JPH02120867U - - Google Patents
Info
- Publication number
- JPH02120867U JPH02120867U JP2896589U JP2896589U JPH02120867U JP H02120867 U JPH02120867 U JP H02120867U JP 2896589 U JP2896589 U JP 2896589U JP 2896589 U JP2896589 U JP 2896589U JP H02120867 U JPH02120867 U JP H02120867U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- prevention structure
- solder film
- solder
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2896589U JPH02120867U (xx) | 1989-03-14 | 1989-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2896589U JPH02120867U (xx) | 1989-03-14 | 1989-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120867U true JPH02120867U (xx) | 1990-09-28 |
Family
ID=31252759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2896589U Pending JPH02120867U (xx) | 1989-03-14 | 1989-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120867U (xx) |
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1989
- 1989-03-14 JP JP2896589U patent/JPH02120867U/ja active Pending