JPH02125353U - - Google Patents

Info

Publication number
JPH02125353U
JPH02125353U JP3303089U JP3303089U JPH02125353U JP H02125353 U JPH02125353 U JP H02125353U JP 3303089 U JP3303089 U JP 3303089U JP 3303089 U JP3303089 U JP 3303089U JP H02125353 U JPH02125353 U JP H02125353U
Authority
JP
Japan
Prior art keywords
pins
lsi package
utility
large number
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3303089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3303089U priority Critical patent/JPH02125353U/ja
Publication of JPH02125353U publication Critical patent/JPH02125353U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,b,cは本考案の一実施例を示す側
面図、第2図aは第2図bのC−C線断面図、第
3図aは第3図bのD−D線断面図、第2図b、
第3図bは軸直角移動コネクタの側断面図である
。 1……プリント基板、9……LSIパツケージ
、11……接続ピン、12……ベースインシユレ
ータ、13……カバーインシユレータ、15……
ソケツトコンタクト、16……プリロードピン、
20……LSIパツケージ、21……接続ピン、
22……エアガン、23……熱風。
Figures 1a, b, and c are side views showing one embodiment of the present invention, Figure 2a is a sectional view taken along line CC in Figure 2b, and Figure 3a is DD in Figure 3b. Line sectional view, Figure 2b,
FIG. 3b is a side sectional view of the transversely movable connector. 1... Printed circuit board, 9... LSI package, 11... Connection pin, 12... Base insulator, 13... Cover insulator, 15...
Socket contact, 16... preload pin,
20...LSI package, 21...Connection pin,
22...Air gun, 23...Hot air.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の接続ピンを有するLSIパツケージにお
いて、前記ピンを形状記憶合金から構成したこと
を特徴とするLSIパツケージ。
An LSI package having a large number of connection pins, characterized in that the pins are made of a shape memory alloy.
JP3303089U 1989-03-23 1989-03-23 Pending JPH02125353U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3303089U JPH02125353U (en) 1989-03-23 1989-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3303089U JPH02125353U (en) 1989-03-23 1989-03-23

Publications (1)

Publication Number Publication Date
JPH02125353U true JPH02125353U (en) 1990-10-16

Family

ID=31536371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3303089U Pending JPH02125353U (en) 1989-03-23 1989-03-23

Country Status (1)

Country Link
JP (1) JPH02125353U (en)

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