JPH02122660A - Plastic package - Google Patents
Plastic packageInfo
- Publication number
- JPH02122660A JPH02122660A JP27782488A JP27782488A JPH02122660A JP H02122660 A JPH02122660 A JP H02122660A JP 27782488 A JP27782488 A JP 27782488A JP 27782488 A JP27782488 A JP 27782488A JP H02122660 A JPH02122660 A JP H02122660A
- Authority
- JP
- Japan
- Prior art keywords
- tie
- lead
- bar
- resin
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004033 plastic Substances 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 239000004642 Polyimide Substances 0.000 abstract description 6
- 229920001721 polyimide Polymers 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 239000002313 adhesive film Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はリードフレームを使用したプラスチックパッケ
ージに関し、特に多ビンのプラスチックパッケージ、又
半田デイツプやりフローを行う事によりプリント基板に
取り付けるプラスチックパッケージに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a plastic package using a lead frame, and more particularly to a multi-bin plastic package and a plastic package attached to a printed circuit board by performing a solder dip flow.
従来、この種のプラスチックパッケージに使用するリー
ドフレームは第3図(a)に示す様な構造であり、チッ
プを搭載しポンデイングル樹脂封止(通常樹脂はエポキ
シ樹脂を使用)後のリード切断分離においてタイバー1
′を切断する。タイバー切断後を第3図(b)に示す。Conventionally, the lead frame used for this type of plastic package has a structure as shown in Figure 3 (a), in which a chip is mounted and the leads are cut and separated after being sealed with resin (usually epoxy resin is used). Tie bar 1 at
′ is cut. Figure 3(b) shows the tie bar after it has been cut.
上述した従来のプラスチックパッケージに使用している
樹脂はエポキシ樹脂を使用している為、プリント基板へ
の取り付は時半田デイツプやりフロー条件下にさらすと
エポキシ封止樹脂は熱変形を起こしリードフレームとの
密着性が悪化しパッケージにおいてリードの付は根より
湿気が浸入し耐湿性の著しい劣化を招く。The resin used in the conventional plastic package mentioned above is epoxy resin, so when it is attached to a printed circuit board, the epoxy sealing resin will thermally deform when exposed to flow conditions and the lead frame will be damaged. This deteriorates the adhesion between the leads and the roots of the package, leading to moisture infiltration from the roots, resulting in a significant deterioration of moisture resistance.
又組立時において、タイバー切断を行うが第3図(b)
、 (d)に示す様にタイバー切断時の余裕を誤差に
より各リードに出っ張りが出来る為、半田デイツプ及び
リフロー時に各リードが半田ブリッジするという問題も
ある。Also, during assembly, the tie bars are cut as shown in Figure 3(b).
As shown in (d), each lead has a protrusion due to an error in the margin when cutting the tie bar, which causes a problem of solder bridging of each lead during solder dipping and reflow.
本発明のプラスチックパッケージは、リードフレームの
タイバーをモールド封止用樹脂と相違した樹脂、で構成
し、タイバーはモールド封止時パッケージ内に収納する
ことを有している。In the plastic package of the present invention, the tie bars of the lead frame are made of a resin different from the resin for mold sealing, and the tie bars are housed within the package during mold sealing.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は(a)は本発明で使用するリードフレームの一
実施例の図であり、(b)はタイバ一部の拡大断面図で
あり、(c)図は組立後のパッケージの断面図である。In FIG. 1, (a) is a diagram of one embodiment of the lead frame used in the present invention, (b) is an enlarged cross-sectional view of a part of the tie bar, and (c) is a cross-sectional view of the package after assembly. It is.
第1図(a)においてタイバー1は融点が高い樹脂を各
リードに密着させタイバーとして構成した物であり、(
本実施例では高耐熱ポリイミド接着フィルムを使用して
いる。)ダイパーが無いリードフレームに(b)図に示
す様、リード上下・左右を覆う様に接着する。この時高
耐熱ポリイミド接着フィルムを接着する場所は(c)図
に示す様に樹脂封止のぎりぎりの部分に接着する。In FIG. 1(a), the tie bar 1 is configured as a tie bar by closely adhering resin with a high melting point to each lead.
