JPH02120865U - - Google Patents

Info

Publication number

JPH02120865U

JPH02120865U JP2919489U JP2919489U JPH02120865U JP H02120865 U JPH02120865 U JP H02120865U JP 2919489 U JP2919489 U JP 2919489U JP 2919489 U JP2919489 U JP 2919489U JP H02120865 U JPH02120865 U JP H02120865U

Authority

JP

Japan

Prior art keywords

chip component

resin layer

polymer resin

circuit board

pad

Prior art date

1989-03-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000002952 polymeric resin Substances 0.000 claims description 3
• 229920003002 synthetic resin Polymers 0.000 claims description 3
• 239000000919 ceramic Substances 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 238000005476 soldering Methods 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 1