JPH02120759U - - Google Patents
Info
- Publication number
- JPH02120759U JPH02120759U JP2915989U JP2915989U JPH02120759U JP H02120759 U JPH02120759 U JP H02120759U JP 2915989 U JP2915989 U JP 2915989U JP 2915989 U JP2915989 U JP 2915989U JP H02120759 U JPH02120759 U JP H02120759U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- molding material
- terminal device
- crimping
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 3
- 239000012778 molding material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2915989U JPH02120759U (zh) | 1989-03-16 | 1989-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2915989U JPH02120759U (zh) | 1989-03-16 | 1989-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120759U true JPH02120759U (zh) | 1990-09-28 |
Family
ID=31253124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2915989U Pending JPH02120759U (zh) | 1989-03-16 | 1989-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120759U (zh) |
-
1989
- 1989-03-16 JP JP2915989U patent/JPH02120759U/ja active Pending