JPH02125372U - - Google Patents
Info
- Publication number
- JPH02125372U JPH02125372U JP3324889U JP3324889U JPH02125372U JP H02125372 U JPH02125372 U JP H02125372U JP 3324889 U JP3324889 U JP 3324889U JP 3324889 U JP3324889 U JP 3324889U JP H02125372 U JPH02125372 U JP H02125372U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- nozzle
- pipe
- copper foil
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 3
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3324889U JPH02125372U (cs) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3324889U JPH02125372U (cs) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125372U true JPH02125372U (cs) | 1990-10-16 |
Family
ID=31536761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3324889U Pending JPH02125372U (cs) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125372U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141313A (ja) * | 2007-12-10 | 2009-06-25 | Samsung Electro Mech Co Ltd | エッチング装置 |
-
1989
- 1989-03-27 JP JP3324889U patent/JPH02125372U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141313A (ja) * | 2007-12-10 | 2009-06-25 | Samsung Electro Mech Co Ltd | エッチング装置 |