JPH0212851A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPH0212851A JPH0212851A JP63160851A JP16085188A JPH0212851A JP H0212851 A JPH0212851 A JP H0212851A JP 63160851 A JP63160851 A JP 63160851A JP 16085188 A JP16085188 A JP 16085188A JP H0212851 A JPH0212851 A JP H0212851A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- capillary
- speed
- bonding
- rocking arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 abstract description 7
- 230000007246 mechanism Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000011435 rock Substances 0.000 abstract 1
- 239000008188 pellet Substances 0.000 description 10
- 230000008602 contraction Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
- H01L2224/78823—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、半導体装置の組立工程におけるワイヤボンデ
ィング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a wire bonding device used in the assembly process of semiconductor devices.
（従来の技術）
従来のワイヤボンディング装置として、特公昭６２−４
３３３６号公報に開示されて−いるような装置が知られ
ている。この装置は、第９図に示されているように、一
端にキャピラリ１６を有し、他端には永久磁石１７とヨ
ーク１８からなる磁気回路１９の空隙内を磁束と直角な
面内で揺動可能なムービングコイル２０を有し、上記磁
気回路１９と協働して揺動型モータを構成する揺動アー
ム２１と、上記揺動アーム２１の揺動角度を検出する位
置検出器２２および上記揺動アームの揺動速度を検出す
る速度検出器２３を備えて構成されている。(Prior art) As a conventional wire bonding device,
A device as disclosed in Japanese Patent No. 3336 is known. As shown in FIG. 9, this device has a capillary 16 at one end, and oscillates in a plane perpendicular to the magnetic flux within the air gap of a magnetic circuit 19 consisting of a permanent magnet 17 and a yoke 18 at the other end. a swinging arm 21 having a movable moving coil 20 and cooperating with the magnetic circuit 19 to form a swinging motor; a position detector 22 for detecting the swinging angle of the swinging arm 21; It is configured to include a speed detector 23 that detects the swinging speed of the swinging arm.
このように構成された装置において、上記揺動アーム２
１の位置および速度を位置検出器２２、速度検出器２３
を用いて検出しなからムービングコイル２０の電流を制
御することでキャピラリ１６の軌跡およびボンディング
圧力を任意に制御しながらボンディングをしていた。In the device configured in this way, the swing arm 2
The position and speed of 1 are detected by the position detector 22 and the speed detector 23.
Bonding was performed while arbitrarily controlling the trajectory of the capillary 16 and the bonding pressure by controlling the current of the moving coil 20 without detecting the current using the moving coil 20.
（発明が解決しようとする課題）
上述した従来技術においては、上記磁気回路１９の近傍
に上記位置検出器２２や速度検出器２３を設置した場合
、上記磁気回路１９の磁束の影響を受け、特に速度検出
器２３はノイズを発生したり誤検出を招いたりし、その
結果精度良くボンディングすることができないという問
題点を生じることがあった。(Problem to be Solved by the Invention) In the above-mentioned conventional technology, when the position detector 22 and the speed detector 23 are installed near the magnetic circuit 19, they are affected by the magnetic flux of the magnetic circuit 19, and in particular, The speed detector 23 may generate noise or cause erroneous detection, resulting in a problem that bonding cannot be performed with high accuracy.
また、より高速でのボンディングを行うためには、応答
性の速い駆動系を用いなければならないという問題点も
あった。Furthermore, in order to perform bonding at higher speeds, there is a problem in that a drive system with quick response must be used.
［発明の構成コ
（課題を解決するための手段）
本発明のワイヤボンディング装置は、一端にキャピラリ
を有しかつこのキャピラリ取付位置と異なる位置に圧電
素子を取付けた揺動アームと、この揺動アームを揺動自
在に支持する軸受体とを有し、上記揺動アームは上記圧
電素子の作動により上記キャピラリの動作方向に揺動す
るように構成される。[Structure of the Invention (Means for Solving the Problem) The wire bonding apparatus of the present invention includes a swinging arm having a capillary at one end and a piezoelectric element mounted at a position different from the capillary mounting position, and and a bearing body that swingably supports the arm, and the swing arm is configured to swing in the operating direction of the capillary by the operation of the piezoelectric element.
（作 用）
本発明によれば、機構が簡単でかつ軽量で、さらにボン
ディング動作の高速化を得ることができ、しかも精度良
くボンディングすることができるワイヤボンディング装
置が得られる。(Function) According to the present invention, it is possible to obtain a wire bonding device that has a simple and lightweight mechanism, can speed up the bonding operation, and can perform bonding with high precision.
