JPH02122068U - - Google Patents
Info
- Publication number
- JPH02122068U JPH02122068U JP3238189U JP3238189U JPH02122068U JP H02122068 U JPH02122068 U JP H02122068U JP 3238189 U JP3238189 U JP 3238189U JP 3238189 U JP3238189 U JP 3238189U JP H02122068 U JPH02122068 U JP H02122068U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- setting table
- wafer setting
- processing liquid
- serves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3238189U JPH02122068U (sk) | 1989-03-22 | 1989-03-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3238189U JPH02122068U (sk) | 1989-03-22 | 1989-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02122068U true JPH02122068U (sk) | 1990-10-04 |
Family
ID=31258837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3238189U Pending JPH02122068U (sk) | 1989-03-22 | 1989-03-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02122068U (sk) |
-
1989
- 1989-03-22 JP JP3238189U patent/JPH02122068U/ja active Pending