JPH02127054U - - Google Patents

Info

Publication number
JPH02127054U
JPH02127054U JP3554189U JP3554189U JPH02127054U JP H02127054 U JPH02127054 U JP H02127054U JP 3554189 U JP3554189 U JP 3554189U JP 3554189 U JP3554189 U JP 3554189U JP H02127054 U JPH02127054 U JP H02127054U
Authority
JP
Japan
Prior art keywords
heating element
metal core
contact
insulating layer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3554189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3554189U priority Critical patent/JPH02127054U/ja
Publication of JPH02127054U publication Critical patent/JPH02127054U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
JP3554189U 1989-03-30 1989-03-30 Pending JPH02127054U (US20080094685A1-20080424-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3554189U JPH02127054U (US20080094685A1-20080424-C00004.png) 1989-03-30 1989-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3554189U JPH02127054U (US20080094685A1-20080424-C00004.png) 1989-03-30 1989-03-30

Publications (1)

Publication Number Publication Date
JPH02127054U true JPH02127054U (US20080094685A1-20080424-C00004.png) 1990-10-19

Family

ID=31540990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3554189U Pending JPH02127054U (US20080094685A1-20080424-C00004.png) 1989-03-30 1989-03-30

Country Status (1)

Country Link
JP (1) JPH02127054U (US20080094685A1-20080424-C00004.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (ja) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd プリント回路基板の放熱構造とその製造方法
JP2011146665A (ja) * 2010-01-12 2011-07-28 Samsung Electro-Mechanics Co Ltd ハイブリッド型放熱基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (ja) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd プリント回路基板の放熱構造とその製造方法
JP2011146665A (ja) * 2010-01-12 2011-07-28 Samsung Electro-Mechanics Co Ltd ハイブリッド型放熱基板およびその製造方法

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