（実施例）
以下、本発明の一実施例ワイヤボンディング装置を図面
を参照して説明する。(Embodiment) Hereinafter, a wire bonding apparatus according to an embodiment of the present invention will be described with reference to the drawings.
第１図乃至第３図は、本発明の一実施例を示す図で、揺
動アーム１は、軸受体２に支持された軸３の周りに同図
中矢印１０１のように揺動可能であり、上記揺動アーム
１の一端にはキャピラリ４、他端には上記揺動アーム１
に設けられた圧電素子取付体５を有している。上記軸受
体２は、ＸＹテーブル６上に設けられ、このＸＹテーブ
ル６上には圧電素子取付体７も設けられている。そして
、上記圧電素子取付体５．７には、上記揺動アーム１の
駆動源である圧電素子８が取付けられている。1 to 3 are views showing one embodiment of the present invention, in which a swinging arm 1 is swingable around a shaft 3 supported by a bearing body 2 as indicated by an arrow 101 in the drawings. There is a capillary 4 at one end of the swing arm 1, and a capillary 4 at the other end of the swing arm 1.
It has a piezoelectric element mounting body 5 provided on the piezoelectric element mounting body 5. The bearing body 2 is provided on an XY table 6, and a piezoelectric element mounting body 7 is also provided on this XY table 6. A piezoelectric element 8, which is a driving source for the swing arm 1, is attached to the piezoelectric element mounting body 5.7.
この圧電素子８は、所定の電圧を印加するとこの電圧に
応じた量だけ上記圧電素子取付体５，７間で矢印１０２
方向に微少変位伸縮し、この伸縮により上記揺動アーム
１は矢印１０１方向に揺動するように構成されている。When a predetermined voltage is applied to the piezoelectric element 8, the piezoelectric element 8 moves between the piezoelectric element mounting bodies 5 and 7 by an amount corresponding to the voltage indicated by the arrow 102.
The swing arm 1 is configured to swing in the direction of the arrow 101 due to this expansion and contraction.
また、上記揺動アーム１の揺動位置と揺動速度は、それ
ぞれ上記軸３に取付けられた位置検出器９および速度検
出器１０により検出される。キャピラリ４は金線１１を
保持し、この金線１１の先端をボンディングステージＰ
上の所定の位置に載置されたペレット１２のポンディン
グパッドに押圧し、ボンディングする。Further, the swinging position and swinging speed of the swinging arm 1 are detected by a position detector 9 and a speed detector 10 respectively attached to the shaft 3. The capillary 4 holds the gold wire 11, and the tip of the gold wire 11 is connected to the bonding stage P.
The pellet 12 placed at a predetermined position above is pressed against the bonding pad for bonding.
次に第４図により、本発明のボンディング装置の制御部
の構成を説明する。なお、第１図乃至第３図に示すワイ
ヤボンディング装置と同一の部位には同じ番号を付して
説明する。Next, the configuration of the control section of the bonding apparatus of the present invention will be explained with reference to FIG. Note that the same parts as those of the wire bonding apparatus shown in FIGS. 1 to 3 will be described with the same numbers.
第４図において、１３は制御部、１４は駆動回路、１５
は増幅器である。In FIG. 4, 13 is a control unit, 14 is a drive circuit, and 15 is a control unit.
is an amplifier.
上記制御部１３は、あらかじめ設定された速度テーブル
と上記位置検出器９と上記速度検出器１０からの出力に
より、キャピラリ４の位置と速度を制御する機能と、上
記位置検出器９の出力の変化を監視し、その変化が無く
なったときキャピラリ４がペレット１２に接触したと判
断する面検出の機能と、ペレット１２に一定の加圧力で
加圧を行う加圧力制御機能を有している。The control unit 13 has a function of controlling the position and speed of the capillary 4 based on a preset speed table and outputs from the position detector 9 and the speed detector 10, and changes in the output of the position detector 9. It has a surface detection function that monitors and determines that the capillary 4 has contacted the pellet 12 when the change disappears, and a pressurizing force control function that pressurizes the pellet 12 with a constant pressurizing force.