In this example, a highly heat-resistant polyimide adhesive film is used. ) Glue to the lead frame without a dipper so as to cover the top, bottom, left and right sides of the lead as shown in figure (b). At this time, the highly heat-resistant polyimide adhesive film is attached to the edge of the resin seal, as shown in Figure (c).
次にポンデイングルモールド封入(エポキシ樹脂)〜リ
ード成形を行うことによりパッケージが構成される。Next, a package is constructed by performing ponder mold encapsulation (epoxy resin) and lead molding.
以上の事により次の2ツの特徴が得られる。As a result of the above, the following two features can be obtained.
1、半田デイツプ及びリフロー条件下にされされた時エ
ポキシ樹脂は熱変形を起こしやすくリードフレームとの
密着性が悪化しリードの付根より湿気が浸入し耐湿性が
悪化する。しかし高耐熱ポリイミド接着フィルムが樹脂
封止ぎりぎりの所のリードに密着していることにより密
着性が悪化しない為耐湿性が良好である。1. When subjected to solder dip and reflow conditions, the epoxy resin tends to undergo thermal deformation, resulting in poor adhesion to the lead frame and moisture infiltration from the base of the lead, resulting in poor moisture resistance. However, since the highly heat-resistant polyimide adhesive film is in close contact with the leads at the edge of resin sealing, the adhesion is not deteriorated and the moisture resistance is good.
2、 プラスチックパッケージ組立時において通常の方
法では第3図(a)のリードフレームを見ても分かる様
にタイバー1′を切断し各リードを独立させるが、タイ
バー切断時の余裕を誤差により第3図(b)に示す様各
リードにダイパー切断跡7が出来る。この出張りにより
半田デイツプ及びリフロー時に半田ブリッジが発生する
事が多いが本発明ではタイバーはモールドパッケージ内
に収納される為外部にタイバーは出ないので半田ブリッ
ジを防止出来る。2. When assembling a plastic package, the usual method is to cut the tie bar 1' to make each lead independent, as can be seen from the lead frame in Figure 3 (a). As shown in Figure (b), a dieper cut mark 7 is formed on each lead. This protrusion often causes solder dips and solder bridges during reflow, but in the present invention, the tie bars are housed within the mold package, so the tie bars do not protrude to the outside, so solder bridges can be prevented.
第2図は本発明の実施例2の図であり(a)はタイバ一
部の拡大断面図であり、(b)はリードフレームの一部
の図である。FIG. 2 is a diagram of a second embodiment of the present invention, in which (a) is an enlarged sectional view of a part of the tie bar, and (b) is a diagram of a part of the lead frame.
本実施例では実施例1にて使用した高耐熱ポリイミド密
着フィルムを使用するがリードとフィルムに穴9を明は
封止樹脂の密着性をより高める事により耐湿性を向上さ
せる利点がある。In this example, the highly heat-resistant polyimide adhesive film used in Example 1 is used, but forming holes 9 between the leads and the film has the advantage of improving moisture resistance by further increasing the adhesion of the sealing resin.
以上説明したように本発明はリードフレームのタイバー
をモールド封止樹脂と相違した樹脂で構成し、タイバー
はモールド封止時、パッケージ内に収納されることによ
りタイバーを切断する必要が無い為タイバー切断工程の
削減と半田ブリッジの防止及び耐湿性の向上という効果
がある。As explained above, in the present invention, the tie bars of the lead frame are made of a resin different from the mold sealing resin, and the tie bars are stored in the package during mold sealing, so there is no need to cut the tie bars, so the tie bars can be cut. This has the effect of reducing the number of steps, preventing solder bridges, and improving moisture resistance.
第1図は本発明の一実施例の図であり、第1図(a)は
リードフレーム、第1図(b)はリード部分の拡大図、
第1図(c)はパッケージに収納された図、第2図は本
発明の実施例2の図であり、第2図(a)はリード部分
の拡大図、第2図(b)はリードフレームの一部分の図
、第3図は従来のプラスチックパッケージの図であり、
第3図(a)リードフレーム、第3図(b)はタイバー
切断後の図、第3図(c)はパッケージに収納された図
、第3図(d)はパッケージを上から見た図である。
1・・・・・・本発明のタイバー 1′・・・・・・従
来のタイバー 2・・・・・・リード、3・・・・・・
アイランド、4・・・・・・チップ、5・・・・・・ポ
ンディングワイヤー 6・・・・・・封止樹脂、7・・
・・・・タイバー切断跡、8・・・・・・パッケージ、
9・・・・・・穴。
代理人 弁理士 内 原 晋
第2図
第3
図FIG. 1 is a diagram of an embodiment of the present invention, in which FIG. 1(a) is a lead frame, FIG. 1(b) is an enlarged view of a lead part,
FIG. 1(c) is a diagram of the package housed in the package, FIG. 2 is a diagram of Embodiment 2 of the present invention, FIG. 2(a) is an enlarged view of the lead part, and FIG. 2(b) is a diagram of the lead part. Figure 3, a diagram of a portion of the frame, is a diagram of a conventional plastic package.
