JPH02122477U - - Google Patents

Info

Publication number
JPH02122477U
JPH02122477U JP3110189U JP3110189U JPH02122477U JP H02122477 U JPH02122477 U JP H02122477U JP 3110189 U JP3110189 U JP 3110189U JP 3110189 U JP3110189 U JP 3110189U JP H02122477 U JPH02122477 U JP H02122477U
Authority
JP
Japan
Prior art keywords
pad
substrate
insulating layer
bonded
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3110189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3110189U priority Critical patent/JPH02122477U/ja
Publication of JPH02122477U publication Critical patent/JPH02122477U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP3110189U 1989-03-17 1989-03-17 Pending JPH02122477U (US07993877-20110809-P00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3110189U JPH02122477U (US07993877-20110809-P00003.png) 1989-03-17 1989-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3110189U JPH02122477U (US07993877-20110809-P00003.png) 1989-03-17 1989-03-17

Publications (1)

Publication Number Publication Date
JPH02122477U true JPH02122477U (US07993877-20110809-P00003.png) 1990-10-08

Family

ID=31256714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3110189U Pending JPH02122477U (US07993877-20110809-P00003.png) 1989-03-17 1989-03-17

Country Status (1)

Country Link
JP (1) JPH02122477U (US07993877-20110809-P00003.png)

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