上記キャピラリ４は、上記ペレット１２の上方からペレ
ット１２より所定の高さに下降するまでは高速で移動で
きるように設定された制御信号に応じて高速で移動し、
上記キャピラリ４が所定の高さに達した後は低速の一定
速度で下降し、キャピラリ４はペレット１２に接触し所
定のボンディングを行う。The capillary 4 moves at high speed according to a control signal set to be able to move at high speed until it descends from above the pellet 12 to a predetermined height above the pellet 12,
After the capillary 4 reaches a predetermined height, it descends at a constant low speed, and the capillary 4 contacts the pellet 12 to perform predetermined bonding.
このボンディング工程において、上記キャピラリ４の軌
跡は上記位置検出器９、速度検出器１０によって検出さ
れている。この各検出信号は、上記制御部１３に入力さ
れ、この制御部１３は、あらかじめ設定されていた速度
テーブルと上記制御部１３に入力されたキャピラリ４の
位置および速度に対応する信号との偏差を計算し、上記
キャピラリ４があらかじめ設定された速度に追従して移
動できるように制御する。上記キャピラリ４が上記ペレ
ット１２に接触し、上記位置検出器９の出力が変化しな
くなった時、上記制御部１３は上記キャピラリ４が上記
ペレット１２に接触したと判断する。そして、上記制御
部１３は、ボンディング加圧力制御信号を上記駆動回路
１４を介して出力し、上記圧電素子８に一定の電圧が印
加されるように制御し、これにより上記ベレット１２に
は一定のボンディング圧力が加わる。In this bonding process, the trajectory of the capillary 4 is detected by the position detector 9 and speed detector 10. Each of these detection signals is input to the control section 13, and the control section 13 detects the deviation between the preset speed table and the signal corresponding to the position and speed of the capillary 4 input to the control section 13. The calculation is performed and the capillary 4 is controlled so that it can move following a preset speed. When the capillary 4 comes into contact with the pellet 12 and the output of the position detector 9 stops changing, the control section 13 determines that the capillary 4 has contacted the pellet 12. Then, the control unit 13 outputs a bonding force control signal via the drive circuit 14 and controls so that a constant voltage is applied to the piezoelectric element 8, thereby applying a constant voltage to the pellet 12. Bonding pressure is applied.
以上のように制御することで、高速のボンディング動作
および精度の良い安定したボンディングが行えるように
なる。By controlling as described above, high-speed bonding operation and accurate and stable bonding can be performed.
さらに、上述したキャピラリ４の移動速度、ボンデイン
ク圧力はすべて電気的に設定することができる。Further, the moving speed of the capillary 4 and the bonding ink pressure described above can all be set electrically.
ここで第１図に示すように、軸受体２に取り付けられた
輔３の中心位置から、圧電素子８の取付は位置の中心位
置までの距離Ａおよびキャピラリ４の中心位置までの距
離Ｂについて説明する。Here, as shown in FIG. 1, the distance A from the center position of the support 3 attached to the bearing body 2 to the center position of the mounting position of the piezoelectric element 8 and the distance B to the center position of the capillary 4 will be explained. do.
圧電素子８の変位量を、およそ全長の０．１％と仮定す
ると、全長Ｃが５０ｍｍの場合その変位量はおよそ５０
μｍとなる。また、キャピラリ４の上下方向のストロー
クは最低５ｍｍ必要であるとすると、距離Ａと距離Ｂの
比Ａ：Ｂは、Ａ：Ｂ−１７１００が適当と考えられる。Assuming that the amount of displacement of the piezoelectric element 8 is approximately 0.1% of the total length, when the total length C is 50 mm, the amount of displacement is approximately 50 mm.
It becomes μm. Further, assuming that the vertical stroke of the capillary 4 is required to be at least 5 mm, it is considered appropriate that the ratio A:B of distance A to distance B is A:B-17100.
また、圧電素子８は概してその変位量が微小であるので
、実際には変位量拡大機構が必要となる場合がある。し
かし、ボンディングヘッドの構成を小形化するためには
、この変位量拡大機構は極力小さくする必要がある。そ
こで、小形で変位量の大きい圧電素子が必要になるが、
−例として積層型の圧電素子が有効である。Furthermore, since the displacement amount of the piezoelectric element 8 is generally very small, a displacement amount enlarging mechanism may actually be required. However, in order to downsize the structure of the bonding head, it is necessary to make this displacement amount enlarging mechanism as small as possible. Therefore, a small piezoelectric element with a large displacement is required.
-For example, a laminated piezoelectric element is effective.
