JPH02122761U

JPH02122761U -

Info

Publication number: JPH02122761U
Application number: JP3196289U
Authority: JP
Priority date: 1989-03-20
Filing date: 1989-03-20
Publication date: 1990-10-09

Description

[Brief explanation of drawings]

第１図はこの考案に係る研磨量自動制御装置の
一実施例を示す斜視図、第２図は研磨量自動制御
装置の断面図、第３図は研磨量自動制御装置の電
気回路図、第４図は研磨量自動制御装置を動作さ
せるためのフローチヤート図、第５図はマイクロ
メータから出てくる電気信号の変化を示す図、第
６図は研磨時間と研磨量の実測値の逐次変化と予
定研磨終了時間の計算結果を示す図、第７図は薄
膜磁気ヘツドの断面図、第８図は薄膜磁気ヘツド
と基板上の導電モニターとの位置関係を示す図、
第９図は櫛歯状デプスモニターと導電モニターに
よるデプス位置検出の方法を示す図、第１０図は
金属膜抵抗体と抵抗計モニターによるデプス位置
検出の方法を示す図である。２０……研磨盤、２１……ガイドリング、２３
……基準面、２４……研磨物、２６……やとい、
２７……基準面、２８，２９……マイクロメータ
、３０，３１……ローラ、５０……ＣＰＵ。 FIG. 1 is a perspective view showing an embodiment of the automatic polishing amount control device according to this invention, FIG. 2 is a sectional view of the automatic polishing amount control device, FIG. 3 is an electric circuit diagram of the automatic polishing amount control device, and FIG. Figure 4 is a flowchart for operating the automatic polishing amount control device, Figure 5 is a diagram showing changes in the electrical signal output from the micrometer, and Figure 6 is the sequential change in polishing time and actual measured value of polishing amount. 7 is a cross-sectional view of the thin film magnetic head, and FIG. 8 is a diagram showing the positional relationship between the thin film magnetic head and the conductive monitor on the substrate.
FIG. 9 is a diagram showing a method of depth position detection using a comb-like depth monitor and a conductivity monitor, and FIG. 10 is a diagram showing a method of depth position detection using a metal film resistor and a resistance meter monitor. 20... Polishing disk, 21... Guide ring, 23
... Reference surface, 24 ... Polished object, 26 ... Yatoi,
27... Reference plane, 28, 29... Micrometer, 30, 31... Roller, 50... CPU.

Claims

[Scope of utility model registration request]

a polishing disk; a guide ring having a reference surface and rotatably disposed with the surface opposite to the reference surface in close contact with the polishing surface of the polishing disk; The polishing material is fixed to the surface opposite to the guide ring and is slidably fitted into the center hole of the guide ring, thereby bringing the polishing material into close contact with the polishing disc. two detection means each in contact with the reference surface of the Yatoi to detect the height of both; and a control that measures the amount of polishing of the polishing object based on signals from these detection means and controls the polishing disk. An automatic polishing amount control device comprising: