JPH02125344U - - Google Patents
Info
- Publication number
- JPH02125344U JPH02125344U JP1989034497U JP3449789U JPH02125344U JP H02125344 U JPH02125344 U JP H02125344U JP 1989034497 U JP1989034497 U JP 1989034497U JP 3449789 U JP3449789 U JP 3449789U JP H02125344 U JPH02125344 U JP H02125344U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- base
- view
- chip
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005394 sealing glass Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989034497U JPH02125344U (US06373033-20020416-M00071.png) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989034497U JPH02125344U (US06373033-20020416-M00071.png) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125344U true JPH02125344U (US06373033-20020416-M00071.png) | 1990-10-16 |
Family
ID=31539015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989034497U Pending JPH02125344U (US06373033-20020416-M00071.png) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125344U (US06373033-20020416-M00071.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07115145A (ja) * | 1993-10-15 | 1995-05-02 | Nec Corp | 半導体パッケージ |
-
1989
- 1989-03-27 JP JP1989034497U patent/JPH02125344U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07115145A (ja) * | 1993-10-15 | 1995-05-02 | Nec Corp | 半導体パッケージ |