また、圧電素子の伸縮に関して、その伸長力と収縮力に
は相違があると考えられる。そこで２個の圧電素子を用
い、一方が伸びている時他方が縮むという差動式を採用
した実施例について説明する。Furthermore, regarding the expansion and contraction of the piezoelectric element, it is thought that there is a difference between the expansion force and the contraction force. Therefore, an embodiment will be described in which two piezoelectric elements are used and a differential type is adopted in which one is expanded while the other is compressed.
第２の実施例として第５図に示すように、圧電素子取付
体５の上下両面に圧電素子を取付けるようにしてもよい
。As a second embodiment, as shown in FIG. 5, piezoelectric elements may be attached to both the upper and lower surfaces of the piezoelectric element mounting body 5.
第３の実施例として第６図に示すように、揺動アーム１
の下側に圧電素子取付体５を設け、その左右両面に圧電
素子を圧電素子取付体７を介して取付けるようにしても
よい。As a third embodiment, as shown in FIG.
A piezoelectric element mounting body 5 may be provided on the lower side, and piezoelectric elements may be mounted on both left and right sides of the piezoelectric element mounting body 7 via piezoelectric element mounting bodies 7.
上記第２および第３の実施例において、２個の圧電素子
の伸縮のタイミングは、制御部１３において位置検出器
９、速度検出器１０からの出力と共に制御される。In the second and third embodiments described above, the timing of expansion and contraction of the two piezoelectric elements is controlled by the control section 13 together with the outputs from the position detector 9 and the speed detector 10.
また、第４の実施例として第７図に示すように、第３の
実施例に使用した２個の圧電素子の一方のみを使用して
、第１の実施例と同様に制御してもよい。Furthermore, as shown in FIG. 7 as a fourth embodiment, only one of the two piezoelectric elements used in the third embodiment may be used for control in the same manner as in the first embodiment. .
また、第５の実施例として第８図に示すように、第１の
実施例に示した構成の装置の圧電素子取付体５．７間に
ばね２３を取付け、圧電素子の収縮の際に一定の収縮力
を付与するようにして、確実に圧電素子８が収縮するよ
うにしてもよい。In addition, as a fifth embodiment, as shown in FIG. 8, a spring 23 is attached between the piezoelectric element mounting bodies 5 and 7 of the apparatus configured as shown in the first embodiment, and a spring 23 is installed between the piezoelectric element mounting bodies 5 and 7 to maintain a constant value when the piezoelectric element contracts. Alternatively, the piezoelectric element 8 may be reliably contracted by applying a contracting force of .
また、上記各実施例では圧電素子は揺動アームの単一箇
所に設けられた圧電素子取付体に取付けられていたが、
揺動アームの複数箇所に圧電素子取付体を設け、これら
の圧電素子取付体に圧電素子を取付けるようにしてもよ
い。また、上記各実施例では、圧電素子８は軸受体２に
支持された軸３を挟んでキャピラリ４と反対の位置に設
けられていたが、キャピラリ４と同じ側に設けてもよい
。Furthermore, in each of the above embodiments, the piezoelectric element was attached to a piezoelectric element mounting body provided at a single location on the swing arm.
Piezoelectric element attachment bodies may be provided at a plurality of locations on the swinging arm, and piezoelectric elements may be attached to these piezoelectric element attachment bodies. Further, in each of the above embodiments, the piezoelectric element 8 was provided at a position opposite to the capillary 4 across the shaft 3 supported by the bearing body 2, but it may be provided on the same side as the capillary 4.
以上述べたように制御することで、キャピラリ４の高速
の揺動が容易であり、しかも位置検出器９および速度検
出器１０からの出力信号を検出しながら圧電索子８に印
加する電圧を制御するので、異品種のペレットに対する
ボンディング動作、条件の変更に対する自由度も高く、
またボンディング圧力も容易に制御することができる。By controlling as described above, the capillary 4 can be easily oscillated at high speed, and the voltage applied to the piezoelectric cord 8 can be controlled while detecting the output signals from the position detector 9 and the speed detector 10. Therefore, there is a high degree of freedom in bonding operations for pellets of different types and in changing conditions.
Furthermore, the bonding pressure can be easily controlled.
さらに、揺動アーム１の駆動源の構造が簡略化されてい
るため、装置全体の構造が簡略化され、゛軽量化をはか
ることもできる。Furthermore, since the structure of the drive source of the swing arm 1 is simplified, the structure of the entire device is simplified and the weight can be reduced.
