129703 U JP H02129703U
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating substrates
- flat coil
- multilayer flat
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002313 adhesive film Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Windings For Motors And Generators (AREA)
Description
第１図は本考案に係る多層偏平コイルを作製す
るための積層部材を拡散して示す構成図、第２図
は接合工程の状態を示す説明図、第３図は接合工
程のフローチヤート、第４図は多層偏平コイルが
適用された偏平モータの構成例を示す一部断面を
含む側面図、第５図は第４図に示される多層偏平
コイルの一部拡大図である。
２……第１層のリードフレーム、３……接着剤
フイルム、４……第２層のリードフレーム、５…
…接着剤フイルム、６……第３層のリードフレー
ム、７……接着剤フイルム、８……第４層のリー
ドフレーム。
Fig. 1 is a configuration diagram showing the spread of laminated members for producing a multilayer flat coil according to the present invention, Fig. 2 is an explanatory diagram showing the state of the bonding process, Fig. 3 is a flowchart of the bonding process, FIG. 4 is a side view including a partial cross section showing a configuration example of a flat motor to which a multilayer flat coil is applied, and FIG. 5 is a partially enlarged view of the multilayer flat coil shown in FIG. 4. 2... First layer lead frame, 3... Adhesive film, 4... Second layer lead frame, 5...
... Adhesive film, 6 ... Third layer lead frame, 7 ... Adhesive film, 8 ... Fourth layer lead frame.
Claims (1)
が夫々に形成される、複数枚のフイルム状絶縁基
体と、 当該複数枚のフイルム状絶縁基体の間に配設さ
れて、夫々の複数枚のフイルム状絶縁基体を加熱
圧着により接合せしめる、熱硬化性の接着剤フイ
ルムと、 を具備して構成されることを特徴とする多層偏
平コイル。[Claims for Utility Model Registration] A plurality of film-like insulating substrates each having a plurality of spiral coil portions each using a copper thin film member, and disposed between the plurality of film-like insulating substrates. 1. A multilayer flat coil comprising: a thermosetting adhesive film for joining a plurality of film-like insulating substrates by heat-pressure bonding;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3930989U JPH02129703U (en) | 1989-04-03 | 1989-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3930989U JPH02129703U (en) | 1989-04-03 | 1989-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129703U true JPH02129703U (en) | 1990-10-25 |
Family
ID=31548109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3930989U Pending JPH02129703U (en) | 1989-04-03 | 1989-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129703U (en) |
-
1989
- 1989-04-03 JP JP3930989U patent/JPH02129703U/ja active Pending
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