Figure 3(a) is the lead frame, Figure 3(b) is the view after the tie bar is cut, Figure 3(c) is the view housed in the package, and Figure 3(d) is the view of the package from above. It is. 1... Tie bar of the present invention 1'... Conventional tie bar 2... Lead, 3...
Island, 4... Chip, 5... Bonding wire 6... Sealing resin, 7...
... Tie bar cut marks, 8... Package,
9...hole. Agent: Susumu Uchihara, patent attorney Figure 2 Figure 3
Claims (1)
おいて、前記リードフレームのタイバーを、モールド封
止用樹脂と相違した樹脂、で構成し、前記タイバーはモ
ールド封止時パッケージ内に収納されることを特徴とす
るプラスチックパッケージ。A plastic package using a lead frame, characterized in that the tie bars of the lead frame are made of a resin different from a resin for mold sealing, and the tie bars are housed within the package during mold sealing. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27782488A JPH02122660A (en) | 1988-11-01 | 1988-11-01 | Plastic package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27782488A JPH02122660A (en) | 1988-11-01 | 1988-11-01 | Plastic package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02122660A true JPH02122660A (en) | 1990-05-10 |
Family
ID=17588774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27782488A Pending JPH02122660A (en) | 1988-11-01 | 1988-11-01 | Plastic package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02122660A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0683518A2 (en) | 1994-05-16 | 1995-11-22 | Hitachi, Ltd. | Lead frame and semiconductor device |
US5587606A (en) * | 1993-03-19 | 1996-12-24 | Fujitsu Miyagi Electronics Ltd. | Lead frame having deflectable and thereby precisely removed tie bars |
US5834831A (en) * | 1994-08-16 | 1998-11-10 | Fujitsu Limited | Semiconductor device with improved heat dissipation efficiency |
US5929513A (en) * | 1994-08-16 | 1999-07-27 | Fujitsu Limited | Semiconductor device and heat sink used therein |
EP1261031A2 (en) * | 2001-05-18 | 2002-11-27 | Lintec Corporation | Tape for forming resin tie bar on a lead frame |
-
1988
- 1988-11-01 JP JP27782488A patent/JPH02122660A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5587606A (en) * | 1993-03-19 | 1996-12-24 | Fujitsu Miyagi Electronics Ltd. | Lead frame having deflectable and thereby precisely removed tie bars |
EP0683518A2 (en) | 1994-05-16 | 1995-11-22 | Hitachi, Ltd. | Lead frame and semiconductor device |
US5637914A (en) * | 1994-05-16 | 1997-06-10 | Hitachi, Ltd. | Lead frame and semiconductor device encapsulated by resin |
EP0683518A3 (en) * | 1994-05-16 | 1998-09-09 | Hitachi, Ltd. | Lead frame and semiconductor device |
US5837567A (en) * | 1994-05-16 | 1998-11-17 | Hitachi, Ltd. | Lead frame and semiconductor device |
US5834831A (en) * | 1994-08-16 | 1998-11-10 | Fujitsu Limited | Semiconductor device with improved heat dissipation efficiency |
US5929513A (en) * | 1994-08-16 | 1999-07-27 | Fujitsu Limited | Semiconductor device and heat sink used therein |
EP1261031A2 (en) * | 2001-05-18 | 2002-11-27 | Lintec Corporation | Tape for forming resin tie bar on a lead frame |
EP1261031A3 (en) * | 2001-05-18 | 2004-06-02 | Lintec Corporation | Tape for forming resin tie bar on a lead frame |
US6855418B2 (en) | 2001-05-18 | 2005-02-15 | Lintec Corporation | Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same |
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