また、上記各実施例では速度検出器を用いていたが、速
度検出器を使用せず位置検出器の出力を速度に変換して
制御することも可能である。Furthermore, although a speed detector is used in each of the above embodiments, it is also possible to convert the output of the position detector into speed and control the speed without using the speed detector.
上記各実施例において、揺動アーム１は軸３に固定的に
取付けられ、軸３を軸受体２に非固定的に取付けるか、
あるいはまた揺動アーム１を軸３に非固定的に取付け、
軸３を軸受体２に固定的に取付けてもよい。In each of the above embodiments, the swing arm 1 is fixedly attached to the shaft 3, and the shaft 3 is non-fixedly attached to the bearing body 2, or
Alternatively, the swing arm 1 is non-fixedly attached to the shaft 3,
The shaft 3 may be fixedly attached to the bearing body 2.
上記各実施例で使用した位置検出器は、揺動アームの回
転軸に取付けた回転方式のものを使用していたが、圧電
素子に直接的または間接的に直線方式の位置検出器を取
付けて位置検出をしてもよい。The position detector used in each of the above embodiments was a rotating type that was attached to the rotating shaft of the swing arm, but a linear type position detector was attached directly or indirectly to the piezoelectric element. Position detection may also be performed.
その他、グイボンディング装置、チップマウント装置に
本発明のような方式を採用することも可能である。In addition, it is also possible to employ the method of the present invention in a bonding device or a chip mounting device.
［発明の効果］
以上のように、本発明のワイヤボンディング装置を用い
れば、より高速でかつ極めて精度の良いボンディングを
実施することができる。[Effects of the Invention] As described above, by using the wire bonding apparatus of the present invention, bonding can be performed at higher speed and with extremely high precision.
第１図は本発明の一実施例を示す側面図、第２図は本発
明の一実施例を示す斜視図、第３図は第２図の斜視方向
と反対側から斜視した図、第４図は本発明の制御回路の
一例を示すブロック図、第５図乃至第７図は揺動アーム
駆動機構の他の実施例を簡単に示した要部断面図、第８
図は他の実施例を示す図、第９図は従来のワイヤボンデ
ィング装置の構成を示す図である。
１・・・揺動アーム ２・・・軸受体３・・・軸
４−・・キャピラリ・・・圧電素子FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 is a perspective view showing an embodiment of the present invention, FIG. 3 is a perspective view from the opposite side to the perspective direction of FIG. 2, and FIG. The figure is a block diagram showing an example of the control circuit of the present invention, FIGS. 5 to 7 are main part sectional views briefly showing other embodiments of the swing arm drive mechanism, and
The figure shows another embodiment, and FIG. 9 is a diagram showing the configuration of a conventional wire bonding apparatus. 1... Swinging arm 2... Bearing body 3... Shaft 4-... Capillary... Piezoelectric element
Claims (1)
異なる位置に圧電素子を取付けた揺動アームと、この揺
動アームを揺動自在に支持する軸受体とを有し、上記揺
動アームは上記圧電素子の作動により上記キャピラリの
動作方向に揺動するように構成したことを特徴とするワ
イヤボンディング装置。The swing arm has a capillary at one end and a piezoelectric element mounted at a position different from the capillary mounting position, and a bearing body that swingably supports the swing arm. A wire bonding apparatus characterized in that the device is configured to swing in the direction of movement of the capillary due to the operation of the element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63160851A JPH0212851A (en) | 1988-06-30 | 1988-06-30 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63160851A JPH0212851A (en) | 1988-06-30 | 1988-06-30 | Wire bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212851A true JPH0212851A (en) | 1990-01-17 |
Family
ID=15723771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63160851A Pending JPH0212851A (en) | 1988-06-30 | 1988-06-30 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212851A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132037U (en) * | 1990-03-01 | 1990-11-02 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61101042A (en) * | 1984-10-24 | 1986-05-19 | Hitachi Ltd | Bonding device |
-
1988
- 1988-06-30 JP JP63160851A patent/JPH0212851A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61101042A (en) * | 1984-10-24 | 1986-05-19 | Hitachi Ltd | Bonding device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132037U (en) * | 1990-03-01 | 1990-11-02 | ||
| JPH0330354Y2 (en) * | 1990-03-01 | 1991-06-27 |
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